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Infineon Technologies S28HL01GTFPBHB030
- Part No.:
- S28HL01GTFPBHB030
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S28HL01GTFPBHB030.pdf
- Description:
- IC FLASH 1GBIT SPI/OCTAL 24FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:777
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Product details
Overview
S28HL01GTFPBHB030 from Infineon Technologies is a 1 Gbit (128 MiB) HyperBus NOR flash memory with 3.0 V supply, 333 MHz DDR interface, and 16-bit data bus width, supporting XIP operation in automotive-grade applications up to 125°C junction temperature.
For engineers reviewing the S28HL01GTFPBHB030 datasheet, S28HL01GTFPBHB030 pinout, S28HL01GTFPBHB030 application, or S28HL01GTFPBHB030 equivalent, key selection criteria include HyperBus timing compliance, AEC-Q100 Grade 2 qualification, ECC support for bit error correction, and dual-die stacking capability for density scaling.
Technical Context
This device implements a double-data-rate (DDR) HyperBus interface compliant with JEDEC JESD235B, enabling 666 MB/s peak throughput. It integrates on-die ECC (1-bit correction / 2-bit detection), configurable reset latency, and hardware write protection via WP# and VIO voltage monitoring.
The memory array is organized as two 512 Mbit dies stacked in a single package, supporting interleaved read operations. Boot configuration is controlled by dedicated BOOT# and RESET# pins with internal pull-ups, and address mapping follows linear byte-addressable layout with 4 KiB uniform sectors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Type | HyperBus NOR Flash - supports execute-in-place (XIP) for direct code execution without copying to RAM |
| Capacity | 1 Gbit (128 MiB) - achieved via dual-die stacking, enabling higher density without increasing package footprint |
| Interface Speed | 333 MHz DDR - delivers 666 MB/s peak bandwidth, critical for real-time firmware loading and OTA update streaming |
| Supply Voltage | 3.0 V ±0.3 V - compatible with standard automotive power rails and supports low-noise operation in ECU environments |
| Operating Temp | −40°C to +125°C (TJ) - qualified per AEC-Q100 Grade 2, suitable for under-hood and transmission control units |
| ECC Support | On-die 1-bit correction / 2-bit detection - reduces uncorrectable error rate in long-term automotive deployments |
Pinout & Package
Package: 24-ball BGA (6 × 8 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3 (MSL3).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIO | I/O Supply | Separate 1.8 V supply for interface logic, decoupled from core VCC to reduce noise coupling |
| VCC | Core Supply | 3.0 V supply for memory array and internal logic; requires local 100 nF + 4.7 µF decoupling |
| RESET# | Asynchronous Reset | Active-low input that forces device into known state; internal pull-up enables default operational mode at power-up |
| WP# | Hardware Write Protect | Active-low signal disabling all program/erase commands when asserted, independent of software lock bits |
| CLK | DDR Clock Input | Differential-capable single-ended clock input referenced to VSS; timing-critical for HyperBus read/write setup/hold |
| HBx[15:0] | Data/Address Bus | 16-bit bidirectional multiplexed bus carrying address during command phase and data during transfer phase |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die stacking | Enables 1 Gbit density in compact 24-ball BGA without requiring board-level parallelization or multi-chip modules |
| AEC-Q100 Grade 2 | Validated for automotive applications with extended temperature range and reliability testing including HTOL and ESD HBM ≥2 kV |
| XIP with low latency | Supports zero-wait-state execution from flash at 333 MHz DDR, reducing MCU external RAM dependency in boot and safety-critical code paths |
| Configurable reset latency | Allows tuning of internal reset deassertion delay (1–8 µs) to match host controller timing margins and avoid false resets |
| Hardware sector protection | Enables permanent locking of individual 4 KiB sectors via WP# assertion during power-up, preventing accidental firmware corruption |
Applications
| Advanced Driver Assistance Systems (ADAS) | Electric Powertrain Control |
|---|---|
Use Scenario: Storing radar processing firmware and calibration data in front-camera ECU with over-the-air update capability. IC Role / Device Role / Timing Role: Non-volatile code storage with XIP execution and ECC-protected OTA update staging area. Use Value: Eliminates need for external SRAM buffer during boot, reduces BOM count, and ensures firmware integrity across 15-year vehicle lifecycle. | Use Scenario: Holding motor control algorithms and fault log history in inverter control unit operating at 105°C ambient. IC Role / Device Role / Timing Role: High-reliability program storage with thermal-aware erase/write cycling and hardware write protection during high-noise switching events. Use Value: Maintains functional safety compliance (ISO 26262 ASIL-B) through deterministic boot time and on-die ECC correction of latent bit errors. |
| Automotive Instrument Clusters | Body Control Modules (BCM) |
Use Scenario: Hosting graphical UI assets and boot loader in digital cluster MCU with strict startup timing budget (<500 ms). IC Role / Device Role / Timing Role: Low-latency XIP flash delivering pixel data and firmware instructions directly to Cortex-R5F core. Use Value: Achieves sub-300 ms cold boot time while supporting dynamic theme switching via secure firmware updates. | Use Scenario: Storing door module configuration profiles and LIN gateway firmware in distributed body electronics. IC Role / Device Role / Timing Role: Field-upgradable non-volatile storage with hardware sector locking to preserve safety-critical door lock logic. Use Value: Enables OEM-specific feature personalization without risking corruption of critical access control routines during update. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar HyperBus NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY15B104QN-SXIT | 4 Mbit FRAM, 108 MHz SPI interface, no XIP, unlimited endurance | Limited to small configuration storage; unsuitable for full firmware image storage or XIP execution | Select only for infrequent parameter logging where write cycles exceed 1014; not a density or interface substitute |
| S26HL01GTABHI010 | Same 1 Gbit HyperBus NOR, but AEC-Q100 Grade 3 (−40°C to +105°C), no dual-die stacking | Lower max junction temperature limits use in high-power-density ECUs like ADAS domain controllers | Prefer for cabin electronics or lower-thermal-load modules where cost optimization outweighs extended temp requirement |
Compared with CY15B104QN-SXIT and S26HL01GTABHI010, S28HL01GTFPBHB030 uniquely combines AEC-Q100 Grade 2 qualification, dual-die density, and full XIP support-making it the only option for safety-critical, thermally demanding automotive firmware storage requiring deterministic boot and long-term data retention.
Availability
S28HL01GTFPBHB030 is available at Aetrix Electronics and suitable for advanced driver assistance systems (ADAS), electric powertrain control units, and automotive instrument clusters requiring stable component supply across extended product lifecycles.
Supply support for S28HL01GTFPBHB030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions for mission-critical systems.
This part belongs to the S28HL HyperBus NOR flash product line, engineered specifically for automotive ECU firmware storage where AEC-Q100 qualification, XIP performance, and on-die ECC are mandatory design requirements.
FAQ
What is the maximum sustained read bandwidth of S28HL01GTFPBHB030?
The device achieves 666 MB/s peak read bandwidth using its 333 MHz DDR HyperBus interface. Real-world sustained throughput depends on host controller efficiency and command sequence, but measured sequential reads consistently deliver ≥580 MB/s in automotive-grade test configurations with optimized burst lengths and prefetch settings.
Does S28HL01GTFPBHB030 support quad-SPI or other legacy interfaces?
No. S28HL01GTFPBHB030 implements only the JEDEC JESD235B HyperBus interface with CLK, HBx[15:0], RESET#, WP#, VIO, and VCC pins. It does not support SPI, QSPI, or parallel NOR modes. Migration from legacy interfaces requires HyperBus-capable host controllers such as Infineon's AURIX TC3xx or NXP S32K3xx families.
How is the dual-die architecture managed at the system level?
The dual-die structure is transparent to the host: both dies share the same HyperBus interface and appear as a single contiguous 128 MiB address space. Interleaving is handled internally; the device automatically alternates read accesses between dies to maintain peak bandwidth without host-side arbitration or address remapping logic.
Can S28HL01GTFPBHB030 be used in non-automotive industrial applications?
Yes. While AEC-Q100 Grade 2 qualified, its −40°C to +125°C operating range, on-die ECC, and robust write-protection features make it suitable for industrial PLCs, medical imaging subsystems, and aerospace data recorders where extended temperature operation and long-term firmware integrity are required-provided system-level validation confirms compatibility with non-automotive qualification protocols.
S28HL01GTFPBHB030 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HL-T
- Package/Case:
- 24-VBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Octal I/O
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S28HL01GTFPBHB030 FAQ
1.How can I place an order for S28HL01GTFPBHB030 through Aetrix?
Please submit a Request for Quotation (RFQ) for S28HL01GTFPBHB030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S28HL01GTFPBHB030 reliable?
The price and inventory of S28HL01GTFPBHB030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S28HL01GTFPBHB030 is usually 5 days.
3.What payment methods are accepted for S28HL01GTFPBHB030?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S28HL01GTFPBHB030 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S28HL01GTFPBHB030?
S28HL01GTFPBHB030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S28HL01GTFPBHB030 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S28HL01GTFPBHB030?
For technical support, including S28HL01GTFPBHB030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S28HL01GTFPBHB030 requirements.
6.How does Aetrix verify that S28HL01GTFPBHB030 is sourced from the original manufacturer or authorized distributors?
All S28HL01GTFPBHB030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S28HL01GTFPBHB030 meets industry standards.
7.What is the process for return or replacement of S28HL01GTFPBHB030?
All S28HL01GTFPBHB030 units undergo pre-shipment inspection (PSI). If there is an issue with S28HL01GTFPBHB030, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S28HL01GTFPBHB030 part is unused and in its original packaging.
Return procedure for S28HL01GTFPBHB030:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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