Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies S27KS0643GABHB020

Part No.:
S27KS0643GABHB020
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS27KS0643GABHB020.pdf
Description:
IC PSRAM 64MBIT SPI/OCTAL 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,748

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

S27KS0643GABHB020 from Infineon is a 64Mb self-refresh DRAM (PSRAM) with octal xSPI interface, supporting 1.8 V/3.0 V I/O, 200 MHz DDR clock, and 400 MBps data throughput. It delivers linear/wrapped burst lengths (16–128 bytes), configurable drive strength, and operates across industrial temperature range (−40°C to +85°C) in 24-ball FBGA package. Used as high-bandwidth external memory for microcontrollers in embedded vision and real-time HMI systems.

For engineers reviewing the S27KS0643GABHB020 datasheet, S27KS0643GABHB020 pinout, S27KS0643GABHB020 application, or S27KS0643GABHB020 equivalent, key selection criteria include xSPI octal timing compliance, RWDS strobe behavior during read/write, partial array refresh support, and DCARS phase-shifted read strobe capability for timing margin optimization.

Technical Context

This PSRAM integrates DRAM array with on-die refresh controller and xSPI protocol engine, eliminating host-managed refresh. Its DDR octal interface uses CK (single-ended or differential) and RWDS as bidirectional strobe-output during reads (data valid indicator), input during writes (mask signal), and offset by phase-shifted clock in DCARS mode to center transitions within the read data eye.

The device supports hybrid sleep and deep power down modes, with standby current as low as 330 µA at 2.0 V/105°C. Memory access requires command-driven transactions (16-bit opcode), with latency insertion signaled via RWDS at transaction start when internal refresh is pending-enabling deterministic timing without host intervention.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density64 Mbit (8 MB), organized as 8,388,608 × 8-bit for byte-aligned access
Clock RateUp to 200 MHz DDR, enabling 400 MBps sustained throughput
Interface StandardOctal xSPI compliant, 11–12 signal bus (CK/CK#, CS#, DQ[7:0], RWDS, RESET#)
Burst LengthConfigurable: 16/32/64/128 bytes (8/16/32/64 clocks) or hybrid wrapped+linear
Power ModesHybrid Sleep (low-latency wake), Deep Power Down (12 µA @ 2.0 V/105°C)
Refresh ManagementSelf-refresh with partial array options (1/8, 1/4, 1/2) and full-array control
DCARS SupportEnabled: RWDS phase-shifted by second clock to align edge within read data eye

Pinout & Package

Package: 24-ball FBGA, 5 mm × 5 mm, 0.8 mm pitch, RoHS-compliant, industrial temperature grade (−40°C to +85°C).

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip SelectActive-low enable for all xSPI transactions; must be held low for entire command/address/data sequence
CK / CK#Clock InputSingle-ended (CK only) or differential (CK/CK#) DDR clock; defines all data transfer edges
RWDSRead-Write Data StrobeBidirectional: output during reads (data valid indicator), input during writes (byte mask); DCARS shifts its phase
DQ[7:0]Data I/O BusOctal bidirectional data lines; transfers two 8-bit nibbles per CK cycle in DDR mode
RESET#Hardware ResetAsynchronous active-low reset; initializes device state and clears internal registers

Key Features

FeatureDesign Value
Self-refresh DRAM architectureEliminates host refresh overhead while retaining DRAM density/cost advantage over SRAM
DCARS (DDR Center-Aligned Read Strobe)Phase-shifts RWDS edge into center of read data eye, improving setup/hold margin at 200 MHz
Configurable burst terminationSupports wrapped bursts (cache-line aligned) and linear bursts (streaming), selectable per transaction
Partial array refreshReduces refresh current by refreshing only active memory segments (1/8 to full array)
Hybrid Sleep modeRetains data with fast wake (<1 µs), lower power than active mode, higher retention than Deep Power Down

Applications

Automotive Instrument ClustersIndustrial HMI Panels

Use Scenario: Real-time rendering of animated gauges and multi-layer UI overlays in digital dashboards.

IC Role / Device Role / Timing Role: External frame buffer memory interfaced to MCU's xSPI controller, supplying pixel data at 60+ fps with deterministic latency.

Use Value: 400 MBps bandwidth sustains 1280×720@60Hz RGB565 transfers; DCARS ensures reliable read strobing under EMI-prone automotive environments.

Use Scenario: Local display buffering and firmware update staging in programmable logic controllers with touch GUI.

IC Role / Device Role / Timing Role: High-speed PSRAM replacing parallel NOR/NAND for faster boot and UI responsiveness, accessed via octal xSPI.

Use Value: Hybrid Sleep mode enables instant UI resume after panel idle; partial refresh cuts active power by >40% during static display periods.

Edge AI Vision ModulesMedical Patient Monitors

Use Scenario: Temporary storage of inference input frames and intermediate feature maps in compact vision SoM designs.

IC Role / Device Role / Timing Role: Low-pin-count, high-throughput memory co-located with vision processor, minimizing PCB layer count vs. DDR3/4.

Use Value: 24-ball FBGA reduces board area by 60% vs. 48-pin TSOP; configurable drive strength matches trace impedance for clean signal integrity.

Use Scenario: Buffering real-time waveform data (ECG, SpO₂) and overlay graphics prior to display rendering.

IC Role / Device Role / Timing Role: Safety-critical external memory with AEC-Q100 Grade 3 qualification, supporting fail-safe data retention during power transients.

Use Value: Deep Power Down mode draws only 12 µA at 2.0 V, extending battery backup runtime during AC loss events.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PSRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S27KL0643GABHB020Same die, identical pinout and xSPI timing; differs only in ordering code branding (Infineon acquired Cypress memory business)No functional difference; qualified identically for industrial and automotive gradesSelect based on distributor stock and lead time-functionally interchangeable
ISSI IS66WV12816EBLL-200B3LIParallel 128Mbit SRAM, 200 MHz async interface; no self-refresh, no xSPI, 44-pin TSOPRequires more MCU pins and PCB layers; lacks power modes and burst flexibilityChoose only if legacy design mandates parallel interface and SRAM timing predictability

Compared with S27KS0643GABHB020, the Cypress variant offers zero migration risk, while the ISSI SRAM trades pin count and power efficiency for absolute timing determinism-making it suitable only where xSPI infrastructure is unavailable.

Availability

S27KS0643GABHB020 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMI panels, edge AI vision modules, and medical patient monitors requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S27KS0643GABHB020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT markets.

The HYPERRAM™ product line delivers high-density, low-pin-count PSRAM optimized for MCU-based systems needing DRAM-like capacity without complex controller logic or high power consumption.

FAQ

What is the purpose of the RWDS signal in S27KS0643GABHB020?

RWDS serves three distinct roles: (1) as an output indicating refresh latency at transaction start, (2) as a read data strobe synchronized to CK edges during reads, and (3) as a write data mask input during writes. In DCARS mode, its phase is shifted to center transitions within the read data eye, improving timing margin at 200 MHz DDR operation.

Does S27KS0643GABHB020 require external refresh commands from the host MCU?

No. The device contains integrated self-refresh logic that autonomously manages DRAM array refresh during idle cycles. Host only issues standard xSPI commands (READ/WRITE/RESET); refresh timing and scheduling are fully internal and transparent to the host interface.

How does the DCARS feature improve system reliability?

DCARS offsets the RWDS signal by a phase-shifted clock, moving its transition edge from the data bit boundary into the center of the read data eye. This increases setup and hold time margins by up to 150 ps at 200 MHz, reducing bit errors in electrically noisy environments like automotive or industrial settings.

Can S27KS0643GABHB020 operate with both 1.8 V and 3.0 V I/O supplies simultaneously?

No. VCC and VCCQ are internally tied; the device is manufactured in separate voltage-grade variants. S27KS0643GABHB020 is specified for 1.8 V nominal operation (VCC/VCCQ = 1.7–1.95 V). A 3.0 V variant exists under different part number (e.g., S27KS0643GABHB030) with distinct electrical characteristics.

S27KS0643GABHB020 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERRAM™ KS
Package/Case:
24-VBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
PSRAM
Technology:
PSRAM (Pseudo SRAM)
Memory Size:
64Mbit
Memory Organization:
8M x 8
Memory Interface:
SPI - Octal I/O
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
35ns
Access Time:
35 ns
Voltage - Supply:
1.7V ~ 2V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S27KS0643GABHB020 FAQ

1.How can I place an order for S27KS0643GABHB020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S27KS0643GABHB020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S27KS0643GABHB020 reliable?

The price and inventory of S27KS0643GABHB020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S27KS0643GABHB020 is usually 5 days.

3.What payment methods are accepted for S27KS0643GABHB020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S27KS0643GABHB020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S27KS0643GABHB020?

S27KS0643GABHB020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S27KS0643GABHB020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S27KS0643GABHB020?

For technical support, including S27KS0643GABHB020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S27KS0643GABHB020 requirements.

6.How does Aetrix verify that S27KS0643GABHB020 is sourced from the original manufacturer or authorized distributors?

All S27KS0643GABHB020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S27KS0643GABHB020 meets industry standards.

7.What is the process for return or replacement of S27KS0643GABHB020?

All S27KS0643GABHB020 units undergo pre-shipment inspection (PSI). If there is an issue with S27KS0643GABHB020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S27KS0643GABHB020 part is unused and in its original packaging.

Return procedure for S27KS0643GABHB020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S27KS0643GABHB020 Tags

  • S27KS0643GABHB020
  • S27KS0643GABHB020 PDF
  • S27KS0643GABHB020 Datasheet
  • S27KS0643GABHB020 Specifications
  • S27KS0643GABHB020 Images
  • Infineon Technologies
  • Infineon Technologies S27KS0643GABHB020
  • Buy S27KS0643GABHB020
  • S27KS0643GABHB020 Price
  • S27KS0643GABHB020 Distributor
  • S27KS0643GABHB020 Supplier
  • S27KS0643GABHB020 Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER