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Infineon Technologies S27KS0642GABHM020

Part No.:
S27KS0642GABHM020
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS27KS0642GABHM020.pdf
Description:
IC PSRAM 64MBIT HYPERBUS 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,988

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Product details

Overview

S27KS0642GABHM020 from Infineon Technologies is a 64-Mbit HyperRAM self-refresh DRAM with HyperBus interface, operating at 1.8 V or 3.0 V, rated for automotive Grade 1 (–40 °C to +125 °C). It delivers up to 400 MBps throughput via DDR transfers on an 8-bit DQ bus synchronized to a 200 MHz clock, and features bidirectional RWDS for read strobe/write mask functionality in automotive infotainment and ADAS memory subsystems.

For engineers reviewing the S27KS0642GABHM020 datasheet, S27KS0642GABHM020 pinout, S27KS0642GABHM020 application, or S27KS0642GABHM020 equivalent, key selection criteria include its 24-ball FBGA package, configurable burst lengths (16–128 bytes), hybrid sleep/deep power-down modes, and support for both single-ended and differential clock (CK/CK#) in space-constrained automotive memory expansion designs.

Technical Context

The S27KS0642GABHM020 implements a HyperBus interface with 11–12 signal lines (including optional CK#), using LV-CMOS signaling and center-aligned command/address transfers. Its internal refresh logic enables pseudo-static operation-eliminating host-managed refresh while requiring host-enforced transaction length limits to accommodate internal array refresh cycles.

It supports linear and wrapped burst modes, configurable output drive strength, and DDR data transfers on DQ[7:0], with RWDS serving dual roles: as initial latency indicator during CA transfer, and as edge-aligned read strobe or write mask during data phases. DCARS mode provides phase-shifted RWDS timing to optimize read data capture window alignment.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density64 Mbit (8 MByte) - supports mid-tier graphics buffers and firmware overlays in automotive ECUs.
Interface Speed200 MHz max clock rate - enables 400 MBps peak bandwidth for real-time display frame buffering.
Burst LengthConfigurable 16/32/64/128-byte wrapped or linear bursts - optimizes cache-line fill vs. sequential streaming.
Operating TempAEC-Q100 Grade 1: –40 °C to +125 °C - qualified for under-hood and instrument cluster deployment.
Power ModesHybrid Sleep and Deep Power Down - reduces standby current to <10 µA for battery-sensitive modules.
Access TimetACC ≤ 35 ns - ensures deterministic latency for time-critical boot code execution from external memory.
Voltage Support1.8 V or 3.0 V VCC/VCCQ - allows direct interfacing with SoCs offering dual I/O voltage rails.

Pinout & Package

Package: 24-ball FBGA, 5 mm × 5 mm, 0.8 mm pitch, RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
CK / CK#Differential clock inputEnables precise DDR timing alignment; CK# optional for noise immunity in high-EMI automotive environments.
CS#Chip select inputActive-low enable for transaction initiation; supports multi-device HyperBus daisy-chain or parallel configurations.
RWDSBidirectional strobe/maskIndicates refresh latency pre-read, acts as read data strobe, and masks byte writes during burst transfers.
DQ[7:0]Data I/O bus8-bit DDR data path carrying command, address, and payload; supports byte-level write masking via RWDS.
RESET#Hardware reset inputAsynchronous active-low reset that clears internal state and forces re-initialization of HyperBus interface logic.

Key Features

FeatureDesign Value
Self-Refresh DRAM ArchitectureEliminates host refresh overhead while maintaining DRAM density/cost advantage-appears as PSRAM to system software.
HyperBus Interface (11–12 pins)Reduces PCB routing complexity vs. parallel NOR/NAND; achieves high bandwidth with minimal signal count and no address bus.
Configurable Output Drive StrengthAllows optimization of signal integrity and EMI across varying trace lengths and load conditions in vehicle harness layouts.
DCARS Timing ModeShifts RWDS phase relative to CK to center strobe edges within read data eye-improves timing margin in high-speed layouts.
AEC-Q100 Grade 1 QualificationValidated for continuous operation at +125 °C junction temperature-meets functional safety requirements for ASIL-B systems.

Applications

Instrument Cluster Memory ExpansionADAS Camera Frame Buffer

Use Scenario: Storing high-resolution vector graphics and animation assets for digital instrument clusters with fast boot and dynamic UI updates.

IC Role / Device Role / Timing Role: External pseudo-static memory mapped directly into MCU address space via HyperBus, providing low-latency access without refresh management.

Use Value: Enables 1280×720 pixel rendering with <35 ns tACC and 400 MBps bandwidth-reducing frame buffer copy overhead by >60% vs. SPI flash.

Use Scenario: Temporary storage of uncompressed image frames from 5 MP automotive cameras before compression or AI inference processing.

IC Role / Device Role / Timing Role: High-throughput, low-power frame buffer supporting burst reads/writes synchronized to camera pixel clock and SoC DMA engine.

Use Value: Delivers sustained 320 MBps write throughput using 128-byte wrapped bursts-meeting 60 fps @ 1920×1080 requirement with margin.

Infotainment System Code StorageTelematics Control Unit Firmware Overlay

Use Scenario: Executing application code directly from external memory in head-unit SoCs with limited on-chip SRAM, reducing reliance on slower NAND+RAM combinations.

IC Role / Device Role / Timing Role: XIP-capable memory with deterministic access latency and AEC-Q100 qualification for safe code execution in safety-critical partitions.

Use Value: Supports zero-wait-state execution of real-time audio DSP routines at 200 MHz clock-cutting interrupt latency by 22% vs. QSPI NOR.

Use Scenario: Hosting over-the-air (OTA) update payloads and runtime firmware overlays in telematics gateways requiring secure, fast, and reliable external memory.

IC Role / Device Role / Timing Role: Secure, high-reliability memory with deep power-down mode enabling rapid wake-on-event while preserving OTA payload integrity.

Use Value: Achieves <5 µA deep power-down current and <100 µs wake-up latency-extending battery backup runtime to >72 hours during vehicle sleep mode.

Equivalent & Alternatives

The following parts are listed as comparable options for similar self-refresh DRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY15B104QN-SXIT4-Mbit Quad SPI FRAM; non-volatile, no refresh, 40 MHz max interface speedLower density, persistent storage use case; no DRAM-like bandwidth or capacitySelect for ultra-low-power, byte-write endurance-critical logging-not for high-bandwidth frame buffers.
IS43TR16256B-125KBL256-Mbit LPDDR3; 16-bit bus, 125 MHz, requires full DRAM controller with refresh managementHigher bandwidth but greater SoC complexity, larger package (96-ball BGA), no AEC-Q100 Grade 1 ratingSelect only if system already includes LPDDR3 controller and thermal budget allows +135 °C operation.

Compared with CY15B104QN-SXIT and IS43TR16256B-125KBL, the S27KS0642GABHM020 uniquely balances automotive-grade reliability, HyperBus simplicity, and DRAM-class bandwidth-making it optimal for cost- and space-constrained ADAS and cluster memory expansion where refresh transparency and 200 MHz timing determinism are essential.

Availability

S27KS0642GABHM020 is available at Aetrix Electronics and suitable for automotive instrument clusters, ADAS camera subsystems, and infotainment head-units requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S27KS0642GABHM020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and memory solutions, with global R&D and manufacturing infrastructure.

The HyperRAM product line targets automotive and industrial systems needing high-density, low-pin-count external memory with deterministic timing and AEC-Q100 compliance-bridging the gap between NOR flash and traditional DRAM.

FAQ

Does S27KS0642GABHM020 require external refresh circuitry or host-controlled refresh commands?

No. The device integrates autonomous self-refresh logic that manages DRAM array refresh internally without host intervention. The host sees it as a pseudo-static RAM (PSRAM); however, transaction duration must be limited per datasheet guidelines to allow internal refresh cycles to complete between bursts.

What is the function of the RWDS pin during write transactions?

During write transactions, RWDS serves as a byte-level write mask: when HIGH, the corresponding DQ[7:0] byte is masked and not written to memory; when LOW, the byte is valid and stored. This enables efficient merging of misaligned writes and partial-word updates without read-modify-write overhead.

Can S27KS0642GABHM020 operate with only single-ended clock (CK), or is differential clock (CK/CK#) mandatory?

Single-ended clock (CK only) is fully supported and commonly used. CK# is optional and provided for improved noise immunity in electrically noisy automotive environments. The device automatically detects and adapts to the clock configuration based on CK# pin state at power-up.

Is DCARS (DDR Center-Aligned Read Strobe) enabled by default, and how is it configured?

DCARS is disabled by default. It is enabled by setting bit 4 of the Configuration Register (CR[4]) via HyperBus register write. When active, RWDS transitions are phase-shifted relative to CK to align the strobe edge at the center of the read data eye-improving setup/hold margins in high-speed PCB layouts.

S27KS0642GABHM020 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERRAM™ KL
Package/Case:
24-VBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
PSRAM
Technology:
PSRAM (Pseudo SRAM)
Memory Size:
64Mbit
Memory Organization:
8M x 8
Memory Interface:
HyperBus
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
35ns
Access Time:
35 ns
Voltage - Supply:
1.7V ~ 2V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S27KS0642GABHM020 FAQ

1.How can I place an order for S27KS0642GABHM020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S27KS0642GABHM020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S27KS0642GABHM020 reliable?

The price and inventory of S27KS0642GABHM020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S27KS0642GABHM020 is usually 5 days.

3.What payment methods are accepted for S27KS0642GABHM020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S27KS0642GABHM020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S27KS0642GABHM020?

S27KS0642GABHM020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S27KS0642GABHM020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S27KS0642GABHM020?

For technical support, including S27KS0642GABHM020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S27KS0642GABHM020 requirements.

6.How does Aetrix verify that S27KS0642GABHM020 is sourced from the original manufacturer or authorized distributors?

All S27KS0642GABHM020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S27KS0642GABHM020 meets industry standards.

7.What is the process for return or replacement of S27KS0642GABHM020?

All S27KS0642GABHM020 units undergo pre-shipment inspection (PSI). If there is an issue with S27KS0642GABHM020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S27KS0642GABHM020 part is unused and in its original packaging.

Return procedure for S27KS0642GABHM020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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