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Infineon Technologies S27KS0643GABHV020

Part No.:
S27KS0643GABHV020
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS27KS0643GABHV020.pdf
Description:
IC PSRAM 64MBIT SPI/OCTAL 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:110

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Product details

Overview

S27KS0643GABHV020 from Infineon is a 64Mb self-refresh DRAM (PSRAM) with octal xSPI interface, supporting 1.8 V/3.0 V I/O, 200 MHz DDR clock, and 400 MBps data throughput. It delivers pseudo-static operation via on-die refresh control, uses 24-ball FBGA (5 × 5 mm), and targets high-bandwidth embedded memory expansion in automotive infotainment and industrial HMI systems.

For engineers reviewing the S27KS0643GABHV020 datasheet, S27KS0643GABHV020 pinout, S27KS0643GABHV020 application, or S27KS0643GABHV020 equivalent, key selection criteria include xSPI command compatibility, RWDS timing alignment for DDR read strobe, configurable burst lengths (16–128 bytes), hybrid sleep power mode, and AEC-Q100 Grade 2 qualification (-40°C to +105°C).

Technical Context

The device implements an octal xSPI interface with 12-signal bus (CK/CK#, CS#, DQ[7:0], RWDS, RESET#) and supports both single-ended and differential clocking. Its internal DRAM array uses 38-nm process technology and performs autonomous partial or full refresh without host intervention.

Read transactions use bidirectional RWDS as read data strobe (center-aligned with DCARS option) or write mask; latency is indicated at transaction start. Burst configurations include linear, wrapped (8/16/32/64 clocks), and hybrid modes - all configurable via mode registers accessible over xSPI.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density64 Mbit (8 MB) pseudo-static RAM with self-refresh capability
InterfaceOctal xSPI DDR - 8-bit DQ bus, dual-edge clocking, 16-bit command structure
Max Clock Rate200 MHz at 1.8 V or 3.0 V - enables 400 MBps peak bandwidth
Burst LengthConfigurable: 16/32/64/128 bytes (8/16/32/64 clocks) or hybrid mode
Power ModesHybrid Sleep (low-latency wake) and Deep Power Down (12 µA @ 2.0 V)
Operating TempIndustrial Plus (–40°C to +105°C) - qualified per AEC-Q100 Grade 2
Package24-ball FBGA, 5 mm × 5 mm, 0.8 mm pitch - compatible with standard SMT reflow

Pinout & Package

24-ball FBGA (5 × 5 mm, 0.8 mm pitch) with ball grid arranged in 5×5 array excluding corner balls. Pin functions defined per Infineon datasheet Rev. *E, page 51–52.

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip SelectActive-low enable for xSPI transaction initiation and termination
CK / CK#Clock InputDifferential clock pair for DDR timing; optional single-ended CK only mode
RWDSRead/Write Data StrobeBidirectional: output as read strobe (DCARS-aligned), input as write mask
DQ[7:0]Data I/OOctal bidirectional data bus - transfers two bytes per clock cycle in DDR mode
RESET#Hardware ResetAsynchronous active-low reset that clears internal state and restarts initialization

Key Features

FeatureDesign Value
Self-refresh DRAM coreEliminates external refresh controller; appears as SRAM to host processor
DCARS-enabled RWDSPhase-shifted RWDS edge placement improves timing margin in high-speed read windows
Configurable drive strengthAdjustable DQ/RWDS output drive reduces signal integrity risk across varied PCB trace lengths
Partial array refreshReduces refresh current by refreshing only active memory segments during low-activity periods
AEC-Q100 Grade 2Validated for automotive under-hood applications requiring –40°C to +105°C operation

Applications

Automotive Infotainment Head UnitIndustrial HMI Display Controller

Use Scenario: High-resolution GUI rendering with frame buffer expansion beyond MCU internal RAM.

IC Role / Device Role / Timing Role: PSRAM acting as off-chip frame buffer; xSPI interface synchronizes pixel data bursts with display controller timing.

Use Value: 400 MBps bandwidth sustains 1080p@60Hz RGB888 transfers; hybrid sleep mode cuts idle power by >95% vs. standard DRAM.

Use Scenario: Real-time multi-layer UI composition in factory HMIs with touch response <15 ms.

IC Role / Device Role / Timing Role: Memory extension for ARM Cortex-A MPU running Linux-based graphics stack; RWDS-strobed reads ensure deterministic latency.

Use Value: Configurable 32-byte wrapped bursts match typical GUI tile sizes; DCARS alignment maintains setup/hold margins at 200 MHz.

Medical Imaging Edge ProcessorADAS Camera Preprocessing Module

Use Scenario: Buffering uncompressed ultrasound scan lines before FPGA-based beamforming.

IC Role / Device Role / Timing Role: High-throughput streaming buffer interfaced to FPGA xSPI master; partial refresh minimizes background current during acquisition.

Use Value: 128-byte linear bursts align with scan-line width; deep power down (12 µA) extends battery life during standby intervals.

Use Scenario: Temporary storage of raw Bayer data from 4-MP automotive camera sensor before ISP processing.

IC Role / Device Role / Timing Role: Low-latency memory sink for MIPI CSI-2 bridge IC; AEC-Q100 Grade 2 ensures reliability in vehicle cabin environment.

Use Value: 105°C rating supports operation near HVAC ducts; 35 ns tACC enables sub-200 ns read turnaround for real-time pipeline buffering.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PSRAM memory expansion applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S27KL0643GABHV020Same die, identical pinout and xSPI command set; differs only in ordering code brandingNo functional difference; legacy Cypress part now manufactured and supported by InfineonSelect when sourcing from legacy Cypress-designated inventory or cross-referenced BOMs
ISSI IS66WV12816EBLL-150B3LIParallel SRAM interface (48-pin TSOP), 128Mbit, 15 ns access, no self-refreshRequires dedicated parallel bus and external refresh management; higher pin count and board areaChoose only if system lacks xSPI master or requires true asynchronous SRAM timing behavior

Compared with S27KS0643GABHV020, the Cypress-branded variant offers identical functionality and drop-in compatibility, while the ISSI SRAM demands significant interface redesign and adds refresh overhead - making the Infineon HYPERRAM optimal for xSPI-capable SoCs needing compact, low-power memory expansion.

Availability

S27KS0643GABHV020 is available at Aetrix Electronics and suitable for automotive infotainment head units, industrial HMI display controllers, and medical edge imaging processors requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S27KS0643GABHV020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-performance memory solutions.

This device belongs to the HYPERRAM™ family - designed specifically to replace parallel SRAM and low-density DDR in bandwidth-constrained embedded systems using minimal pins and simplified controller logic.

FAQ

What voltage supplies does S27KS0643GABHV020 require?

The device operates with separate VCC (core array) and VCCQ (I/O buffer) supplies, each configurable for 1.8 V or 3.0 V nominal. Both must be within ±5% tolerance and powered simultaneously. The specific voltage combination is fixed per ordering part number - this variant supports 1.8 V VCC/VCCQ as indicated by the 'G' suffix in the OPN.

Does S27KS0643GABHV020 require external refresh commands from the host?

No. The device contains fully autonomous refresh logic that executes partial or full array refreshes internally without host involvement. The host only issues standard xSPI commands (READ/WRITE/REGISTER ACCESS); refresh timing and scheduling are managed entirely on-die.

How is RWDS used during write operations?

During write transactions, RWDS functions as a write data mask: each rising edge samples one bit of mask data on DQ[0], enabling byte-level write masking. This allows selective updating of portions of a burst without reading-modify-write cycles, reducing bus traffic and power consumption.

Can S27KS0643GABHV020 operate with a single-ended clock only?

Yes. The device supports both single-ended (CK only) and differential (CK/CK#) clocking modes. When using single-ended mode, CK# must be tied to VSS or VCC per datasheet guidance (Section 3.1), and the internal receiver automatically configures for single-ended operation upon power-up.

S27KS0643GABHV020 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HYPERRAM™ KS
Package/Case:
24-VBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
PSRAM
Technology:
PSRAM (Pseudo SRAM)
Memory Size:
64Mbit
Memory Organization:
8M x 8
Memory Interface:
SPI - Octal I/O
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
35ns
Access Time:
35 ns
Voltage - Supply:
1.7V ~ 2V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S27KS0643GABHV020 FAQ

1.How can I place an order for S27KS0643GABHV020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S27KS0643GABHV020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S27KS0643GABHV020 reliable?

The price and inventory of S27KS0643GABHV020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S27KS0643GABHV020 is usually 5 days.

3.What payment methods are accepted for S27KS0643GABHV020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S27KS0643GABHV020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S27KS0643GABHV020?

S27KS0643GABHV020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S27KS0643GABHV020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S27KS0643GABHV020?

For technical support, including S27KS0643GABHV020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S27KS0643GABHV020 requirements.

6.How does Aetrix verify that S27KS0643GABHV020 is sourced from the original manufacturer or authorized distributors?

All S27KS0643GABHV020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S27KS0643GABHV020 meets industry standards.

7.What is the process for return or replacement of S27KS0643GABHV020?

All S27KS0643GABHV020 units undergo pre-shipment inspection (PSI). If there is an issue with S27KS0643GABHV020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S27KS0643GABHV020 part is unused and in its original packaging.

Return procedure for S27KS0643GABHV020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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