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Infineon Technologies S27KS0642GABHB020

Part No.:
S27KS0642GABHB020
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS27KS0642GABHB020.pdf
Description:
IC PSRAM 64MBIT HYPERBUS 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,147

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Product details

Overview

S27KS0642GABHB020 from Infineon Technologies is a 64Mb self-refresh DRAM (PSRAM) with HYPERBUS™ interface, operating at 1.8 V or 3.0 V VCC/VCCQ, supporting DDR transfers up to 200 MHz clock rate and 400 MBps throughput. It features bidirectional RWDS strobe, configurable burst lengths (16–128 bytes), partial/full array refresh, and industrial temperature range (–40°C to +85°C) in 24-ball FBGA package. Used as high-bandwidth external memory for microcontrollers in automotive instrument clusters.

For engineers reviewing the S27KS0642GABHB020 datasheet, S27KS0642GABHB020 pinout, S27KS0642GABHB020 application, or S27KS0642GABHB020 equivalent, key selection criteria include HYPERBUS™ timing compliance, RWDS phase alignment support, DCARS capability, burst configuration flexibility, and AEC-Q100 Grade 3 qualification for automotive use.

Technical Context

This PSRAM integrates dynamic DRAM cells with on-die refresh control logic, eliminating host-managed refresh while maintaining static RAM-like interface behavior. Its HYPERBUS™ interface uses only 11–12 signals (including optional CK#), with command/address/data multiplexed over DQ[7:0] and RWDS serving dual roles: read-data strobe and write-data mask.

The device supports linear and wrapped burst modes, hybrid sleep and deep power-down states, and configurable output drive strength. DCARS functionality enables center-aligned RWDS edge placement during reads to maximize data eye margin at 200 MHz DDR operation.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density64 Mbit (8 MB) - sufficient for firmware overlay, graphics frame buffers, or real-time log storage in resource-constrained MCUs.
Interface StandardHYPERRAM™ / HYPERBUS™ - low-pin-count DDR interface with 8-bit DQ bus and bidirectional RWDS, reducing PCB routing complexity vs. parallel NOR/NAND.
Max Clock Rate200 MHz - enables 400 MBps peak bandwidth (DDR), matching high-speed MCU AXI/AHB bus requirements without external FIFO buffering.
Burst Lengths16/32/64/128 bytes - configurable via register writes, allowing optimization for cache line size or DMA transfer granularity.
Operating Voltage1.8 V or 3.0 V VCC/VCCQ - dual-supply support simplifies integration with mixed-voltage SoCs and avoids level-shifting components.
Refresh ManagementSelf-refresh with partial array options (1/8, 1/4, 1/2) - reduces power during idle periods while preserving data integrity without host intervention.
Temp Range–40°C to +85°C (Industrial) - qualified per AEC-Q100 Grade 3, enabling use in automotive body control modules and infotainment head units.

Pinout & Package

Package: 24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
CK / CK#Differential clock inputEnables precise DDR timing capture; CK# required for DCARS mode to generate phase-shifted RWDS edge within read data eye.
CS#Chip select (active-low)Asserted to initiate all transactions; deassertion terminates burst and triggers internal refresh if needed.
RWDSBidirectional read/write strobeOutput during reads (initial latency indicator and data strobe); input during writes (byte mask for DQ[7:0]).
DQ[7:0]8-bit bidirectional data busMultiplexes command, address, and data; supports LV-CMOS 1.8 V/3.0 V I/O levels without external voltage translation.
RESET#Hardware reset inputAsynchronous active-low signal that forces device into known state and clears internal registers, required before initialization sequence.

Key Features

FeatureDesign Value
HYPERBUS™ Interface11–12 signal count (vs. 40+ for parallel NOR) reduces PCB layer count and EMI, enabling compact automotive module designs.
DCARS SupportPhase-shifted RWDS generation improves setup/hold margin by >150 ps at 200 MHz, critical for reliable high-speed read timing in noisy automotive environments.
Configurable Drive StrengthAdjustable output current on DQ/RWDS allows impedance matching to varied trace lengths and terminations without redesigning layout.
Hybrid Sleep ModeCombines clock gating and partial array retention to achieve 330 µA standby current at 105°C, extending battery life in always-on vehicle systems.
AEC-Q100 Grade 3Validated for automotive under-hood and cabin applications with full temperature cycling, ESD, and HTOL stress testing per JEDEC standards.

Applications

Automotive Instrument ClusterIndustrial HMI Display Buffer

Use Scenario: Real-time rendering of digital speedometer, tachometer, and warning icons with animated transitions.

IC Role / Device Role / Timing Role: External frame buffer memory for MCU-driven TFT-LCD controller, accessed via HYPERBUS™ at 160 MHz sustained burst rate.

Use Value: 128-byte wrapped burst mode aligns with typical display line width; DCARS ensures robust read timing across wide temperature range (–40°C to +85°C).

Use Scenario: Storing and updating multi-language UI assets and touch-screen gesture buffers in factory HMIs.

IC Role / Device Role / Timing Role: High-throughput PSRAM for ARM Cortex-M7-based HMI SoC, replacing slower SPI flash + SRAM combo.

Use Value: 400 MBps bandwidth eliminates UI stutter during simultaneous asset loading and animation; hybrid sleep cuts idle power by 70% vs. standard PSRAM.

ADAS Camera Preprocessing BufferSmart Gateway Message Queue

Use Scenario: Temporary storage of raw image frames from 1–2 MP camera sensors before ISP processing or compression.

IC Role / Device Role / Timing Role: Low-latency, burst-capable memory for pipeline buffering between MIPI CSI-2 receiver and image processor.

Use Value: 35 ns tACC and 200 MHz DDR enable sub-5 µs frame fetch latency; self-refresh maintains data during brief processor sleep cycles.

Use Scenario: Queuing CAN FD and Ethernet messages in automotive domain controllers with deterministic latency requirements.

IC Role / Device Role / Timing Role: Shared memory region for inter-core communication between safety and non-safety ASIL-B/B partitions.

Use Value: AEC-Q100 Grade 3 qualification ensures reliability; configurable burst lengths match CAN FD payload sizes (8–64 bytes) for zero-copy message handling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PSRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S27KL0641GABHI020Same die, identical electrical specs, but lacks DCARS support and is rated only for Industrial (–40°C to +85°C), not AEC-Q100.No automotive qualification; unsuitable for safety-critical clusters or ADAS where RWDS timing margin is critical.Select only for cost-sensitive industrial HMIs without DCARS dependency or automotive requirements.
ISSI IS66WV12816EBLL-15BLIParallel async SRAM (128K × 16), 15 ns access, no self-refresh, 32-pin SOJ - higher pin count, no DDR, no burst modes.Lacks HYPERBUS™ compatibility; requires full address/data bus and separate control lines, increasing MCU pin usage and PCB area.Consider only when legacy design mandates parallel interface or when ultra-low latency (<15 ns) is mandatory and bandwidth <100 MBps suffices.

Compared with S27KL0641GABHI020, the S27KS0642GABHB020 adds DCARS and AEC-Q100 Grade 3, making it suitable for automotive timing-critical applications; versus IS66WV12816EBLL-15BLI, it offers 4× bandwidth with half the pins but requires HYPERBUS™-capable host controllers.

Availability

S27KS0642GABHB020 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMI display buffers, ADAS camera preprocessing, and smart gateway message queuing requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S27KS0642GABHB020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.

This part belongs to the HYPERRAM™ product line, designed specifically to deliver high-bandwidth, low-pin-count external memory for automotive and industrial MCUs needing PSRAM performance without DRAM complexity.

FAQ

Does S27KS0642GABHB020 require external refresh circuitry?

No. It contains on-die self-refresh logic that automatically manages DRAM cell refresh during idle periods or hybrid sleep mode. The host processor never initiates or schedules refresh cycles - the device appears as static RAM to software, though internal refresh occurs transparently when CS# is deasserted and no transaction is active.

What is the function of RWDS in write versus read operations?

In read operations, RWDS is driven by the device as an output: first indicating initial access latency, then acting as a read-data strobe aligned with DQ transitions. In write operations, RWDS is driven by the host as an input to mask individual bytes on DQ[7:0], enabling partial-word writes without read-modify-write sequences.

Can S27KS0642GABHB020 operate with single-ended clock only?

Yes. The device supports both single-ended (CK only) and differential (CK/CK#) clock configurations. When using single-ended mode, CK# must be tied to VSS or VCC per datasheet guidelines; DCARS functionality is only available with differential clock enabled, as it relies on the phase relationship between CK and CK#.

How does burst length configuration affect timing behavior?

Burst length is set via Configuration Register 0 and determines the number of consecutive 16-bit transfers per transaction. Longer bursts (e.g., 128 bytes) increase throughput but extend transaction duration, limiting opportunities for internal refresh. Shorter bursts allow more frequent refresh windows and reduce worst-case latency between successive commands, critical for real-time deterministic systems.

S27KS0642GABHB020 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERRAM™ KS
Package/Case:
24-VBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
PSRAM
Technology:
PSRAM (Pseudo SRAM)
Memory Size:
64Mbit
Memory Organization:
8M x 8
Memory Interface:
HyperBus
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
35ns
Access Time:
35 ns
Voltage - Supply:
1.7V ~ 2V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S27KS0642GABHB020 FAQ

1.How can I place an order for S27KS0642GABHB020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S27KS0642GABHB020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S27KS0642GABHB020 reliable?

The price and inventory of S27KS0642GABHB020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S27KS0642GABHB020 is usually 5 days.

3.What payment methods are accepted for S27KS0642GABHB020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S27KS0642GABHB020 transactions.

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4.How is shipping managed for S27KS0642GABHB020?

S27KS0642GABHB020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S27KS0642GABHB020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S27KS0642GABHB020?

For technical support, including S27KS0642GABHB020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S27KS0642GABHB020 requirements.

6.How does Aetrix verify that S27KS0642GABHB020 is sourced from the original manufacturer or authorized distributors?

All S27KS0642GABHB020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S27KS0642GABHB020 meets industry standards.

7.What is the process for return or replacement of S27KS0642GABHB020?

All S27KS0642GABHB020 units undergo pre-shipment inspection (PSI). If there is an issue with S27KS0642GABHB020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S27KS0642GABHB020 part is unused and in its original packaging.

Return procedure for S27KS0642GABHB020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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