Infineon Technologies S27KS0642GABHI033
- Part No.:
- S27KS0642GABHI033
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S27KS0642GABHI033.pdf
- Description:
- IC PSRAM 64MBIT HYPERBUS 24FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S27KS0642GABHI033 from Infineon is a 64Mb self-refresh DRAM (PSRAM) with HYPERBUS™ interface, operating at 1.8 V or 3.0 V VCC/VCCQ, supporting DDR transfers up to 200 MHz clock rate and 400 MBps throughput. It features bidirectional RWDS strobe, configurable burst lengths (16–128 bytes), partial/full array refresh, and industrial temperature range (−40°C to +85°C) in 24-ball FBGA package. Used in embedded microcontroller systems requiring low-pin-count, high-bandwidth external memory with no host-managed refresh.
For engineers reviewing the S27KS0642GABHI033 datasheet, S27KS0642GABHI033 pinout, S27KS0642GABHI033 application, or S27KS0642GABHI033 equivalent, key selection criteria include HYPERBUS™ timing compliance, RWDS phase alignment for read capture, burst configuration register settings, and Deep Power-Down current (12 µA at 2.0 V), critical for battery-powered edge devices and automotive infotainment head units.
Technical Context
This PSRAM implements a self-refresh DRAM core with integrated refresh control logic, eliminating host refresh management. Its HYPERBUS™ interface uses only 11–12 signals (including optional CK#), with command/address/data multiplexed on DQ[7:0] and RWDS serving dual roles: initial latency indicator and read/write strobe/mask.
The device supports linear and wrapped burst modes, DCARS-enabled center-aligned RWDS for improved read data eye margin, and hybrid sleep/deep power-down modes. Timing-critical parameters include tACC = 35 ns max, 200 MHz DDR clock, and configurable output drive strength - all managed via Configuration Registers 0 and 1 accessible over the HYPERBUS™ interface.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 Mbit (8 MByte), organized as 1M × 64-bit internal array |
| Interface Standard | HYPERRAM™/HYPERBUS™ DDR, 8-bit DQ + RWDS + CS# + CK/CK# + RESET# |
| Max Clock Rate | 200 MHz DDR - enables 400 MBps sustained throughput with aligned RWDS capture |
| Access Time | tACC ≤ 35 ns - defines minimum time from CK edge to valid DQ output during reads |
| Burst Lengths | Configurable: 16/32/64/128 bytes (8/16/32/64 clocks) - balances bandwidth vs. transaction overhead |
| Power Modes | Hybrid Sleep (low-latency wake), Deep Power-Down (12 µA @ 2.0 V, 105°C) |
| Operating Temp | Industrial grade: −40°C to +85°C - qualified per AEC-Q100 Grade 3 for automotive ECUs |
Pinout & Package
Package: 24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ[7:0] | Bi-directional data bus | Multiplexes command, address, and read/write data; LV-CMOS I/O, VCCQ-referenced |
| RWDS | Bi-directional read/write data strobe | Output: indicates refresh latency start & read data valid window; Input: write mask during WR transactions |
| CS# | Chip select (active low) | Asserted to initiate all HYPERBUS™ transactions; deassertion terminates access |
| CK / CK# | Differential clock inputs | DDR sampling reference; CK# enables precise edge alignment for RWDS phase shift (DCARS mode) |
| RESET# | Hardware reset (active low) | Asynchronous reset of internal logic and registers; requires ≥100 ns pulse width |
| VCC / VCCQ | Power supplies | VCC = 1.8 V or 3.0 V core; VCCQ = same voltage for I/O buffers - single-supply operation supported |
Key Features
| Feature | Design Value |
|---|---|
| Self-refresh DRAM core | Eliminates host refresh overhead; internal logic schedules refresh during idle cycles without interrupting transactions |
| DCARS-enabled RWDS | Phase-shifted RWDS edge placement improves read data setup/hold margin by aligning strobe transition within data eye center |
| Configurable burst wrapping | Supports both linear and wrapped bursts - critical for cache-line-aligned accesses in MCU external memory interfaces |
| Hybrid Sleep mode | Retains memory state with <1 µA additional current vs. active mode; resumes in <500 ns - ideal for real-time interrupt response |
| AEC-Q100 Grade 3 | Qualified for automotive applications including instrument clusters and ADAS sensor fusion modules operating at −40°C to +85°C |
Applications
| Automotive Instrument Cluster | Industrial HMI Display Controller |
|---|---|
Use Scenario: Real-time rendering of vector graphics and animated gauges in digital dashboards with strict latency constraints. IC Role / Device Role / Timing Role: External PSRAM providing frame buffer storage for GPU or display controller; RWDS-synchronized reads ensure pixel data validity at display controller sampling edge. Use Value: 400 MBps bandwidth sustains 1080p@60Hz RGB888 framebuffer updates; Deep Power-Down reduces quiescent current during vehicle sleep mode. | Use Scenario: Local UI rendering in factory-floor HMIs where MCU internal RAM is insufficient for multi-language GUI assets. IC Role / Device Role / Timing Role: High-speed external memory mapped into MCU's XIP or DMA-accessible address space; HYPERBUS™'s low signal count minimizes PCB routing complexity. Use Value: 24-ball FBGA simplifies layout vs. parallel NOR/NAND; configurable burst length optimizes DMA transfer efficiency for JPEG texture loads. |
| Edge AI Sensor Hub | Medical Portable Monitor |
Use Scenario: On-device inference acceleration using lightweight CNN models with intermediate tensor buffering. IC Role / Device Role / Timing Role: PSRAM serves as scratchpad memory for neural network layer outputs; self-refresh avoids CPU intervention during inference pipeline stalls. Use Value: Hybrid Sleep mode enables rapid wake from sensor-triggered inference while maintaining 64Mb context; tACC = 35 ns ensures timely weight matrix fetches. | Use Scenario: Battery-powered patient monitors requiring continuous waveform logging and touchscreen UI with >8-hour runtime. IC Role / Device Role / Timing Role: Frame buffer and event log storage; Deep Power-Down (12 µA @ 2.0 V) extends battery life during standby between vital sign updates. Use Value: Industrial temp rating (−40°C to +85°C) supports operation in uncontrolled clinical environments; single 1.8 V supply simplifies PMIC design. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PSRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S27KL0642GABHI033 | Same die, identical electrical specs and pinout; legacy Cypress branding pre-Infineon acquisition | No functional difference; legacy part number used in older BOMs | Select when maintaining legacy design continuity or sourcing from existing distributor stock |
| ISSI IS66WV12816EBLL-55BLI | Parallel SRAM (not PSRAM); 128K × 16-bit, 55 ns async access; no self-refresh or HYPERBUS™ | Requires more pins (48-TSOP), higher static power, no burst or DDR capability | Choose only if system lacks HYPERBUS™ controller support and needs true async SRAM behavior |
Compared with S27KS0642GABHI033, the Cypress variant offers identical performance and drop-in compatibility, while the ISSI SRAM trades bandwidth and pin-efficiency for deterministic timing and zero refresh complexity - making it suitable only for non-HYPERBUS™ legacy platforms.
Availability
S27KS0642GABHI033 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMI controllers, edge AI sensor hubs, and portable medical monitors requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S27KS0642GABHI033 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
This device belongs to the HYPERRAM™ product line, designed specifically to replace parallel NOR/NAND and SRAM in MCU-based systems where high bandwidth, low pin count, and self-refresh simplicity are required - targeting automotive, industrial, and IoT edge applications.
FAQ
What is the function of the RWDS signal in S27KS0642GABHI033?
RWDS is a bidirectional strobe that serves three confirmed roles: (1) output at transaction start to indicate refresh latency count, (2) output during reads as edge-aligned read data strobe, and (3) input during writes as byte-level write mask. Its phase can be shifted via DCARS mode to center-align transitions within the read data eye, improving timing margin at 200 MHz DDR operation.
Does S27KS0642GABHI033 require external refresh commands from the host?
No. The device contains fully autonomous self-refresh logic that schedules DRAM array refresh during idle periods without host intervention. The host sees static RAM behavior - no refresh cycles, timers, or commands are needed. Refresh is triggered internally based on temperature and time, and signaled to the host only via RWDS assertion at transaction start when latency must be extended.
Can S27KS0642GABHI033 operate with a single 1.8 V supply?
Yes. VCC and VCCQ are internally connected and rated for 1.8 V ±0.15 V nominal operation. The device supports single-supply configuration with no separate I/O voltage rail required. This is verified in Section 9.4.2 of the datasheet and confirmed in ordering information for the "GABHI" suffix, which denotes 1.8 V VCC/VCCQ industrial-grade variants.
What is the minimum supported burst length and how is it configured?
The minimum supported burst length is 16 bytes (8 clocks), selectable via Configuration Register 0 (CR0[1:0]). Burst length is set at power-up or dynamically via HYPERBUS™ register write; options include 16, 32, 64, or 128 bytes. Wrapped burst mode is mandatory for all lengths, ensuring address wrap-around within the selected page - critical for cache-line-aligned MCU memory accesses.
S27KS0642GABHI033 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERRAM™ KL
- Package/Case:
- 24-VBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- PSRAM
- Technology:
- PSRAM (Pseudo SRAM)
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- HyperBus
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 35ns
- Access Time:
- 35 ns
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S27KS0642GABHI033 FAQ
1.How can I place an order for S27KS0642GABHI033 through Aetrix?
Please submit a Request for Quotation (RFQ) for S27KS0642GABHI033 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S27KS0642GABHI033 reliable?
The price and inventory of S27KS0642GABHI033 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S27KS0642GABHI033 is usually 5 days.
3.What payment methods are accepted for S27KS0642GABHI033?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S27KS0642GABHI033 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S27KS0642GABHI033?
S27KS0642GABHI033 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S27KS0642GABHI033 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S27KS0642GABHI033?
For technical support, including S27KS0642GABHI033 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S27KS0642GABHI033 requirements.
6.How does Aetrix verify that S27KS0642GABHI033 is sourced from the original manufacturer or authorized distributors?
All S27KS0642GABHI033 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S27KS0642GABHI033 meets industry standards.
7.What is the process for return or replacement of S27KS0642GABHI033?
All S27KS0642GABHI033 units undergo pre-shipment inspection (PSI). If there is an issue with S27KS0642GABHI033, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S27KS0642GABHI033 part is unused and in its original packaging.
Return procedure for S27KS0642GABHI033:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S27KS0642GABHI033 Tags

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