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Infineon Technologies S28HL512TFPBHI013

Part No.:
S28HL512TFPBHI013
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS28HL512TFPBHI013.pdf
Description:
IC FLASH 512MBIT SPI/OCTL 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,749

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Product details

Overview

S28HL512TFPBHI013 from Cypress Semiconductor (now Infineon) is a 512-Mb (64-MB), 3.0-V supply, industrial-grade (−40 °C to +85 °C), Semper® Flash NOR memory with Octal xSPI interface, 400 MBps DDR read throughput, and ISO 26262 ASIL-B compliance for automotive safety-critical boot code storage in ADAS ECUs.

For engineers reviewing the S28HL512TFPBHI013 datasheet, S28HL512TFPBHI013 pinout, S28HL512TFPBHI013 application, or S28HL512TFPBHI013 equivalent, key selection criteria include octal DDR timing margin, EnduraFlex® partitioning for mixed endurance/retention requirements, SafeBoot initialization reporting, and 24-ball 6×8 mm BGA footprint compatibility with high-density automotive PCB layouts.

Technical Context

This device implements Cypress's 45-nm MirrorBit® technology with two bits per cell and supports both uniform (all 256 KB sectors) and hybrid sector architectures (32 × 4 KB + remainder 256 KB). Its Host Interface Controller (HIC) and Embedded Algorithm Controller (EAC) operate in parallel to decouple host command handling from internal erase/program execution.

The octal interface complies fully with JEDEC JESD251, supporting 8S-8S-8S and 8D-8D-8D protocols with Data Strobe (DS) for timing-critical read capture. Built-in SECDED ECC corrects single-bit errors and detects double-bit errors across the entire memory array, while Interface CRC validates all command/address/data transfers.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density512 Mb (64 MB) - sufficient for full firmware images and secure boot partitions in modern automotive microcontrollers
Supply Voltage2.7 V to 3.6 V (HL-T) - compatible with standard 3.3-V system rails and automotive power domains
Read Throughput400 MBps (DDR, 200 MHz clock) - enables sub-100 ms boot time for 32 MB firmware images
Endurance1,280,000 program-erase cycles (main array) - supports over 10 years of OTA update cycles in telematics modules
Data Retention25 years minimum - meets long-life requirements for engine control units and chassis systems
Temperature Range−40 °C to +85 °C (Industrial) - qualified for under-hood and cabin ECU deployment without derating
Safety CertificationISO 26262 ASIL-B compliant, ASIL-D ready - enables integration into functional safety architectures without external error mitigation

Pinout & Package

Package: 24-ball BGA, 6 × 8 mm, 1.0-mm pitch, halogen-free and lead-free (RoHS-compliant).

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip SelectActive-low enable signal; drives device into standby when HIGH, enabling low-power idle states during host idle periods
CKClock InputRising-edge–latched SDR or dual-edge–latched DDR timing reference; determines maximum interface bandwidth and setup/hold margins
DQ[7:0]Bidirectional Data BusOctal I/O lines carrying commands, addresses, and data; supports x1 SPI fallback and x8 DDR burst reads for deterministic latency
DSData Strobe OutputSource-synchronous strobe aligned with DQ output edges; eliminates skew-related timing closure issues at >166 MHz operation
RESET#Hardware ResetAsynchronous reset with weak internal pull-up; ensures known state recovery after brown-out or watchdog timeout without external circuitry
INT#Interrupt OutputOpen-drain status indicator signaling completion of program/erase or ECC error detection; reduces polling overhead in real-time OS environments
VCC / VCCQPower SuppliesVCC = core logic (2.7–3.6 V); VCCQ = I/O drivers (2.7–3.6 V); independent regulation allows noise isolation between digital core and interface
VSS / VSSQGround ReturnsSeparate analog/digital ground pins minimize switching noise coupling into sensitive read sense amplifiers

Key Features

FeatureDesign Value
EnduraFlex® ArchitectureEnables runtime partitioning of memory into high-endurance (≥1M cycles) and long-retention (25-year) zones - critical for logging vs. boot code co-location
SafeBoot InitializationReports configuration corruption and provides automatic recovery paths - prevents failed boot due to bit flips in SFDP or security registers
Sector Erase Status IndicatorPer-sector status flag indicating success/failure after power loss during erase - eliminates need for host-side sector validation on resume
Serial Flash Discoverable Parameters (SFDP)JEDEC-standardized parameter table accessible via SPI - enables automatic driver configuration without hard-coded timing tables
OTP Secure Silicon Array1024-byte one-time-programmable region for cryptographic keys or device-specific secrets - supports secure boot root-of-trust implementation

Applications

ADAS Camera Module Boot StorageAutomotive Gateway Firmware

Use Scenario: Stores boot loader and sensor fusion firmware in front-facing camera ECU requiring fast startup and fault-tolerant execution.

IC Role / Device Role / Timing Role: Primary nonvolatile boot memory with SafeBoot and ECC ensuring deterministic boot integrity after voltage transients.

Use Value: 400 MBps DDR read speed reduces boot time by >40% vs. legacy quad-SPI NOR, while ASIL-B compliance eliminates need for external safety monitors.

Use Scenario: Holds gateway application firmware and CAN/FlexRay protocol stacks in zonal architecture gateways managing multiple domain controllers.

IC Role / Device Role / Timing Role: High-reliability code storage with EnduraFlex®-configured partitions for frequent OTA updates (high-endurance zone) and immutable boot code (long-retention zone).

Use Value: 1.28M program-erase cycles support >15 years of bi-weekly OTA updates; hybrid sector architecture isolates update failures from boot partition.

Engine Control Unit (ECU) Calibration DataInfotainment Head Unit Kernel Image

Use Scenario: Stores calibrated lookup tables and trim parameters subject to field updates during vehicle service campaigns.

IC Role / Device Role / Timing Role: Nonvolatile parameter storage with 4 KB sector granularity enabling atomic updates without erasing full firmware image.

Use Value: 300,000 program-erase cycles in 4 KB sectors ensure >20 years of calibration updates; sector erase status reporting prevents corrupted parameter loads after power interruption.

Use Scenario: Hosts Linux kernel and initramfs in premium infotainment systems requiring rapid UI launch and secure firmware verification.

IC Role / Device Role / Timing Role: High-bandwidth code execution memory interfaced directly to application processor's xSPI controller.

Use Value: Octal DDR interface delivers 4× bandwidth vs. quad-SPI, enabling kernel decompression in <150 ms; built-in Interface CRC prevents silent corruption from PCB-level noise.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-reliability automotive NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Infineon S28HL512TFPBHI023Same die, identical electrical specs, but uses 13" tape-and-reel packaging instead of trayNo functional difference; suited for automated SMT lines requiring reel-fed placementSelect for high-volume production with pick-and-place machines configured for tape feed
Macronix MX66UM1G45GXDIO1 Gb density, 1.8 V core, 332 MBps DDR (166 MHz), no ASIL-B certificationLacks ISO 26262 qualification; requires external safety mechanisms for ASIL-B systemsConsider only for non-safety-critical infotainment or telematics where higher density offsets certification overhead

Compared with S28HL512TFPBHI013, the 023 variant offers identical functionality in reel format for volume manufacturing, while the Macronix part trades ASIL-B compliance for higher density and lower voltage - making it unsuitable for safety-critical boot storage but viable for cost-sensitive consumer-tier applications.

Availability

S28HL512TFPBHI013 is available at Aetrix Electronics and suitable for automotive ADAS camera modules, engine control units, and infotainment head units requiring stable component supply, long-term lifecycle assurance, and AEC-Q100 Grade 3 qualification.

Supply support for S28HL512TFPBHI013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and now manufactures the Semper Flash family, delivering high-reliability memory solutions for automotive, industrial, and communications markets.

The Semper Flash product line was designed specifically for functional safety–critical applications, combining high-speed octal interface performance with ISO 26262–aligned reliability features including SafeBoot, EnduraFlex®, and embedded SECDED ECC.

FAQ

What is the purpose of the DS (Data Strobe) pin on S28HL512TFPBHI013?

The DS pin outputs a source-synchronous strobe synchronized with DQ[7:0] read data edges. It enables reliable data capture at high speeds (up to 200 MHz DDR) by eliminating clock-to-data skew, especially critical in automotive PCBs with length-mismatched traces. DS toggles only during active CS# read transactions and remains inactive in standby or write modes.

Does S28HL512TFPBHI013 support both SDR and DDR modes on its octal interface?

Yes - the device supports both SDR (up to 200 MBps at 200 MHz) and DDR (up to 400 MBps at 200 MHz) on the octal interface. Mode selection is controlled via configuration registers programmed during initialization; the default power-on mode is SDR, and DDR must be explicitly enabled using the Read Status Register command per JEDEC JESD251.

How does the EnduraFlex® architecture work in practice for system design?

EnduraFlex® allows the host to define up to four non-overlapping memory partitions with independent endurance (1M+ cycles) and retention (25-year) profiles. Partition boundaries and attributes are stored in dedicated configuration registers and persist across power cycles. This lets designers allocate high-endurance space for OTA update buffers while reserving long-retention zones for immutable boot code - all within a single die.

Is the RESET# pin required for normal operation of S28HL512TFPBHI013?

No - RESET# is optional and internally weak-pulled HIGH. The device performs automatic power-on reset (POR) and SafeBoot initialization without external reset assertion. However, connecting RESET# to a system supervisor IC enables coordinated reset sequencing across multiple devices and recovers from lockup conditions that POR alone cannot resolve, such as stuck internal state machines.

S28HL512TFPBHI013 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
SEMPER™
Package/Case:
24-VBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR (SLC)
Memory Size:
512Mbit
Memory Organization:
64M x 8
Memory Interface:
SPI - Octal I/O
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
1.7ms
Access Time:
6.5 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S28HL512TFPBHI013 FAQ

1.How can I place an order for S28HL512TFPBHI013 through Aetrix?

Please submit a Request for Quotation (RFQ) for S28HL512TFPBHI013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S28HL512TFPBHI013 reliable?

The price and inventory of S28HL512TFPBHI013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S28HL512TFPBHI013 is usually 5 days.

3.What payment methods are accepted for S28HL512TFPBHI013?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S28HL512TFPBHI013 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S28HL512TFPBHI013?

S28HL512TFPBHI013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S28HL512TFPBHI013 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S28HL512TFPBHI013?

For technical support, including S28HL512TFPBHI013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S28HL512TFPBHI013 requirements.

6.How does Aetrix verify that S28HL512TFPBHI013 is sourced from the original manufacturer or authorized distributors?

All S28HL512TFPBHI013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S28HL512TFPBHI013 meets industry standards.

7.What is the process for return or replacement of S28HL512TFPBHI013?

All S28HL512TFPBHI013 units undergo pre-shipment inspection (PSI). If there is an issue with S28HL512TFPBHI013, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S28HL512TFPBHI013 part is unused and in its original packaging.

Return procedure for S28HL512TFPBHI013:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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