Infineon Technologies S27KS0643GABHB020
- Part No.:
- S27KS0643GABHB020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S27KS0643GABHB020.pdf
- Description:
- IC PSRAM 64MBIT SPI/OCTAL 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,748
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Product details
Overview
S27KS0643GABHB020 from Infineon is a 64Mb self-refresh DRAM (PSRAM) with octal xSPI interface, supporting 1.8 V/3.0 V I/O, 200 MHz DDR clock, and 400 MBps data throughput. It delivers linear/wrapped burst lengths (16–128 bytes), configurable drive strength, and operates across industrial temperature range (−40°C to +85°C) in 24-ball FBGA package. Used as high-bandwidth external memory for microcontrollers in embedded vision and real-time HMI systems.
For engineers reviewing the S27KS0643GABHB020 datasheet, S27KS0643GABHB020 pinout, S27KS0643GABHB020 application, or S27KS0643GABHB020 equivalent, key selection criteria include xSPI octal timing compliance, RWDS strobe behavior during read/write, partial array refresh support, and DCARS phase-shifted read strobe capability for timing margin optimization.
Technical Context
This PSRAM integrates DRAM array with on-die refresh controller and xSPI protocol engine, eliminating host-managed refresh. Its DDR octal interface uses CK (single-ended or differential) and RWDS as bidirectional strobe-output during reads (data valid indicator), input during writes (mask signal), and offset by phase-shifted clock in DCARS mode to center transitions within the read data eye.
The device supports hybrid sleep and deep power down modes, with standby current as low as 330 µA at 2.0 V/105°C. Memory access requires command-driven transactions (16-bit opcode), with latency insertion signaled via RWDS at transaction start when internal refresh is pending-enabling deterministic timing without host intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 Mbit (8 MB), organized as 8,388,608 × 8-bit for byte-aligned access |
| Clock Rate | Up to 200 MHz DDR, enabling 400 MBps sustained throughput |
| Interface Standard | Octal xSPI compliant, 11–12 signal bus (CK/CK#, CS#, DQ[7:0], RWDS, RESET#) |
| Burst Length | Configurable: 16/32/64/128 bytes (8/16/32/64 clocks) or hybrid wrapped+linear |
| Power Modes | Hybrid Sleep (low-latency wake), Deep Power Down (12 µA @ 2.0 V/105°C) |
| Refresh Management | Self-refresh with partial array options (1/8, 1/4, 1/2) and full-array control |
| DCARS Support | Enabled: RWDS phase-shifted by second clock to align edge within read data eye |
Pinout & Package
Package: 24-ball FBGA, 5 mm × 5 mm, 0.8 mm pitch, RoHS-compliant, industrial temperature grade (−40°C to +85°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for all xSPI transactions; must be held low for entire command/address/data sequence |
| CK / CK# | Clock Input | Single-ended (CK only) or differential (CK/CK#) DDR clock; defines all data transfer edges |
| RWDS | Read-Write Data Strobe | Bidirectional: output during reads (data valid indicator), input during writes (byte mask); DCARS shifts its phase |
| DQ[7:0] | Data I/O Bus | Octal bidirectional data lines; transfers two 8-bit nibbles per CK cycle in DDR mode |
| RESET# | Hardware Reset | Asynchronous active-low reset; initializes device state and clears internal registers |
Key Features
| Feature | Design Value |
|---|---|
| Self-refresh DRAM architecture | Eliminates host refresh overhead while retaining DRAM density/cost advantage over SRAM |
| DCARS (DDR Center-Aligned Read Strobe) | Phase-shifts RWDS edge into center of read data eye, improving setup/hold margin at 200 MHz |
| Configurable burst termination | Supports wrapped bursts (cache-line aligned) and linear bursts (streaming), selectable per transaction |
| Partial array refresh | Reduces refresh current by refreshing only active memory segments (1/8 to full array) |
| Hybrid Sleep mode | Retains data with fast wake (<1 µs), lower power than active mode, higher retention than Deep Power Down |
Applications
| Automotive Instrument Clusters | Industrial HMI Panels |
|---|---|
Use Scenario: Real-time rendering of animated gauges and multi-layer UI overlays in digital dashboards. IC Role / Device Role / Timing Role: External frame buffer memory interfaced to MCU's xSPI controller, supplying pixel data at 60+ fps with deterministic latency. Use Value: 400 MBps bandwidth sustains 1280×720@60Hz RGB565 transfers; DCARS ensures reliable read strobing under EMI-prone automotive environments. | Use Scenario: Local display buffering and firmware update staging in programmable logic controllers with touch GUI. IC Role / Device Role / Timing Role: High-speed PSRAM replacing parallel NOR/NAND for faster boot and UI responsiveness, accessed via octal xSPI. Use Value: Hybrid Sleep mode enables instant UI resume after panel idle; partial refresh cuts active power by >40% during static display periods. |
| Edge AI Vision Modules | Medical Patient Monitors |
Use Scenario: Temporary storage of inference input frames and intermediate feature maps in compact vision SoM designs. IC Role / Device Role / Timing Role: Low-pin-count, high-throughput memory co-located with vision processor, minimizing PCB layer count vs. DDR3/4. Use Value: 24-ball FBGA reduces board area by 60% vs. 48-pin TSOP; configurable drive strength matches trace impedance for clean signal integrity. | Use Scenario: Buffering real-time waveform data (ECG, SpO₂) and overlay graphics prior to display rendering. IC Role / Device Role / Timing Role: Safety-critical external memory with AEC-Q100 Grade 3 qualification, supporting fail-safe data retention during power transients. Use Value: Deep Power Down mode draws only 12 µA at 2.0 V, extending battery backup runtime during AC loss events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PSRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S27KL0643GABHB020 | Same die, identical pinout and xSPI timing; differs only in ordering code branding (Infineon acquired Cypress memory business) | No functional difference; qualified identically for industrial and automotive grades | Select based on distributor stock and lead time-functionally interchangeable |
| ISSI IS66WV12816EBLL-200B3LI | Parallel 128Mbit SRAM, 200 MHz async interface; no self-refresh, no xSPI, 44-pin TSOP | Requires more MCU pins and PCB layers; lacks power modes and burst flexibility | Choose only if legacy design mandates parallel interface and SRAM timing predictability |
Compared with S27KS0643GABHB020, the Cypress variant offers zero migration risk, while the ISSI SRAM trades pin count and power efficiency for absolute timing determinism-making it suitable only where xSPI infrastructure is unavailable.
Availability
S27KS0643GABHB020 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMI panels, edge AI vision modules, and medical patient monitors requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S27KS0643GABHB020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT markets.
The HYPERRAM™ product line delivers high-density, low-pin-count PSRAM optimized for MCU-based systems needing DRAM-like capacity without complex controller logic or high power consumption.
FAQ
What is the purpose of the RWDS signal in S27KS0643GABHB020?
RWDS serves three distinct roles: (1) as an output indicating refresh latency at transaction start, (2) as a read data strobe synchronized to CK edges during reads, and (3) as a write data mask input during writes. In DCARS mode, its phase is shifted to center transitions within the read data eye, improving timing margin at 200 MHz DDR operation.
Does S27KS0643GABHB020 require external refresh commands from the host MCU?
No. The device contains integrated self-refresh logic that autonomously manages DRAM array refresh during idle cycles. Host only issues standard xSPI commands (READ/WRITE/RESET); refresh timing and scheduling are fully internal and transparent to the host interface.
How does the DCARS feature improve system reliability?
DCARS offsets the RWDS signal by a phase-shifted clock, moving its transition edge from the data bit boundary into the center of the read data eye. This increases setup and hold time margins by up to 150 ps at 200 MHz, reducing bit errors in electrically noisy environments like automotive or industrial settings.
Can S27KS0643GABHB020 operate with both 1.8 V and 3.0 V I/O supplies simultaneously?
No. VCC and VCCQ are internally tied; the device is manufactured in separate voltage-grade variants. S27KS0643GABHB020 is specified for 1.8 V nominal operation (VCC/VCCQ = 1.7–1.95 V). A 3.0 V variant exists under different part number (e.g., S27KS0643GABHB030) with distinct electrical characteristics.
S27KS0643GABHB020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERRAM™ KS
- Package/Case:
- 24-VBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- PSRAM
- Technology:
- PSRAM (Pseudo SRAM)
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- SPI - Octal I/O
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 35ns
- Access Time:
- 35 ns
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S27KS0643GABHB020 FAQ
1.How can I place an order for S27KS0643GABHB020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S27KS0643GABHB020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S27KS0643GABHB020 reliable?
The price and inventory of S27KS0643GABHB020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S27KS0643GABHB020 is usually 5 days.
3.What payment methods are accepted for S27KS0643GABHB020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S27KS0643GABHB020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S27KS0643GABHB020?
S27KS0643GABHB020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S27KS0643GABHB020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S27KS0643GABHB020?
For technical support, including S27KS0643GABHB020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S27KS0643GABHB020 requirements.
6.How does Aetrix verify that S27KS0643GABHB020 is sourced from the original manufacturer or authorized distributors?
All S27KS0643GABHB020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S27KS0643GABHB020 meets industry standards.
7.What is the process for return or replacement of S27KS0643GABHB020?
All S27KS0643GABHB020 units undergo pre-shipment inspection (PSI). If there is an issue with S27KS0643GABHB020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S27KS0643GABHB020 part is unused and in its original packaging.
Return procedure for S27KS0643GABHB020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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