Infineon Technologies S27KS0642GABHI023
- Part No.:
- S27KS0642GABHI023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S27KS0642GABHI023.pdf
- Description:
- IC PSRAM 64MBIT HYPERBUS 24FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S27KS0642GABHI023 from Infineon Technologies is a 64Mb self-refresh DRAM (PSRAM) with HYPERBUS™ interface, operating at 1.8 V or 3.0 V VCC/VCCQ, supporting DDR transfers up to 200 MHz clock rate and 400 MBps throughput. It features bidirectional RWDS strobe, configurable burst lengths (16–128 bytes), partial/full array refresh, and industrial temperature range (−40°C to +85°C) in 24-ball FBGA package. Used in embedded microcontroller systems requiring low-pin-count, high-bandwidth external memory without host-managed refresh.
For engineers reviewing the S27KS0642GABHI023 datasheet, S27KS0642GABHI023 pinout, S27KS0642GABHI023 application, or S27KS0642GABHI023 equivalent, key selection criteria include HYPERBUS™ timing compliance, RWDS phase alignment for read data capture, burst configuration register settings, DCARS support status, and industrial-grade thermal performance under sustained 200 MHz operation.
Technical Context
The device implements a self-refresh DRAM core with integrated refresh controller, eliminating host-side refresh management while presenting static RAM-like behavior. Its HYPERBUS™ interface uses 8-bit DQ bus with single-ended or optional differential CK/CK# and bidirectional RWDS for latency signaling and data masking.
It supports linear and wrapped burst modes (8–64 clocks), hybrid burst (wrapped + linear), configurable output drive strength, and four power modes: active, interface standby, hybrid sleep, and deep power-down - with 12 µA deep power-down current at 2.0 V and 105°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 Mbit (8 MB), organized as 8,388,608 × 8 bits |
| Interface Standard | HYPERRAM™ compliant HYPERBUS™ DDR interface with 11–12 signal count |
| Max Clock Rate | 200 MHz DDR - enables 400 MBps peak bandwidth on 8-bit DQ bus |
| Burst Length | Configurable: 16/32/64/128 bytes (8/16/32/64 clocks), plus hybrid mode |
| Access Latency | tACC ≤ 35 ns at 1.8 V - defines minimum time from command to valid read data |
| Power Modes | Hybrid Sleep (low-latency wake) and Deep Power-Down (12 µA @ 2.0 V, 105°C) |
| Operating Temp | Industrial grade: −40°C to +85°C - validated for continuous operation in embedded control environments |
Pinout & Package
Package: 24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ[7:0] | Data I/O bus | 8-bit bidirectional DDR data path; transfers two bytes per clock cycle |
| CK / CK# | Clock input | Single-ended (CK only) or differential (CK/CK#) clock source; determines sampling edge for CA and data |
| RWDS | Read/Write Data Strobe | Bidirectional: indicates initial latency start in reads; serves as write mask in writes; center-aligned or DCARS-shifted |
| CS# | Chip Select | Active-low enable for all transactions; deassertion terminates ongoing access |
| RESET# | Hardware reset | Asynchronous active-low signal forcing device into known power-on state |
| VCC / VCCQ | Power supplies | VCC = 1.8 V or 3.0 V core; VCCQ = same voltage for I/O buffers - no split-rail requirement |
Key Features
| Feature | Design Value |
|---|---|
| Self-refresh DRAM core | Eliminates host refresh overhead; maintains data integrity during idle periods without CPU intervention |
| HYPERBUS™ low-pin-count interface | 11–12 signals replace traditional parallel NOR/NAND buses - reduces PCB layer count and routing complexity |
| Configurable RWDS timing | Supports standard center-aligned or DCARS phase-shifted RWDS to optimize read data eye margin at 200 MHz |
| Partial array refresh | Enables selective 1/8, 1/4, or 1/2 array refresh - reduces average current during light-access workloads |
| Hybrid Sleep mode | Retains memory contents with sub-µs wake latency - suitable for real-time interrupt-driven applications |
Applications
| Automotive Instrument Clusters | Industrial HMI Panels |
|---|---|
Use Scenario: Real-time rendering of vector graphics and animated UI elements in digital dashboards. IC Role / Device Role / Timing Role: External PSRAM providing frame buffer storage for MCU-driven display controller; synchronized via HYPERBUS™ CK/RWDS. Use Value: 400 MBps bandwidth sustains 60 Hz updates of 1280×720 RGB565 frame buffers without DMA bottlenecks. | Use Scenario: Local caching of configuration data, firmware overlays, and alarm history logs in programmable logic controllers. IC Role / Device Role / Timing Role: Non-volatile-adjacent memory for fast read/write access with deterministic latency; managed by ARM Cortex-M7 host. Use Value: Hybrid Sleep mode enables <1 µs wake from low-power state - critical for sub-millisecond response to fieldbus interrupts. |
| Medical Patient Monitors | Edge AI Inference Accelerators |
Use Scenario: Buffering multi-channel ECG waveform streams and annotation metadata prior to compression and transmission. IC Role / Device Role / Timing Role: High-reliability external memory supporting burst-aligned acquisition at 10 kS/s per channel with guaranteed tACC ≤ 35 ns. Use Value: Industrial temperature rating (−40°C to +85°C) ensures stable operation inside sealed medical enclosures without forced cooling. | Use Scenario: Storing intermediate activation tensors during CNN inference on microcontroller-based vision modules. IC Role / Device Role / Timing Role: Low-latency, high-throughput memory backing lightweight neural network accelerators with HYPERBUS™-direct host interface. Use Value: Configurable 128-byte wrapped bursts align with typical tensor tile sizes - minimizing bus turnaround overhead and improving MAC utilization. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PSRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S27KL0642GABHI020 | Same die, identical electrical specs, but rated for Automotive AEC-Q100 Grade 2 (−40°C to +105°C) | Required for under-hood automotive ECUs; higher temp validation adds cost and qualification lead time | Select when ambient operating temperature exceeds +85°C or AEC-Q100 compliance is mandated |
| Infineon S27KS0642GABHI010 | Identical functionality and pinout, but configured for 3.0 V-only operation (VCC/VCCQ = 3.0 V) | Used where system lacks 1.8 V rail; higher active current (30 mA vs. 25 mA at 200 MHz) | Select when board-level power architecture uses only 3.0 V supply for memory subsystem |
Compared with S27KS0642GABHI023, the S27KL0642GABHI020 extends thermal capability for harsh environments, while S27KS0642GABHI010 simplifies power design at the cost of higher dynamic current - both retain identical HYPERBUS™ timing, burst control, and RWDS behavior.
Availability
S27KS0642GABHI023 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMI panels, medical patient monitors, and edge AI inference accelerators requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S27KS0642GABHI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT markets.
This device belongs to the HYPERRAM™ family, designed specifically to replace parallel NOR/NAND flash and SRAM in resource-constrained MCUs needing high-speed, low-pin-count external memory with zero-host refresh overhead.
FAQ
Does S27KS0642GABHI023 require external refresh circuitry or host software intervention?
No. The device integrates autonomous self-refresh logic that maintains DRAM cell charge during idle periods without any host involvement. Refresh cycles occur transparently between transactions, and the host only observes static RAM-like behavior - no refresh commands, timers, or scheduling are needed in firmware.
What is the function of the RWDS signal during write operations?
During writes, RWDS operates as a write data mask: each rising edge samples one byte of DQ[7:0] data, and its assertion duration determines how many bytes are written in the burst. This enables partial writes without read-modify-write cycles, reducing bus traffic and improving efficiency for small data updates.
Is DCARS (DDR Center-Aligned Read Strobe) enabled by default on this part?
No. DCARS is an optional feature activated via Configuration Register 1 (bit CR1[2]). By default, RWDS operates in standard center-aligned mode. Enabling DCARS introduces a fixed 90° phase shift to RWDS relative to CK, widening the data eye for reliable sampling at maximum 200 MHz operation - particularly beneficial on marginal PCB layouts.
Can S27KS0642GABHI023 operate with only a 1.8 V supply, or does it require separate VCC and VCCQ rails?
It operates with a single 1.8 V supply applied to both VCC (core) and VCCQ (I/O) pins. The device does not require split-rail operation. The 1.8 V/3.0 V designation refers to ordering variants - this specific part (GABHI023) is the 1.8 V version, with absolute max ratings and timing validated for 1.8 V ±0.15 V operation.
S27KS0642GABHI023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERRAM™ KS
- Package/Case:
- 24-VBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- PSRAM
- Technology:
- PSRAM (Pseudo SRAM)
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- HyperBus
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 35ns
- Access Time:
- 35 ns
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S27KS0642GABHI023 FAQ
1.How can I place an order for S27KS0642GABHI023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S27KS0642GABHI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S27KS0642GABHI023 reliable?
The price and inventory of S27KS0642GABHI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S27KS0642GABHI023 is usually 5 days.
3.What payment methods are accepted for S27KS0642GABHI023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S27KS0642GABHI023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S27KS0642GABHI023?
S27KS0642GABHI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S27KS0642GABHI023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S27KS0642GABHI023?
For technical support, including S27KS0642GABHI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S27KS0642GABHI023 requirements.
6.How does Aetrix verify that S27KS0642GABHI023 is sourced from the original manufacturer or authorized distributors?
All S27KS0642GABHI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S27KS0642GABHI023 meets industry standards.
7.What is the process for return or replacement of S27KS0642GABHI023?
All S27KS0642GABHI023 units undergo pre-shipment inspection (PSI). If there is an issue with S27KS0642GABHI023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S27KS0642GABHI023 part is unused and in its original packaging.
Return procedure for S27KS0642GABHI023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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