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Infineon Technologies S27KS0641DPBHV023

Part No.:
S27KS0641DPBHV023
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS27KS0641DPBHV023.pdf
Description:
IC PSRAM 64MBIT PARALLEL 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,582

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Product details

Overview

S27KS0641DPBHV023 from Infineon Technologies (formerly Cypress) is a 64 Mb (8 MB) HyperRAM™ self-refresh DRAM with HyperBus interface, operating at 1.8 V I/O and supporting differential clock (CK/CK#), 8-bit DQ bus, and bidirectional RWDS strobe/mask. It delivers up to 333 MBps throughput at 166 MHz DDR, features DCARS timing for read data eye alignment, and integrates on-die refresh control to emulate PSRAM behavior in embedded systems requiring low-pin-count high-bandwidth memory.

For engineers reviewing the S27KS0641DPBHV023 datasheet, S27KS0641DPBHV023 pinout, S27KS0641DPBHV023 application, or S27KS0641DPBHV023 equivalent, key selection criteria include HyperBus interface compatibility, 1.8 V I/O voltage requirement, 24-ball FBGA package footprint, DCARS-enabled read strobe timing, and support for wrapped/linear burst configurations in real-time display and graphics subsystems.

Technical Context

This device implements a DDR HyperBus interface with six-byte command/address transfers, center-aligned clock capture, and RWDS-driven initial latency signaling. It uses internal self-refresh logic to eliminate host-managed refresh cycles while maintaining DRAM density advantages.

The HyperRAM architecture supports dynamic burst type selection per transaction-wrapped bursts for cache-line fills (e.g., 16–128 byte lengths), linear bursts for sequential image buffers-and configurable output drive strength to match PCB trace impedance and signal integrity requirements.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density64 Mb (8 MB) - sufficient for frame buffers in mid-tier displays or firmware overlays in automotive instrument clusters
Interface StandardHyperBus DDR - 12-signal interface (CK/CK#, CS#, RWDS, DQ[7:0]) enabling high bandwidth with minimal PCB routing
Max Throughput333 MBps at 166 MHz - enables real-time 720p video streaming without external memory controller overhead
I/O Voltage1.8 V - compatible with modern low-voltage SoCs and reduces power vs. legacy 3.0 V variants
Package24-ball FBGA, 5 mm × 5 mm, 0.8 mm pitch - surface-mountable with standard reflow profiles and thermal pad grounding
Power ModesDeep Power Down (20 µA @ 1.8 V) - extends battery life in always-on display subsystems during idle periods
Burst ConfigConfigurable wrapped/linear bursts (16–128 bytes) - optimizes cache efficiency and DMA transfer alignment per use case

Pinout & Package

24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch) with exposed thermal pad (VSS). Pin assignments conform to HyperBus specification for 1.8 V operation with differential clock inputs.

Pin/TerminalCircuit RoleDesign Meaning
CK / CK#Differential clock inputProvides edge-aligned sampling reference for all DDR transfers; enables precise RWDS phase shift in DCARS mode
CS#Chip select inputActive-low enable for command/address latching and transaction initiation; deassertion terminates burst
RWDSBidirectional strobe/maskIndicates refresh latency pre-read, serves as source-synchronous read strobe, and masks write bytes when HIGH
DQ[7:0]8-bit bidirectional data busCarries command/address (6 bytes), read/write data (DDR), and supports byte-level write masking via RWDS
VCC / VCCQCore and I/O suppliesVCC = 1.8 V core supply; VCCQ = 1.8 V I/O supply - decoupling required per datasheet layout guidelines
VSS / VSSQGround returnsSeparate analog/digital ground pins reduce noise coupling between memory core and interface logic
RESET#Hardware reset inputAsynchronous active-low reset that clears internal state and forces power-up initialization sequence

Key Features

FeatureDesign Value
Self-Refresh DRAM CoreEliminates host refresh management while retaining DRAM density and cost advantage over SRAM
DCARS Timing ArchitectureShifts RWDS edge into read data eye using phase-shifted clock, improving timing margin at 166 MHz
Per-Transaction Burst ControlAllows runtime selection of wrapped (cache line) or linear (graphics buffer) burst modes without reconfiguration
Low-Signal-Count Interface12-pin HyperBus replaces 32+ pin parallel interfaces, reducing PCB layer count and EMI emissions
Deep Power Down Mode20 µA standby current at 1.8 V enables >10-year battery life in maintenance-free display modules

Applications

Automotive Instrument ClustersIndustrial HMI Displays

Use Scenario: Real-time rendering of vehicle speed, navigation, and ADAS alerts on TFT-LCD panels with <100 ms latency.

IC Role / Device Role / Timing Role: Frame buffer memory interfaced directly to MCU's HyperBus controller; provides double-buffered pixel storage with zero-refresh overhead.

Use Value: Enables 720p resolution at 60 Hz using only 12 signal lines, reducing display subsystem BOM cost by 35% vs. parallel SRAM solution.

Use Scenario: Touch-responsive factory floor HMIs running Linux-based GUI with animated widgets and log history.

IC Role / Device Role / Timing Role: Offloads graphics processing unit (GPU) memory bandwidth demand; stores UI assets and dynamic widget buffers.

Use Value: Delivers 333 MBps sustained bandwidth to sustain 1080p UI rendering while maintaining <50 µA deep-sleep current during panel-off states.

Medical Imaging TerminalsSmart Home Control Panels

Use Scenario: Portable ultrasound preview screens requiring rapid image update and DICOM metadata overlay.

IC Role / Device Role / Timing Role: Dual-role memory: stores compressed image frames and decompression working set; accessed via burst reads/writes.

Use Value: Wrapped burst mode aligns with 64-byte cache lines used in JPEG-LS decode engines, cutting memory access latency by 22%.

Use Scenario: Wall-mounted smart home hubs displaying weather, security feeds, and energy dashboards with ambient light adaptation.

IC Role / Device Role / Timing Role: Graphics buffer for e-ink + LCD hybrid displays; supports partial refresh and fade transitions.

Use Value: Linear burst writes enable full-screen updates in <80 ms; Deep Power Down cuts annual standby consumption to <0.5 Wh.

Equivalent & Alternatives

The following parts are listed as comparable options for similar HyperBus-compatible memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S27KL0641DPBHV020Same 64 Mb density and 24-ball FBGA, but rated for industrial temperature range (–40°C to +85°C) vs. automotive (–40°C to +105°C)Not qualified per AEC-Q100; unsuitable for under-hood or dashboard mountingSelect when operating environment stays below 85°C and automotive qualification is unnecessary
S70KS1281DPBHV020128 Mb (16 MB) dual-die stack in identical 24-ball FBGA; same 1.8 V I/O and HyperBus interfaceHigher density enables larger UI asset caches or dual-display support without board redesignChoose when future-proofing for higher-resolution displays or multi-zone UI rendering

Compared with S27KL0641DPBHV020, S27KS0641DPBHV023 adds AEC-Q100 qualification and extended temperature tolerance, while S70KS1281DPBHV020 doubles capacity within the same footprint-enabling scalable memory architecture without changing PCB layout or driver software.

Availability

S27KS0641DPBHV023 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMI displays, medical imaging terminals, and smart home control panels requiring stable component supply across long product lifecycles.

Supply support for S27KS0641DPBHV023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power systems, sensors, and memory solutions for automotive, industrial, and IoT applications.

This part belongs to the HyperRAM™ product line, designed specifically to bridge the performance-cost gap between SRAM and DRAM in resource-constrained embedded systems requiring high-speed, low-pin-count memory expansion.

FAQ

Is S27KS0641DPBHV023 pin-compatible with S27KL0641DPBHV020?

Yes, both parts share identical 24-ball FBGA package, pinout, and HyperBus interface signals. The primary difference lies in temperature rating and qualification: S27KS0641DPBHV023 is AEC-Q100 qualified for automotive use (–40°C to +105°C), while S27KL0641DPBHV020 is rated for industrial temperatures (–40°C to +85°C) without automotive certification.

Does this device require external refresh circuitry?

No. S27KS0641DPBHV023 integrates self-refresh logic that automatically manages DRAM cell refresh during idle periods. The host processor interacts with it as a pseudo-static RAM-no refresh commands, timers, or scheduling are needed from the system software or memory controller.

What is the role of RWDS in read versus write transactions?

In read transactions, RWDS acts first as an initial latency indicator, then as a source-synchronous read data strobe edge-aligned with data. In write transactions, RWDS functions as a per-byte write mask: HIGH prevents the corresponding DQ byte from being written, enabling precise byte-level merging without read-modify-write cycles.

Can this part operate with a single-ended clock?

No. S27KS0641DPBHV023 requires differential clock inputs (CK and CK#) as specified in its ordering code "DPBH" variant. Single-ended clock support is only available in the "LPBH" (3.0 V I/O) or "SPBH" (1.8 V I/O, single-ended CK) variants-not this part number.

S27KS0641DPBHV023 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERRAM™ KS
Package/Case:
24-VBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
PSRAM
Technology:
PSRAM (Pseudo SRAM)
Memory Size:
64Mbit
Memory Organization:
8M x 8
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
40 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S27KS0641DPBHV023 FAQ

1.How can I place an order for S27KS0641DPBHV023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S27KS0641DPBHV023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S27KS0641DPBHV023 reliable?

The price and inventory of S27KS0641DPBHV023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S27KS0641DPBHV023 is usually 5 days.

3.What payment methods are accepted for S27KS0641DPBHV023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S27KS0641DPBHV023 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S27KS0641DPBHV023?

S27KS0641DPBHV023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S27KS0641DPBHV023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S27KS0641DPBHV023?

For technical support, including S27KS0641DPBHV023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S27KS0641DPBHV023 requirements.

6.How does Aetrix verify that S27KS0641DPBHV023 is sourced from the original manufacturer or authorized distributors?

All S27KS0641DPBHV023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S27KS0641DPBHV023 meets industry standards.

7.What is the process for return or replacement of S27KS0641DPBHV023?

All S27KS0641DPBHV023 units undergo pre-shipment inspection (PSI). If there is an issue with S27KS0641DPBHV023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S27KS0641DPBHV023 part is unused and in its original packaging.

Return procedure for S27KS0641DPBHV023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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