Infineon Technologies S27KS0642GABHV023
- Part No.:
- S27KS0642GABHV023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S27KS0642GABHV023.pdf
- Description:
- IC PSRAM 64MBIT HYPERBUS 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,593
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S27KS0642GABHV023 from Infineon Technologies is a 64Mb self-refresh DRAM (PSRAM) with HYPERBUS™ interface, operating at 1.8 V or 3.0 V VCC/VCCQ, supporting DDR transfers up to 200 MHz and delivering up to 400 MBps throughput. It features bidirectional RWDS for read/write strobe/mask, configurable burst lengths (16–128 bytes), partial/full array refresh, and 24-ball FBGA packaging for industrial-plus (−40°C to +105°C) applications in embedded controllers and display buffers.
For engineers reviewing the S27KS0642GABHV023 datasheet, S27KS0642GABHV023 pinout, S27KS0642GABHV023 application, or S27KS0642GABHV023 equivalent, key selection criteria include HYPERBUS™ timing compliance, RWDS phase alignment support, DCARS capability, burst configuration flexibility, and AEC-Q100 Grade 2 qualification for high-temperature automotive use.
Technical Context
The device implements a DDR HYPERBUS™ interface with 8-bit DQ bus, single-ended or optional differential clock (CK/CK#), and bidirectional RWDS that serves as both read data strobe and write data mask. Command/address and data share the same DQ[7:0] lines, with six CA bytes transferred per transaction.
Internal refresh logic enables pseudo-static operation: the host avoids managing refresh cycles, but must respect initial access latency (tACC = 35 ns max) and limit burst duration to allow internal DRAM refresh. Configuration registers control wrapped/linear burst modes, output drive strength, and power modes including Hybrid Sleep and Deep Power-Down.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 Mbit (8 MB) - supports compact external memory expansion without SRAM cost penalty |
| Clock Rate | Up to 200 MHz DDR - enables 400 MBps peak bandwidth on 8-bit bus |
| Access Time | tACC ≤ 35 ns - defines minimum latency between CS# assertion and valid read data |
| Supply Voltage | 1.8 V or 3.0 V VCC/VCCQ - dual-voltage support simplifies integration with mixed-voltage SoCs |
| Burst Length | 16/32/64/128 bytes (wrapped or linear) - balances throughput vs. transaction overhead in real-time systems |
| Power Modes | Hybrid Sleep & Deep Power-Down - reduces standby current to 330 µA / 12 µA at 2.0 V, 105°C |
| Operating Temp | −40°C to +105°C (Industrial Plus) - qualified for under-hood automotive and industrial edge compute |
Pinout & Package
Package: 24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, VCCQ | Power supply inputs | Separate 1.8 V/3.0 V supplies for core (VCC) and I/O (VCCQ); decoupling required per datasheet layout guidelines |
| GND | Ground reference | Four dedicated GND balls ensure low-impedance return path for DDR signaling integrity |
| CS# | Chip select | Active-low enable; deassertion terminates all transactions and initiates power-down entry sequence |
| CK, CK# | Clock inputs | Differential clock pair supports jitter-tolerant timing; single-ended CK mode uses CK only, CK# tied to VSS |
| RWDS | Bidirectional strobe | Output during reads (data valid indicator), input during writes (byte mask); phase-aligned with DCARS option |
| DQ[7:0] | Data I/O bus | Shared command/address/data lines; LV-CMOS compatible; requires controlled impedance routing (50 Ω) |
| RESET# | Hardware reset | Asynchronous active-low signal forcing device into known state; resets configuration registers and refresh logic |
Key Features
| Feature | Design Value |
|---|---|
| Self-refresh DRAM architecture | Eliminates external refresh controller overhead while retaining DRAM density/cost advantage over SRAM |
| HYPERBUS™ DDR interface | 11–12 signal count (vs. 40+ for parallel NOR/NAND) enables high-speed, low-pin-count memory expansion |
| Configurable RWDS behavior | Supports standard edge-aligned or DCARS phase-shifted strobe to maximize read data eye margin at 200 MHz |
| Partial array refresh | Reduces refresh power by refreshing only 1/8, 1/4, or 1/2 of array - critical for battery-powered displays |
| AEC-Q100 Grade 2 | Validated for automotive applications up to +105°C ambient - suitable for instrument clusters and ADAS displays |
Applications
| Automotive Instrument Cluster | Industrial HMI Display Buffer |
|---|---|
Use Scenario: Real-time rendering of gauges, alerts, and navigation overlays in digital dashboards. IC Role / Device Role / Timing Role: External frame buffer memory interfaced via HYPERBUS™ to MCU GPU or display controller. Use Value: 400 MBps bandwidth sustains 1080p@60Hz RGB888 updates; AEC-Q100 Grade 2 ensures reliability at 105°C under hood. | Use Scenario: Storing dynamic UI assets and touch-screen frame buffers in factory HMIs. IC Role / Device Role / Timing Role: PSRAM replacing SRAM for cost-effective, high-bandwidth off-chip memory. Use Value: 35 ns tACC and configurable bursts reduce CPU wait states; Hybrid Sleep mode cuts idle power by >95% vs. standard PSRAM. |
| Edge AI Inference Accelerator | Medical Imaging Preview Buffer |
Use Scenario: Temporary storage of intermediate tensors during lightweight neural network inference on microcontrollers. IC Role / Device Role / Timing Role: High-speed scratchpad memory accessed via DMA over HYPERBUS™. Use Value: DDR transfers at 200 MHz enable rapid weight/activation loading; DCARS improves timing margin for deterministic latency. | Use Scenario: Real-time buffering of ultrasound or endoscope preview frames before compression or transmission. IC Role / Device Role / Timing Role: Low-latency, high-throughput frame buffer supporting bursty video streams. Use Value: Partial refresh reduces power during static image hold; 128-byte wrapped bursts align with common pixel block sizes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PSRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY15B104QN-PSOC | 4 Mb Quad SPI FRAM; no refresh, 10⁶ write cycles, 40 MHz max clock | Lower density, serial interface, no DDR timing constraints | Select for ultra-low-power, byte-write-critical logging where bandwidth < 50 MBps suffices |
| IS66WV51216EBLL-15BLI | 8 MB async SRAM; 15 ns access, parallel x16 bus, 3.3 V only | No refresh needed, but 48-pin TSOP package and higher pin count increase PCB area and routing complexity | Select when deterministic sub-15 ns latency is mandatory and board space allows larger footprint |
Compared with CY15B104QN-PSOC and IS66WV51216EBLL-15BLI, S27KS0642GABHV023 delivers 8× higher density than FRAM and 2× higher bandwidth than async SRAM within a 24-ball FBGA, making it optimal for space-constrained, high-throughput embedded displays and AI accelerators requiring DRAM economics with SRAM-like usability.
Availability
S27KS0642GABHV023 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMIs, edge AI accelerators, and medical imaging preview systems requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S27KS0642GABHV023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
This device belongs to the HYPERRAM™ product line, designed specifically to replace parallel NOR/NAND and SRAM in bandwidth-constrained embedded systems where low pin count, DDR performance, and self-refresh simplicity are critical.
FAQ
Does S27KS0642GABHV023 require external refresh circuitry?
No. The device integrates self-refresh logic that automatically manages DRAM array refresh during idle periods. The host processor only needs to observe initial access latency and avoid excessively long bursts - no refresh commands or timing control are required, enabling true pseudo-static operation.
What is the function of the RWDS signal in read versus write operations?
In read operations, RWDS is driven by the device as a read data strobe aligned with valid DQ transitions. In write operations, RWDS is driven by the host as a write data mask - each RWDS pulse masks one byte of the 8-bit DQ bus, enabling selective byte writes without read-modify-write cycles.
Can S27KS0642GABHV023 operate with only single-ended clock (CK) instead of differential (CK/CK#)?
Yes. The device supports both modes: single-ended operation uses CK only (CK# must be tied to VSS), while differential mode uses CK/CK# for improved noise immunity. Configuration is set via Configuration Register 0; no hardware change is needed - only register initialization differs.
Is DCARS functionality enabled by default on S27KS0642GABHV023?
No. DCARS (DDR Center-Aligned Read Strobe) is an optional feature activated by setting bit [1] in Configuration Register 1. When enabled, RWDS transitions are phase-shifted relative to CK to center the strobe within the read data eye - improving setup/hold margins at maximum 200 MHz operation.
S27KS0642GABHV023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERRAM™ KS
- Package/Case:
- 24-VBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- PSRAM
- Technology:
- PSRAM (Pseudo SRAM)
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- HyperBus
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 35ns
- Access Time:
- 35 ns
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S27KS0642GABHV023 FAQ
1.How can I place an order for S27KS0642GABHV023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S27KS0642GABHV023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S27KS0642GABHV023 reliable?
The price and inventory of S27KS0642GABHV023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S27KS0642GABHV023 is usually 5 days.
3.What payment methods are accepted for S27KS0642GABHV023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S27KS0642GABHV023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S27KS0642GABHV023?
S27KS0642GABHV023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S27KS0642GABHV023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S27KS0642GABHV023?
For technical support, including S27KS0642GABHV023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S27KS0642GABHV023 requirements.
6.How does Aetrix verify that S27KS0642GABHV023 is sourced from the original manufacturer or authorized distributors?
All S27KS0642GABHV023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S27KS0642GABHV023 meets industry standards.
7.What is the process for return or replacement of S27KS0642GABHV023?
All S27KS0642GABHV023 units undergo pre-shipment inspection (PSI). If there is an issue with S27KS0642GABHV023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S27KS0642GABHV023 part is unused and in its original packaging.
Return procedure for S27KS0642GABHV023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S27KS0642GABHV023 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…

