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Infineon Technologies S27KS0643GABHI023
- Part No.:
- S27KS0643GABHI023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S27KS0643GABHI023.pdf
- Description:
- IC PSRAM 64MBIT SPI/OCTAL 24FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,941
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Product details
Overview
S27KS0643GABHI023 from Infineon Technologies is a 64Mb self-refresh DRAM (PSRAM) with octal xSPI interface, supporting 1.8 V/3.0 V I/O, 200 MHz DDR clocking, and 400 MBps data throughput. It operates in industrial temperature range (–40°C to +85°C), uses 24-ball FBGA packaging, and delivers linear/wrapped burst lengths up to 128 bytes for high-bandwidth memory expansion in microcontroller-based systems.
For engineers reviewing the S27KS0643GABHI023 datasheet, S27KS0643GABHI023 pinout, S27KS0643GABHI023 application, or S27KS0643GABHI023 equivalent, this device serves as a drop-in PSRAM replacement for legacy SRAMs where low pin count, high bandwidth, and autonomous refresh are required - especially in automotive instrument clusters, industrial HMI displays, and edge AI inference accelerators.
Technical Context
The S27KS0643GABHI023 implements an octal xSPI interface with DDR signaling on DQ[7:0], using CK (single-ended) or CK/CK# (differential) for timing. RWDS functions bidirectionally as read data strobe and write data mask, with optional DCARS mode enabling phase-shifted strobe alignment for improved read eye margin at 200 MHz.
Internal refresh logic manages partial (1/8, 1/4, 1/2) or full array refresh autonomously; host only enforces transaction length limits (≤128-byte bursts) to guarantee refresh windows. Configuration registers control burst type, drive strength, and power modes including Hybrid Sleep and Deep Power Down (12 µA at 2.0 V).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 64 Mbit (8 MB), organized as 8,388,608 × 8-bit for byte-aligned access |
| Clock rate | Up to 200 MHz DDR - enables 400 MBps sustained throughput with dual-edge sampling |
| Burst length | Configurable: 16/32/64/128 bytes (8/16/32/64 clocks) - supports cache-line matching and DMA efficiency |
| Power modes | Deep Power Down (12 µA @ 2.0 V), Hybrid Sleep - reduces idle power without host refresh management |
| Timing latency | tACC ≤ 35 ns - defines minimum CS# assertion-to-first-valid-data window for deterministic initialization |
| Supply voltage | VCC/VCCQ = 1.8 V ±0.15 V or 3.0 V ±0.3 V - dual-voltage support simplifies integration with mixed-supply SoCs |
| Operating temp | –40°C to +85°C (Industrial grade) - validated for extended thermal cycling in enclosed enclosures |
Pinout & Package
24-ball FBGA (5 mm × 5 mm, 0.8 mm pitch), RoHS-compliant, with 11 primary signals in single-ended clock configuration or 12 signals with differential CK/CK# option.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select (active-low) | Asserts transaction boundary; deassertion triggers internal refresh arbitration and bus release |
| CK / CK# | Clock input (single/diff) | DDR timing reference; CK# enables jitter-immune sampling when used differentially |
| RWDS | Bidirectional strobe | Output during reads (data valid indicator); input during writes (byte mask for DQ[7:0]) |
| DQ[7:0] | Octal data I/O | DDR data path carrying two 8-bit nibbles per CK cycle - enables 8-bit parallelism with SPI-like pin count |
| RESET# | Hardware reset | Asynchronous active-low signal forcing device into known state and clearing internal configuration registers |
Key Features
| Feature | Design Value |
|---|---|
| Self-refresh DRAM core | Eliminates external refresh controller overhead - appears as static RAM to host firmware and drivers |
| Octal xSPI interface | Replaces 16–32-pin parallel SRAM interfaces with 11–12 pins while doubling bandwidth via DDR |
| DCARS mode | Phase-shifts RWDS by ½ CK to center strobe transitions within read data eye - improves timing margin at max speed |
| Configurable drive strength | Adjustable output impedance on DQ/RWDS pins - optimizes signal integrity across varying PCB trace lengths and loads |
| Hybrid Sleep mode | Retains memory contents while reducing current to <100 µA - ideal for intermittent UI update workloads |
Applications
| Automotive Instrument Cluster | Industrial HMI Display Buffer |
|---|---|
Use Scenario: Real-time rendering of gauges, alerts, and navigation overlays on TFT-LCD panels with 60 Hz refresh. IC Role / Device Role / Timing Role: Frame buffer memory interfaced to MCU's xSPI controller; provides low-latency, burst-access storage for pixel data. Use Value: 400 MBps throughput sustains 1024×600@32bpp at >90% bus utilization without frame tearing or FIFO underrun. |
Use Scenario: Local caching of GUI assets (icons, fonts, bitmaps) in programmable logic controllers with limited external memory bandwidth. IC Role / Device Role / Timing Role: Offload from internal MCU SRAM; acts as expandable, low-pin-count memory mapped via xSPI address space. Use Value: 64Mb capacity stores >1200 icons at 4KB each; wrapped burst mode aligns with typical asset fetch patterns. |
| Edge AI Inference Accelerator | Smart Camera Image Preprocessing |
Use Scenario: Temporary storage of intermediate tensors during CNN layer execution on RISC-V-based vision SoC. IC Role / Device Role / Timing Role: High-bandwidth scratchpad memory accessed via DMA engine; synchronized to xSPI clock domain. Use Value: Linear 128-byte bursts match typical weight matrix tile sizes; DCARS ensures reliable read capture at 200 MHz. |
Use Scenario: Line-buffering and histogram accumulation for real-time auto-exposure and white balance algorithms. IC Role / Device Role / Timing Role: Dual-port-capable memory region accessed concurrently by ISP pipeline and CPU for metadata exchange. Use Value: Partial array refresh allows background histogram updates while video stream continues uninterrupted. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PSRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S27KL0643GABHI020 | Same die, identical xSPI register map and timing, but rated for Industrial Plus (–40°C to +105°C) | Required for under-hood automotive modules exceeding 85°C ambient | Select when extended temperature operation is mandated; otherwise pin- and firmware-compatible |
| Winbond W958D8MBYA | 8-bit QSPI PSRAM, 200 MHz max, but lacks DCARS and RWDS-based write masking | Supports basic burst reads/writes but requires host-side timing compensation for strobe skew | Choose for cost-sensitive designs where advanced strobe alignment is unnecessary |
Compared with S27KL0643GABHI020, the S27KS0643GABHI023 trades extended temperature rating for lower qualification cost; versus W958D8MBYA, it adds RWDS-driven write masking and DCARS for deterministic high-speed timing - critical in real-time display and AI buffering.
Availability
S27KS0643GABHI023 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMIs, and edge AI accelerators requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-compliant memory solutions.
Supply support for S27KS0643GABHI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and wafer fabrication infrastructure.
This part belongs to the HYPERRAM™ family - designed specifically to replace parallel SRAM in bandwidth-constrained, pin-limited embedded systems while maintaining ease of firmware integration and low system-level power.
FAQ
Does S27KS0643GABHI023 require external refresh circuitry?
No. The device integrates autonomous self-refresh logic that manages DRAM array refresh without host intervention. The host only needs to limit burst length (≤128 bytes) and allow initial access latency when signaled via RWDS - making it functionally equivalent to static RAM in software.
What is the role of RWDS in write transactions?
During writes, RWDS operates as an input serving as byte-wise write mask for DQ[7:0]. Each rising edge samples one mask bit, allowing selective updating of individual bytes within an 8-bit transfer - essential for efficient partial register or structure updates without read-modify-write cycles.
Can S27KS0643GABHI023 operate with only single-ended clock (CK)?
Yes. The device supports both single-ended (CK only, 11-signal mode) and differential (CK/CK#, 12-signal mode) clocking. Single-ended mode simplifies layout and reduces routing complexity, while differential mode improves noise immunity in electrically noisy environments like automotive cabins.
How does Deep Power Down mode affect memory retention?
In Deep Power Down mode (entered via xSPI command), the device retains all stored data but disables internal clocks and refresh logic. Retention time is guaranteed for ≥24 hours at +105°C and indefinitely at room temperature - sufficient for battery-backed or short-interval sleep states in portable equipment.
S27KS0643GABHI023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERRAM™ KS
- Package/Case:
- 24-VBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- PSRAM
- Technology:
- PSRAM (Pseudo SRAM)
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- SPI - Octal I/O
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 35ns
- Access Time:
- 35 ns
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S27KS0643GABHI023 FAQ
1.How can I place an order for S27KS0643GABHI023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S27KS0643GABHI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S27KS0643GABHI023 reliable?
The price and inventory of S27KS0643GABHI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S27KS0643GABHI023 is usually 5 days.
3.What payment methods are accepted for S27KS0643GABHI023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S27KS0643GABHI023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S27KS0643GABHI023?
S27KS0643GABHI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S27KS0643GABHI023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S27KS0643GABHI023?
For technical support, including S27KS0643GABHI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S27KS0643GABHI023 requirements.
6.How does Aetrix verify that S27KS0643GABHI023 is sourced from the original manufacturer or authorized distributors?
All S27KS0643GABHI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S27KS0643GABHI023 meets industry standards.
7.What is the process for return or replacement of S27KS0643GABHI023?
All S27KS0643GABHI023 units undergo pre-shipment inspection (PSI). If there is an issue with S27KS0643GABHI023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S27KS0643GABHI023 part is unused and in its original packaging.
Return procedure for S27KS0643GABHI023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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