Infineon Technologies S27KS0643GABHV020
- Part No.:
- S27KS0643GABHV020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S27KS0643GABHV020.pdf
- Description:
- IC PSRAM 64MBIT SPI/OCTAL 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:110
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Product details
Overview
S27KS0643GABHV020 from Infineon is a 64Mb self-refresh DRAM (PSRAM) with octal xSPI interface, supporting 1.8 V/3.0 V I/O, 200 MHz DDR clock, and 400 MBps data throughput. It delivers pseudo-static operation via on-die refresh control, uses 24-ball FBGA (5 × 5 mm), and targets high-bandwidth embedded memory expansion in automotive infotainment and industrial HMI systems.
For engineers reviewing the S27KS0643GABHV020 datasheet, S27KS0643GABHV020 pinout, S27KS0643GABHV020 application, or S27KS0643GABHV020 equivalent, key selection criteria include xSPI command compatibility, RWDS timing alignment for DDR read strobe, configurable burst lengths (16–128 bytes), hybrid sleep power mode, and AEC-Q100 Grade 2 qualification (-40°C to +105°C).
Technical Context
The device implements an octal xSPI interface with 12-signal bus (CK/CK#, CS#, DQ[7:0], RWDS, RESET#) and supports both single-ended and differential clocking. Its internal DRAM array uses 38-nm process technology and performs autonomous partial or full refresh without host intervention.
Read transactions use bidirectional RWDS as read data strobe (center-aligned with DCARS option) or write mask; latency is indicated at transaction start. Burst configurations include linear, wrapped (8/16/32/64 clocks), and hybrid modes - all configurable via mode registers accessible over xSPI.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 Mbit (8 MB) pseudo-static RAM with self-refresh capability |
| Interface | Octal xSPI DDR - 8-bit DQ bus, dual-edge clocking, 16-bit command structure |
| Max Clock Rate | 200 MHz at 1.8 V or 3.0 V - enables 400 MBps peak bandwidth |
| Burst Length | Configurable: 16/32/64/128 bytes (8/16/32/64 clocks) or hybrid mode |
| Power Modes | Hybrid Sleep (low-latency wake) and Deep Power Down (12 µA @ 2.0 V) |
| Operating Temp | Industrial Plus (–40°C to +105°C) - qualified per AEC-Q100 Grade 2 |
| Package | 24-ball FBGA, 5 mm × 5 mm, 0.8 mm pitch - compatible with standard SMT reflow |
Pinout & Package
24-ball FBGA (5 × 5 mm, 0.8 mm pitch) with ball grid arranged in 5×5 array excluding corner balls. Pin functions defined per Infineon datasheet Rev. *E, page 51–52.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for xSPI transaction initiation and termination |
| CK / CK# | Clock Input | Differential clock pair for DDR timing; optional single-ended CK only mode |
| RWDS | Read/Write Data Strobe | Bidirectional: output as read strobe (DCARS-aligned), input as write mask |
| DQ[7:0] | Data I/O | Octal bidirectional data bus - transfers two bytes per clock cycle in DDR mode |
| RESET# | Hardware Reset | Asynchronous active-low reset that clears internal state and restarts initialization |
Key Features
| Feature | Design Value |
|---|---|
| Self-refresh DRAM core | Eliminates external refresh controller; appears as SRAM to host processor |
| DCARS-enabled RWDS | Phase-shifted RWDS edge placement improves timing margin in high-speed read windows |
| Configurable drive strength | Adjustable DQ/RWDS output drive reduces signal integrity risk across varied PCB trace lengths |
| Partial array refresh | Reduces refresh current by refreshing only active memory segments during low-activity periods |
| AEC-Q100 Grade 2 | Validated for automotive under-hood applications requiring –40°C to +105°C operation |
Applications
| Automotive Infotainment Head Unit | Industrial HMI Display Controller |
|---|---|
Use Scenario: High-resolution GUI rendering with frame buffer expansion beyond MCU internal RAM. IC Role / Device Role / Timing Role: PSRAM acting as off-chip frame buffer; xSPI interface synchronizes pixel data bursts with display controller timing. Use Value: 400 MBps bandwidth sustains 1080p@60Hz RGB888 transfers; hybrid sleep mode cuts idle power by >95% vs. standard DRAM. | Use Scenario: Real-time multi-layer UI composition in factory HMIs with touch response <15 ms. IC Role / Device Role / Timing Role: Memory extension for ARM Cortex-A MPU running Linux-based graphics stack; RWDS-strobed reads ensure deterministic latency. Use Value: Configurable 32-byte wrapped bursts match typical GUI tile sizes; DCARS alignment maintains setup/hold margins at 200 MHz. |
| Medical Imaging Edge Processor | ADAS Camera Preprocessing Module |
Use Scenario: Buffering uncompressed ultrasound scan lines before FPGA-based beamforming. IC Role / Device Role / Timing Role: High-throughput streaming buffer interfaced to FPGA xSPI master; partial refresh minimizes background current during acquisition. Use Value: 128-byte linear bursts align with scan-line width; deep power down (12 µA) extends battery life during standby intervals. | Use Scenario: Temporary storage of raw Bayer data from 4-MP automotive camera sensor before ISP processing. IC Role / Device Role / Timing Role: Low-latency memory sink for MIPI CSI-2 bridge IC; AEC-Q100 Grade 2 ensures reliability in vehicle cabin environment. Use Value: 105°C rating supports operation near HVAC ducts; 35 ns tACC enables sub-200 ns read turnaround for real-time pipeline buffering. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PSRAM memory expansion applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S27KL0643GABHV020 | Same die, identical pinout and xSPI command set; differs only in ordering code branding | No functional difference; legacy Cypress part now manufactured and supported by Infineon | Select when sourcing from legacy Cypress-designated inventory or cross-referenced BOMs |
| ISSI IS66WV12816EBLL-150B3LI | Parallel SRAM interface (48-pin TSOP), 128Mbit, 15 ns access, no self-refresh | Requires dedicated parallel bus and external refresh management; higher pin count and board area | Choose only if system lacks xSPI master or requires true asynchronous SRAM timing behavior |
Compared with S27KS0643GABHV020, the Cypress-branded variant offers identical functionality and drop-in compatibility, while the ISSI SRAM demands significant interface redesign and adds refresh overhead - making the Infineon HYPERRAM optimal for xSPI-capable SoCs needing compact, low-power memory expansion.
Availability
S27KS0643GABHV020 is available at Aetrix Electronics and suitable for automotive infotainment head units, industrial HMI display controllers, and medical edge imaging processors requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S27KS0643GABHV020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-performance memory solutions.
This device belongs to the HYPERRAM™ family - designed specifically to replace parallel SRAM and low-density DDR in bandwidth-constrained embedded systems using minimal pins and simplified controller logic.
FAQ
What voltage supplies does S27KS0643GABHV020 require?
The device operates with separate VCC (core array) and VCCQ (I/O buffer) supplies, each configurable for 1.8 V or 3.0 V nominal. Both must be within ±5% tolerance and powered simultaneously. The specific voltage combination is fixed per ordering part number - this variant supports 1.8 V VCC/VCCQ as indicated by the 'G' suffix in the OPN.
Does S27KS0643GABHV020 require external refresh commands from the host?
No. The device contains fully autonomous refresh logic that executes partial or full array refreshes internally without host involvement. The host only issues standard xSPI commands (READ/WRITE/REGISTER ACCESS); refresh timing and scheduling are managed entirely on-die.
How is RWDS used during write operations?
During write transactions, RWDS functions as a write data mask: each rising edge samples one bit of mask data on DQ[0], enabling byte-level write masking. This allows selective updating of portions of a burst without reading-modify-write cycles, reducing bus traffic and power consumption.
Can S27KS0643GABHV020 operate with a single-ended clock only?
Yes. The device supports both single-ended (CK only) and differential (CK/CK#) clocking modes. When using single-ended mode, CK# must be tied to VSS or VCC per datasheet guidance (Section 3.1), and the internal receiver automatically configures for single-ended operation upon power-up.
S27KS0643GABHV020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERRAM™ KS
- Package/Case:
- 24-VBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- PSRAM
- Technology:
- PSRAM (Pseudo SRAM)
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- SPI - Octal I/O
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 35ns
- Access Time:
- 35 ns
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S27KS0643GABHV020 FAQ
1.How can I place an order for S27KS0643GABHV020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S27KS0643GABHV020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S27KS0643GABHV020 reliable?
The price and inventory of S27KS0643GABHV020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S27KS0643GABHV020 is usually 5 days.
3.What payment methods are accepted for S27KS0643GABHV020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S27KS0643GABHV020 transactions.
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4.How is shipping managed for S27KS0643GABHV020?
S27KS0643GABHV020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S27KS0643GABHV020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S27KS0643GABHV020?
For technical support, including S27KS0643GABHV020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S27KS0643GABHV020 requirements.
6.How does Aetrix verify that S27KS0643GABHV020 is sourced from the original manufacturer or authorized distributors?
All S27KS0643GABHV020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S27KS0643GABHV020 meets industry standards.
7.What is the process for return or replacement of S27KS0643GABHV020?
All S27KS0643GABHV020 units undergo pre-shipment inspection (PSI). If there is an issue with S27KS0643GABHV020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S27KS0643GABHV020 part is unused and in its original packaging.
Return procedure for S27KS0643GABHV020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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