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Infineon Technologies S27KS0642GABHB023

Part No.:
S27KS0642GABHB023
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS27KS0642GABHB023.pdf
Description:
IC PSRAM 64MBIT HYPERBUS 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,830

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Product details

Overview

S27KS0642GABHB023 from Infineon is a 64Mb self-refresh DRAM (PSRAM) with HYPERBUS™ interface, operating at 1.8 V or 3.0 V VCC/VCCQ, supporting DDR transfers up to 200 MHz clock rate and 400 MBps throughput. It features 8-bit DQ bus, bidirectional RWDS strobe, configurable burst lengths (16–128 bytes), and industrial temperature range (–40°C to +85°C) in 24-ball FBGA package. Used in embedded microcontroller systems requiring low-pin-count, high-bandwidth external memory without host-managed refresh.

For engineers reviewing the S27KS0642GABHB023 datasheet, S27KS0642GABHB023 pinout, S27KS0642GABHB023 application, or S27KS0642GABHB023 equivalent, key selection factors include HYPERBUS™ timing compliance, RWDS phase alignment for read eye optimization, burst configuration register settings, and hybrid sleep/deep power-down current specs under 1.8 V/3.0 V supply conditions.

Technical Context

The device implements a self-refresh DRAM core with integrated refresh controller, presenting static RAM behavior to the host despite dynamic cell architecture. All refresh operations occur autonomously during idle intervals between HYPERBUS™ transactions, eliminating host refresh overhead.

HYPERBUS™ interface uses single-ended or optional differential clock (CK/CK#), 11–12 signal count, and LV-CMOS I/O. RWDS serves dual roles: initial latency indicator at transaction start and edge-aligned read/write strobe-optionally enhanced via DDR center-aligned read strobe (DCARS) for improved timing margin in high-speed reads.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density64 Mbit (8 MB), organized as 8,388,608 × 8 bits - supports compact code/data expansion in MCU-based systems.
Interface StandardHYPERRAM™ with HYPERBUS™ protocol - 11–12-pin DDR interface enabling high bandwidth with minimal PCB routing.
Max Clock Rate200 MHz (DDR) - delivers 400 MBps peak data rate; requires precise CK/RWDS timing alignment per JEDEC-compliant layout.
Burst LengthConfigurable wrapped bursts: 16/32/64/128 bytes - balances latency vs. throughput for real-time buffer or frame storage.
Power ModesHybrid Sleep (330 µA @ 1.8 V) and Deep Power-Down (12 µA @ 1.8 V) - enables ultra-low-power operation in battery-backed applications.
Operating TempIndustrial grade: –40°C to +85°C - qualified for industrial control, HMI, and edge node deployments without derating.
Package24-ball FBGA, 5 mm × 5 mm, 0.8 mm pitch - compatible with standard SMT reflow, supports high-density PCB layouts.

Pinout & Package

24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch) with ball map defined per Infineon datasheet Rev. *I, page 49–50. Pin functions validated against official signal description table (Section 3.1, page 9).

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip SelectActive-low enable for all HYPERBUS™ transactions; must be asserted before CA transfer and held stable during burst.
CK / CK#Clock InputSingle-ended (CK only) or differential (CK/CK#) reference; determines DDR sampling edges for DQ and RWDS.
RWDSBidirectional StrobeIndicates refresh latency at start of transaction; acts as read strobe (edge-aligned) or write mask (input) during data phase.
DQ[7:0]Data Bus8-bit bidirectional LV-CMOS bus carrying command/address/data; DDR transfers two bytes per clock cycle.
RESET#Hardware ResetAsynchronous active-low reset that clears internal state and forces re-initialization on next CS# assertion.

Key Features

FeatureDesign Value
Self-Refresh DRAM CoreEliminates host refresh management; internal logic schedules array refresh during idle cycles - reduces firmware complexity and CPU load.
Configurable Output Drive StrengthAdjustable DQ/RWDS drive levels optimize signal integrity across varying trace lengths and termination schemes without external resistors.
DCARS SupportOptional DDR center-aligned read strobe shifts RWDS phase by 90° relative to CK - widens valid data window for reliable high-speed reads.
Partial Array RefreshSupports 1/8, 1/4, or 1/2 array refresh - lowers average current during light-traffic operation while maintaining data retention.
Hybrid Sleep ModeRetains memory contents with sub-µA leakage; exits in <1 µs - ideal for wake-on-event architectures in IoT endpoints.

Applications

Automotive Instrument ClustersIndustrial HMI Panels

Use Scenario: Real-time rendering of vector graphics and animated UI elements in digital dashboards with limited MCU SRAM.

IC Role / Device Role / Timing Role: External PSRAM providing 8 MB frame buffer and overlay storage; synchronized via HYPERBUS™ to MCU's memory-mapped interface.

Use Value: Enables 60 Hz UI updates using linear 128-byte bursts at 200 MHz, reducing display latency versus SPI flash or QSPI PSRAM alternatives.

Use Scenario: Local data logging and recipe storage in programmable logic controllers with deterministic response requirements.

IC Role / Device Role / Timing Role: Non-volatile-adjacent memory for buffering sensor streams and configuration tables; accessed via fixed-latency HYPERBUS™ reads/writes.

Use Value: Hybrid Sleep mode cuts standby current to 330 µA, extending runtime during mains loss while preserving volatile context.

Edge AI Inference AcceleratorsMedical Patient Monitors

Use Scenario: On-device neural network inference where model weights are cached externally to conserve MCU on-chip memory.

IC Role / Device Role / Timing Role: High-throughput memory mapped as XIP-capable region; burst reads feed convolution engine with minimal wait states.

Use Value: 400 MBps bandwidth sustains >95% MAC utilization during INT8 inference kernels, avoiding pipeline stalls.

Use Scenario: Real-time waveform acquisition and overlay rendering in portable ECG/SpO₂ devices with strict power budgets.

IC Role / Device Role / Timing Role: Dual-role buffer: stores raw ADC samples (write bursts) and pre-rendered UI assets (read bursts), managed via RWDS timing feedback.

Use Value: Deep power-down current of 12 µA extends battery life beyond 72 hours in standby without compromising wake-up responsiveness.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PSRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S27KL0642GABHI020Same die, identical HYPERBUS™ timing and register map; differs only in temperature grade (Industrial Plus: –40°C to +105°C) and FBGA marking.Required for extended-temperature industrial control cabinets or under-hood automotive modules.Select when ambient operating temperature exceeds +85°C but full AEC-Q100 qualification is not needed.
Infineon S27KS0642GABHB020Identical electrical and functional spec; differs only in tape-and-reel packaging (3,000 pcs/reel vs. 1,000 pcs/reel) and date code format.No impact on board design or firmware; relevant only for production line feeding and inventory tracking.Choose based on SMT line feeder compatibility and procurement lot sizing requirements.

Compared with S27KL0642GABHI020 and S27KS0642GABHB020, the S27KS0642GABHB023 offers identical memory performance and HYPERBUS™ interoperability but targets standard industrial temperature range and medium-volume reel packaging-making it optimal for cost-sensitive, volume OEM designs with verified thermal margins.

Availability

S27KS0642GABHB023 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMI panels, edge AI accelerators, and medical patient monitors requiring stable component supply across multi-year production cycles.

Supply support for S27KS0642GABHB023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.

This device belongs to the HYPERRAM™ product line, designed specifically to replace legacy SRAM and NOR flash in bandwidth-constrained, pin-limited embedded systems while delivering DRAM-level density and cost efficiency.

FAQ

Does S27KS0642GABHB023 require external refresh circuitry or host software intervention?

No. The device integrates autonomous self-refresh logic that executes array refresh during idle periods between HYPERBUS™ transactions. Host systems access it as a static memory-no refresh commands, timers, or firmware overhead are required. Refresh timing and scheduling are fully internal and transparent to the controller.

What is the role of RWDS in write transactions, and how does it differ from read mode?

In write transactions, RWDS functions as a write data mask input, allowing selective byte enabling on the DQ[7:0] bus. During reads, RWDS is driven by the device as a strobe aligned to data edges. This dual-mode operation is hardware-controlled and requires no mode register setting-the direction is determined by transaction type (CA[5:0] = 0x02 for write, 0x03 for read).

Can S27KS0642GABHB023 operate with only single-ended clock (CK), or is differential clock (CK/CK#) mandatory?

Single-ended clock (CK only) is fully supported and commonly used. Differential clock (CK/CK#) is optional and improves noise immunity in electrically noisy environments. Both modes use identical timing parameters and register configurations; no hardware or firmware changes are needed when switching between them.

How does partial array refresh affect power consumption and data retention reliability?

Partial array refresh reduces active current by limiting refresh to 1/8, 1/4, or 1/2 of the memory array per cycle, lowering average power by up to 50% during light-traffic operation. Data retention remains guaranteed per JEDEC JESD22-A117 for all configured refresh fractions, with no impact on MTBF or error rates under specified temperature and voltage conditions.

S27KS0642GABHB023 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERRAM™ KS
Package/Case:
24-VBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
PSRAM
Technology:
PSRAM (Pseudo SRAM)
Memory Size:
64Mbit
Memory Organization:
8M x 8
Memory Interface:
HyperBus
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
35ns
Access Time:
35 ns
Voltage - Supply:
1.7V ~ 2V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S27KS0642GABHB023 FAQ

1.How can I place an order for S27KS0642GABHB023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S27KS0642GABHB023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S27KS0642GABHB023 reliable?

The price and inventory of S27KS0642GABHB023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S27KS0642GABHB023 is usually 5 days.

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4.How is shipping managed for S27KS0642GABHB023?

S27KS0642GABHB023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S27KS0642GABHB023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S27KS0642GABHB023?

For technical support, including S27KS0642GABHB023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S27KS0642GABHB023 requirements.

6.How does Aetrix verify that S27KS0642GABHB023 is sourced from the original manufacturer or authorized distributors?

All S27KS0642GABHB023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S27KS0642GABHB023 meets industry standards.

7.What is the process for return or replacement of S27KS0642GABHB023?

All S27KS0642GABHB023 units undergo pre-shipment inspection (PSI). If there is an issue with S27KS0642GABHB023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S27KS0642GABHB023 part is unused and in its original packaging.

Return procedure for S27KS0642GABHB023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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