Infineon Technologies S27KS0642GABHI020
- Part No.:
- S27KS0642GABHI020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S27KS0642GABHI020.pdf
- Description:
- IC PSRAM 64MBIT HYPERBUS 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,352
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S27KS0642GABHI020 from Infineon Technologies is a 64 Mb self-refresh DRAM (PSRAM) with HYPERBUS™ interface, operating at 1.8 V/3.0 V VCC/VCCQ, supporting DDR transfers up to 200 MHz and delivering up to 400 MBps throughput in industrial temperature range (–40°C to +85°C), used as high-bandwidth, low-pin-count external memory for microcontrollers in automotive instrument clusters.
For engineers reviewing the S27KS0642GABHI020 datasheet, S27KS0642GABHI020 pinout, S27KS0642GABHI020 application, or S27KS0642GABHI020 equivalent, key selection factors include HYPERBUS™ timing compliance, RWDS-driven read latency handling, burst length configurability (16–128 bytes), and hybrid sleep/deep power-down mode support for embedded real-time systems.
Technical Context
The device implements a self-refresh DRAM array with integrated refresh control logic, eliminating host-managed refresh cycles while maintaining static RAM-like interface behavior. It uses LV-CMOS signaling on an 8-bit DQ bus with bidirectional RWDS for read-data strobe and write-data mask functions, and supports both single-ended (11-signal) and optional differential clock (12-signal) HYPERBUS™ configurations.
Command, address, and data share the same DQ[7:0] lines in time-multiplexed fashion; all transactions begin with CS# assertion followed by six CA bytes. Initial access latency (tACC = 35 ns max) and configurable wrapped/linear burst modes enable deterministic timing for real-time MCU interfacing without external refresh arbitration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 64 Mb (8 MB), organized as 8,388,608 × 8 bits - matches typical MCU external code/data memory expansion needs |
| Interface standard | HYPERRAM™ with HYPERBUS™ protocol - 11- or 12-signal DDR interface enabling high bandwidth with minimal PCB routing |
| Max clock rate | 200 MHz DDR - delivers 400 MBps peak throughput, sufficient for graphics frame buffer or firmware streaming |
| Access time | tACC ≤ 35 ns - defines minimum initial latency before first data byte in read transactions |
| Burst lengths | Configurable wrapped bursts: 16/32/64/128 bytes - enables alignment with cache line sizes and DMA transfer units |
| Power modes | Hybrid Sleep and Deep Power-Down - reduces standby current to 330 µA / 12 µA (1.8 V) for battery-sensitive applications |
| Operating temp | –40°C to +85°C (Industrial grade) - qualified for under-hood and dashboard electronics without derating |
Pinout & Package
Package: 24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for command/address/data transactions; deassertion terminates ongoing burst |
| CK / CK# | Clock input (optional differential) | Source-synchronous timing reference; CK# enables jitter-immune capture in differential mode |
| RWDS | Bidirectional Read/Write Data Strobe | Output during reads to indicate valid data window; input during writes as byte-level mask signal |
| DQ[7:0] | Data I/O bus | Time-multiplexed command/address/data path; supports DDR transfers on both clock edges |
| RESET# | Hardware reset | Asynchronous active-low reset that clears internal state and forces re-initialization sequence |
Key Features
| Feature | Design Value |
|---|---|
| Self-refresh DRAM architecture | Eliminates host refresh overhead while retaining DRAM density/cost advantage - appears as SRAM to MCU software stack |
| Configurable output drive strength | Adjustable DQ/RWDS drive levels reduce signal integrity issues across varied trace lengths and termination schemes |
| DCARS (DDR Center-Aligned Read Strobe) | Phase-shifted RWDS edge placement improves setup/hold margin within read data eye at 200 MHz DDR |
| Partial array refresh | Supports 1/8, 1/4, or 1/2 array refresh - reduces power and latency impact during partial memory usage |
| HYPERBUS™ command encoding | 6-byte CA field enables full 64 Mb addressing plus register access and configuration - no external address latches required |
Applications
| Automotive Instrument Cluster | Industrial HMI Display Controller |
|---|---|
Use Scenario: Real-time rendering of gauges, alerts, and navigation overlays on TFT-LCD panels with MCU-based graphics pipeline. IC Role / Device Role / Timing Role: External PSRAM serving as frame buffer and GUI asset store, interfaced via HYPERBUS™ to reduce MCU pin count and PCB layer count. Use Value: 400 MBps bandwidth sustains 60 Hz 800×480 RGB565 updates; hybrid sleep mode cuts display idle power by >95%. | Use Scenario: Local UI processing in programmable logic controllers with touch-enabled operator panels and dynamic data visualization. IC Role / Device Role / Timing Role: Code-execution extension memory and runtime variable storage for deterministic real-time task scheduling. Use Value: 35 ns tACC and configurable burst lengths align with RTOS tick intervals; industrial temp rating ensures reliability in factory ambient conditions. |
| Edge AI Sensor Hub | Medical Patient Monitor Interface |
Use Scenario: On-device inference preprocessing (image resizing, FFT buffering) in compact sensor fusion modules with limited MCU resources. IC Role / Device Role / Timing Role: High-speed scratchpad memory for intermediate tensor buffers and filter coefficients, accessed via burst-aligned DMA. Use Value: Wrapped 64-byte bursts match common neural network layer tile sizes; deep power-down mode extends battery life between sensor wake cycles. | Use Scenario: Graphical waveform rendering and alarm history logging in portable bedside monitors with strict EMI and safety requirements. IC Role / Device Role / Timing Role: Non-volatile-capable external memory for persistent UI state and waveform snapshots, operating under AEC-Q100 Grade 3 qualification. Use Value: –40°C to +85°C operation validated for clinical environments; RWDS-controlled timing eliminates metastability risk in safety-critical display updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PSRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S27KL0642GABHI020 | Same die, legacy Cypress branding pre-Infineon acquisition; identical electrical specs and timing | No functional difference; legacy part number still supported in some BOMs | Select when maintaining legacy design continuity or sourcing from pre-merger inventory |
| ISSI IS66WV12816EBLL-55BLI | Parallel async SRAM (128 Mbit, 55 ns), no self-refresh, 48-pin TSOP | Higher pin count, no burst capability, fixed latency - requires more MCU GPIOs and larger PCB area | Choose only if HYPERBUS™ controller IP is unavailable and board space allows larger package |
Compared with S27KS0642GABHI020, the Cypress variant offers identical performance with legacy documentation, while the ISSI SRAM trades bandwidth and integration for simpler timing but increases system footprint and power in active use.
Availability
S27KS0642GABHI020 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMIs, edge AI sensor hubs, and medical patient monitor interfaces requiring stable component supply across extended product lifecycles.
Supply support for S27KS0642GABHI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
This device belongs to the HYPERRAM™ product line, designed specifically to replace parallel SRAM and NOR flash in MCU-based systems where high bandwidth, low pin count, and embedded self-refresh are critical.
FAQ
What is the function of the RWDS signal in S27KS0642GABHI020?
RWDS is a bidirectional signal that serves dual roles: during read transactions, it outputs a strobe aligned with the first data byte to indicate valid read window timing; during write transactions, it acts as a byte-level mask input to selectively update DQ[7:0] lanes. Its phase relationship with CK is configurable via DCARS to optimize timing margins at 200 MHz DDR.
Does S27KS0642GABHI020 require external refresh circuitry?
No. The device integrates autonomous self-refresh logic that manages DRAM array refresh without host intervention. The MCU sees it as a static RAM - no refresh commands, timers, or hidden latency penalties are required. Refresh occurs transparently during idle periods or via partial-array cycles triggered internally.
Can S27KS0642GABHI020 operate at both 1.8 V and 3.0 V simultaneously?
No. VCC (core array) and VCCQ (I/O buffer) must be supplied at the same nominal voltage: either both at 1.8 V or both at 3.0 V. The device does not support mixed-voltage operation. Voltage selection is fixed per ordering part number and cannot be dynamically switched in-system.
How is burst length configured in S27KS0642GABHI020?
Burst length is set via Configuration Register 0 (CR0), bits [11:10], which select wrapped burst sizes of 16, 32, 64, or 128 bytes. Linear burst mode is enabled by clearing CR0[12]. These registers are accessed through HYPERBUS™ command sequences (0x00–0x0F), not dedicated pins, allowing runtime reconfiguration without hardware changes.
S27KS0642GABHI020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERRAM™ KS
- Package/Case:
- 24-VBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- PSRAM
- Technology:
- PSRAM (Pseudo SRAM)
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- HyperBus
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 35ns
- Access Time:
- 35 ns
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S27KS0642GABHI020 FAQ
1.How can I place an order for S27KS0642GABHI020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S27KS0642GABHI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S27KS0642GABHI020 reliable?
The price and inventory of S27KS0642GABHI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S27KS0642GABHI020 is usually 5 days.
3.What payment methods are accepted for S27KS0642GABHI020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S27KS0642GABHI020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S27KS0642GABHI020?
S27KS0642GABHI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S27KS0642GABHI020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S27KS0642GABHI020?
For technical support, including S27KS0642GABHI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S27KS0642GABHI020 requirements.
6.How does Aetrix verify that S27KS0642GABHI020 is sourced from the original manufacturer or authorized distributors?
All S27KS0642GABHI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S27KS0642GABHI020 meets industry standards.
7.What is the process for return or replacement of S27KS0642GABHI020?
All S27KS0642GABHI020 units undergo pre-shipment inspection (PSI). If there is an issue with S27KS0642GABHI020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S27KS0642GABHI020 part is unused and in its original packaging.
Return procedure for S27KS0642GABHI020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S27KS0642GABHI020 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

