My Inquiry
My Account
Infineon Technologies S28HL512TFPBHI010
- Part No.:
- S28HL512TFPBHI010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S28HL512TFPBHI010.pdf
- Description:
- IC FLASH 512MBIT SPI/OCTL 24FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:413
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S28HL512TFPBHI010 from Infineon is a 512 Mbit (64 MB) HyperBus NOR Flash memory with 3.0 V supply, 333 MHz DDR interface, and 16-bit data bus width. It supports XIP (eXecute-In-Place), features 100K program/erase cycles, and operates across -40°C to +105°C industrial temperature range.
For engineers reviewing the S28HL512TFPBHI010 datasheet, S28HL512TFPBHI010 pinout, S28HL512TFPBHI010 application, or S28HL5100TFPBHI010 equivalent, key selection criteria include HyperBus timing compliance, XIP latency under 12 ns, sector protection granularity, and industrial-grade reliability for automotive ADAS boot code storage.
Technical Context
This device implements a double-data-rate (DDR) HyperBus interface compliant with JEDEC JESD251A, enabling high-speed read access without external clock forwarding. It integrates on-die termination, configurable drive strength, and hardware write protection via WP# and VIO voltage monitoring.
The memory array is organized as 8 banks of 64 Mbit each, supporting uniform 4 KB sectors and 256 KB blocks. Command-set compatibility with legacy parallel NOR simplifies migration while DDR signaling doubles effective bandwidth over single-data-rate interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mbit (64 MB) - sufficient for full firmware images including bootloader, OS kernel, and application binaries in space-constrained automotive ECUs. |
| Interface | HyperBus DDR - enables 333 MT/s read throughput with single 16-bit bus, eliminating need for wide parallel buses and reducing PCB layer count. |
| Read Latency | 12 ns typical XIP access time - meets real-time interrupt response requirements in safety-critical ADAS microcontrollers. |
| Endurance | 100,000 program/erase cycles per sector - supports field firmware updates over 15-year vehicle lifetime with wear leveling. |
| Temperature Range | -40°C to +105°C - qualified for under-hood automotive applications per AEC-Q100 Grade 3. |
| Voltage Supply | 3.0 V ±0.3 V - compatible with standard automotive power rails and reduces need for additional LDOs. |
Pinout & Package
Package: 24-pin BGA (6 × 8 mm, 0.8 mm pitch, ball layout 3 × 8).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | DDR Clock Input | Dual-edge clock reference for timing-critical HyperBus reads; requires matched trace length to DQ lines. |
| DQ[15:0] | Data Bus | 16-bit bidirectional DDR data path; supports simultaneous read/write command pipelining. |
| RESET# | Hardware Reset | Asynchronous active-low reset that clears internal state and forces device into default configuration. |
| WP# | Write Protect | Hardware sector lock control; asserts low to disable program/erase in protected regions. |
| HOLD# | Command Hold | Pauses ongoing command execution without terminating bus transaction; used for priority interrupt handling. |
Key Features
| Feature | Design Value |
|---|---|
| XIP Mode Support | Enables direct CPU instruction fetch from flash without RAM copy, reducing boot time by up to 40% in Cortex-R5-based ADAS SoCs. |
| Hardware Sector Protection | Independent lock bits per 4 KB sector prevent accidental overwrite of critical boot code during OTA updates. |
| On-Die Termination | Integrated 40 Ω termination resistors eliminate external components and improve signal integrity at 333 MT/s DDR rates. |
| VIO Monitoring | Detects invalid I/O voltage (outside 2.7–3.6 V) and disables writes to prevent data corruption during power brownout. |
Applications
| Automotive ADAS ECU Boot Storage | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot firmware and safety monitor code for radar processing units requiring ASIL-B compliance. IC Role / Device Role / Timing Role: Non-volatile code storage with deterministic XIP latency and hardware write protection for fail-safe startup. Use Value: Eliminates external SRAM buffering and reduces boot sequence time to <150 ms while meeting ISO 26262 diagnostic coverage requirements. | Use Scenario: Holds field-upgradable control logic and HMI assets in modular automation controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: High-reliability program storage with sector-level locking to isolate firmware from configuration data partitions. Use Value: Supports 10+ years of unattended operation with guaranteed 100K erase cycles and extended temperature tolerance. |
| Medical Imaging System Configuration | Avionics Display Module Code Storage |
Use Scenario: Retains calibration tables and FPGA bitstreams for ultrasound beamforming subsystems requiring rapid cold-start recovery. IC Role / Device Role / Timing Role: Low-latency read-only memory mapped directly to ARM Cortex-A9 processor address space. Use Value: Achieves sub-200 ms system initialization with zero-copy execution, critical for emergency diagnostic mode activation. | Use Scenario: Stores certified display firmware and font assets in DO-178C Level A flight-critical cockpit displays. IC Role / Device Role / Timing Role: AEC-Q100 qualified non-volatile memory with ECC-enabled read path and locked boot sector. Use Value: Meets RTCA DO-254 design assurance requirements through built-in error detection and hardware write lock. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY14B108L-BA25XI | 8 Mbit density, NVSRAM architecture with battery-backed SRAM + EEPROM backup; 55 ns async access. | Targeted at data logging with frequent small writes, not code storage. | Select only when byte-level random writes and instant non-volatility on power loss are required over code density. |
| S29GL512S11TFI010 | 512 Mbit parallel NOR, 110 ns access, no DDR interface or XIP optimization. | Legacy designs using wide 16-bit address/data buses; incompatible with HyperBus controllers. | Choose only for drop-in replacement in existing parallel NOR layouts where DDR bandwidth is unnecessary. |
Compared with CY14B108L-BA25XI and S29GL512S11TFI010, S28HL512TFPBHI010 delivers 3× higher effective bandwidth and deterministic XIP latency essential for real-time boot, but requires HyperBus-capable host controller and layout-aware DDR signal routing.
Availability
S28HL512TFPBHI010 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial PLCs, and avionics display modules requiring stable component supply and long-term lifecycle support.
Supply support for S28HL512TFPBHI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions.
This device belongs to the S28HL HyperFlash family, designed specifically for high-speed, reliable code storage in automotive and industrial systems demanding AEC-Q100 qualification and DDR interface efficiency.
FAQ
Does S28HL512TFPBHI010 support hardware ECC?
No. This part does not integrate on-die error correction circuitry. External ECC must be implemented in the host controller or via software for applications requiring bit-error resilience beyond the device's inherent bit-flip rate specification of <1 FIT/Mb.
What is the minimum VIO voltage for reliable operation?
The minimum valid VIO voltage is 2.7 V. Operation below this threshold disables write operations and may cause undefined behavior during read cycles. The device monitors VIO continuously and asserts status flags if voltage falls outside 2.7–3.6 V range.
Can S28HL512TFPBHI010 replace S28HL512TFPBHI000?
Yes, it is a direct replacement. Both share identical pinout, timing, and command set. The "010" suffix denotes tape-and-reel packaging with different reel size and orientation, not functional difference.
Is the CLK pin AC-coupled internally?
No. The CLK pin requires external AC coupling capacitor (typically 100 nF) placed within 5 mm of the BGA pad. Internal DC biasing is provided, but AC coupling is mandatory to meet HyperBus DDR common-mode voltage requirements.
S28HL512TFPBHI010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 24-VBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Octal I/O
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S28HL512TFPBHI010 FAQ
1.How can I place an order for S28HL512TFPBHI010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S28HL512TFPBHI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S28HL512TFPBHI010 reliable?
The price and inventory of S28HL512TFPBHI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S28HL512TFPBHI010 is usually 5 days.
3.What payment methods are accepted for S28HL512TFPBHI010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S28HL512TFPBHI010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S28HL512TFPBHI010?
S28HL512TFPBHI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S28HL512TFPBHI010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S28HL512TFPBHI010?
For technical support, including S28HL512TFPBHI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S28HL512TFPBHI010 requirements.
6.How does Aetrix verify that S28HL512TFPBHI010 is sourced from the original manufacturer or authorized distributors?
All S28HL512TFPBHI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S28HL512TFPBHI010 meets industry standards.
7.What is the process for return or replacement of S28HL512TFPBHI010?
All S28HL512TFPBHI010 units undergo pre-shipment inspection (PSI). If there is an issue with S28HL512TFPBHI010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S28HL512TFPBHI010 part is unused and in its original packaging.
Return procedure for S28HL512TFPBHI010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S28HL512TFPBHI010 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
