Infineon Technologies S27KS0643GABHV023
- Part No.:
- S27KS0643GABHV023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S27KS0643GABHV023.pdf
- Description:
- IC PSRAM 64MBIT SPI/OCTAL 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,953
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Product details
Overview
S27KS0643GABHV023 from Infineon is a 64Mb self-refresh DRAM (PSRAM) with octal xSPI interface, supporting 1.8 V/3.0 V I/O and 200 MHz DDR clocking. It delivers up to 400 MBps throughput, features configurable burst lengths (16–128 bytes), hybrid sleep and deep power-down modes, and operates across -40°C to +105°C (Industrial Plus grade). Used in embedded microcontroller systems requiring low-latency, high-bandwidth external memory without host-managed refresh.
For engineers reviewing the S27KS0643GABHV023 datasheet, S27KS0643GABHV023 pinout, S27KS0643GABHV023 application, or S27KS0643GABHV023 equivalent, key selection criteria include xSPI octal timing compliance, RWDS strobe behavior, DCARS phase-shift support, partial array refresh configuration, and FBGA-24 thermal/power envelope suitability for space-constrained MCU co-processors.
Technical Context
This PSRAM integrates DRAM array logic with on-die refresh control and xSPI protocol engine, eliminating host-side refresh management. Its octal DDR interface uses CK/RWDS synchronization with optional differential CK# and DCARS for read-data eye centering - enabling reliable 200 MHz operation with 35 ns tACC.
The device implements command-based transactions (16-bit opcodes), supports linear/wrapped/hybrid bursts, and manages power states via CS#, RESET#, and register-controlled modes including Deep Power Down (12 µA at 2.0 V) and Hybrid Sleep. Memory density is organized as 8M × 8, with row/column addressing over xSPI bus.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 Mb (8 M × 8 organization), sufficient for frame buffers or firmware overlays in resource-limited MCUs |
| Interface | Octal xSPI DDR, 11–12 signal count (CK/CK#, CS#, DQ[7:0], RWDS, RESET#), reducing PCB routing vs. parallel SRAM |
| Max Clock Rate | 200 MHz DDR (400 MT/s), enabling 400 MBps peak bandwidth with minimal timing margin overhead |
| Access Time | tACC = 35 ns at 1.8 V/3.0 V, defining minimum cycle time between consecutive read commands |
| Power Modes | Deep Power Down (12 µA @ 2.0 V), Hybrid Sleep (dynamic current scaling), and interface standby (330 µA) |
| Burst Config | Programmable wrapped bursts (16/32/64/128 bytes) or hybrid mode - aligns with cache line sizes and DMA transfer widths |
| Operating Temp | -40°C to +105°C (Industrial Plus grade), validated for extended thermal cycling in industrial gateways and motor drives |
Pinout & Package
Package: 24-ball FBGA, 5 mm × 5 mm, 0.8 mm pitch, RoHS-compliant, optimized for thermal dissipation and high-density layout in compact modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select (active-low) | Asserts transaction boundary; must remain low for full command/address/data sequence; enables internal state machine |
| CK / CK# | Single-ended or differential clock input | Drives all DDR transfers; CK# enables jitter-resistant sampling when used differentially; defines 200 MHz timing base |
| RWDS | Bidirectional read-write data strobe | Output during reads (data valid indicator); input during writes (byte mask); phase-aligned or DCARS-shifted per register config |
| DQ[7:0] | Octal bidirectional data bus | Transfers 8 bits per half-cycle in DDR mode; supports octal SPI-compatible signaling with LV-CMOS voltage levels |
| RESET# | Hardware reset input | Asynchronous active-low signal forcing device into known power-on-reset state; required before initialization sequence |
Key Features
| Feature | Design Value |
|---|---|
| Self-refresh DRAM core | Eliminates host refresh overhead; retains data during idle periods without software intervention or external timer |
| DCARS (DDR Center-Aligned Read Strobe) | Phase-shifts RWDS by one CK edge to center strobe transition within read data eye - improves timing margin at 200 MHz |
| Configurable burst length | Supports 16/32/64/128-byte wrapped bursts or hybrid (wrapped + linear), matching common DMA and cache-line sizes |
| Partial array refresh | Refreshes only 1/8, 1/4, or 1/2 of array per cycle - reduces power and latency impact during active use |
| Hybrid Sleep mode | Dynamically scales current based on access frequency - cuts standby power by >50% vs. standard active standby |
Applications
| Industrial HMI Display Buffer | Automotive ADAS Preprocessing Cache |
|---|---|
Use Scenario: High-resolution TFT display controller buffering frame data in PLC operator panels with limited PCB area. IC Role / Device Role / Timing Role: External PSRAM providing 64 Mb of low-latency, refresh-free memory mapped to MCU's external bus interface. Use Value: Replaces parallel SRAM with 70% fewer pins and 4× higher bandwidth, enabling 800×480@60Hz rendering without frame tearing. | Use Scenario: Real-time image preprocessing pipeline in rear-view camera ECU, storing intermediate convolution outputs. IC Role / Device Role / Timing Role: Burst-accessed memory buffer synchronized to vision processor's xSPI master, using DCARS for stable 200 MHz reads. Use Value: Delivers 400 MBps sustained bandwidth with <35 ns access, meeting real-time 30 fps processing deadlines under -40°C to +105°C conditions. |
| IoT Edge Gateway Firmware Overlay | Medical Portable Ultrasound Data Buffer |
Use Scenario: Over-the-air firmware update staging area in cellular-connected industrial gateways with constrained RAM. IC Role / Device Role / Timing Role: Non-volatile-capable PSRAM holding decrypted firmware images prior to flash programming, accessed via MCU xSPI peripheral. Use Value: Enables zero-downtime updates using hybrid sleep mode - maintains data integrity while drawing only 12 µA in deep power-down between sessions. | Use Scenario: Temporary storage of raw RF echo data in handheld ultrasound devices before DSP compression and transmission. IC Role / Device Role / Timing Role: Low-power, high-throughput memory buffer interfaced to ARM Cortex-M7 with octal xSPI peripheral, operating in AEC-Q100 Grade 2 environment. Use Value: Meets medical-grade thermal reliability (-40°C to +105°C) and achieves 300 MBps sustained write throughput using 128-byte wrapped bursts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PSRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S27KL0643GABHV020 | Same die, identical pinout and xSPI timing, but rated for Industrial (-40°C to +85°C) only; no DCARS support | Lacks DCARS phase-shift capability and 105°C rating - unsuitable for thermally aggressive enclosures or high-speed timing-critical reads | Select when cost sensitivity outweighs thermal margin and 200 MHz timing robustness requirements |
| Winbond W958D8MBYA1I | 64Mb octal PSRAM, 1.8 V only, max 166 MHz clock, no DCARS, different register map and reset behavior | Requires modified initialization firmware; lower bandwidth limits real-time video buffering; no partial refresh option | Choose only if existing Winbond ecosystem integration and legacy driver compatibility are mandatory |
Compared with S27KS0643GABHV023, the Cypress alternative trades thermal range and DCARS for cost, while the Winbond part requires firmware rework and delivers 17% lower bandwidth - making the Infineon device optimal for new designs demanding 200 MHz stability and extended temperature operation.
Availability
S27KS0643GABHV023 is available at Aetrix Electronics and suitable for industrial HMIs, automotive ADAS ECUs, IoT edge gateways, and portable medical devices requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S27KS0643GABHV023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, sensor, and memory solutions for industrial, automotive, and IoT markets.
The HYPERRAM™ product line delivers high-bandwidth, low-pin-count PSRAMs targeting MCU-based systems needing external memory without refresh complexity or parallel bus overhead.
FAQ
Does S27KS0643GABHV023 require external refresh circuitry?
No. The device contains integrated self-refresh logic that autonomously manages DRAM array refresh during idle periods. Host processors interact with it as a static memory - no refresh commands, timers, or scheduling are needed. Refresh occurs transparently between transactions, triggered by internal counters and configurable partial-array settings.
What is the function of the RWDS pin during write operations?
During write transactions, RWDS serves as a write data mask (WDM) input. Each rising edge samples one byte of DQ[7:0], enabling selective byte-level writes without read-modify-write cycles. This allows precise memory updates - critical for register-mapped peripherals or fragmented firmware patching - while maintaining full DDR bandwidth efficiency.
Can S27KS0643GABHV023 operate with only single-ended CK (no CK#)?
Yes. The device supports both single-ended (CK only) and differential (CK/CK#) clocking. When CK# is unused, it must be tied to VSS or VCC per datasheet guidance. Single-ended mode simplifies layout but sacrifices some jitter immunity; differential mode is recommended for 200 MHz operation in electrically noisy environments like motor drives or automotive chassis.
How does DCARS improve timing margin in read operations?
DCARS shifts the RWDS output edge by one CK period relative to CK, positioning the strobe transition near the center of the read data eye instead of its edge. This increases setup/hold margin by up to 1.5 ns at 200 MHz - directly enabling reliable operation on FR-4 PCBs with moderate trace skew and signal integrity challenges typical in cost-sensitive industrial designs.
S27KS0643GABHV023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HYPERRAM™ KS
- Package/Case:
- 24-VBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- PSRAM
- Technology:
- PSRAM (Pseudo SRAM)
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- SPI - Octal I/O
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 35ns
- Access Time:
- 35 ns
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S27KS0643GABHV023 FAQ
1.How can I place an order for S27KS0643GABHV023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S27KS0643GABHV023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S27KS0643GABHV023 reliable?
The price and inventory of S27KS0643GABHV023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S27KS0643GABHV023 is usually 5 days.
3.What payment methods are accepted for S27KS0643GABHV023?
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S27KS0643GABHV023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S27KS0643GABHV023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S27KS0643GABHV023?
For technical support, including S27KS0643GABHV023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S27KS0643GABHV023 requirements.
6.How does Aetrix verify that S27KS0643GABHV023 is sourced from the original manufacturer or authorized distributors?
All S27KS0643GABHV023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S27KS0643GABHV023 meets industry standards.
7.What is the process for return or replacement of S27KS0643GABHV023?
All S27KS0643GABHV023 units undergo pre-shipment inspection (PSI). If there is an issue with S27KS0643GABHV023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S27KS0643GABHV023 part is unused and in its original packaging.
Return procedure for S27KS0643GABHV023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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