Infineon Technologies S28HL512TFPBHM013
- Part No.:
- S28HL512TFPBHM013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S28HL512TFPBHM013.pdf
- Description:
- IC FLASH 512MBIT SPI/OCTL 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,855
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Product details
Overview
S28HL512TFPBHM013 from Cypress Semiconductor is a 512-Mb (64-MB), 3.0-V supply, Semper® Flash NOR memory with Octal xSPI interface, ISO 26262 ASIL-B compliant functional safety architecture, and EnduraFlex™ endurance partitioning. It delivers up to 400 MBps DDR read throughput, supports 256 KB/4 KB sector erase, and features built-in SECDED ECC, interface CRC, and SafeBoot for automotive and industrial embedded boot storage.
For engineers reviewing the S28HL512TFPBHM013 datasheet, S28HL512TFPBHM013 pinout, S28HL512TFPBHM013 application, or S28HL512TFPBHM013 equivalent, key selection criteria include ASIL-B compliance, octal DDR timing at 200 MHz, 24-ball BGA (6 × 8 mm) package compatibility, and hybrid sector architecture support for firmware update partitioning.
Technical Context
This device implements Cypress's 45-nm MirrorBit® technology with two bits per cell and dual-controller architecture: Host Interface Controller (HIC) handles protocol-level transactions, while Embedded Algorithm Controller (EAC) manages program/erase sequences, ECC generation, and SafeBoot initialization. It supports both JEDEC JESD251-compliant Octal Peripheral Interface (OPI) and legacy SPI.
The memory array uses configurable sector architecture (uniform or hybrid), includes 1024-byte OTP Secure Silicon, and integrates Data Strobe (DS) for precise DDR read capture. Power management includes deep power-down mode (0.0022 mA) and hardware reset via dedicated RESET# pin or CS# signaling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (64 MB) - sufficient for full automotive boot code + configuration data in single-package solution |
| Supply Voltage | 2.7 V to 3.6 V (HL-T) - compatible with 3.3-V system rails without level-shifting |
| Max Read Throughput | 400 MBps (Octal DDR @ 200 MHz) - enables sub-100 ms firmware load time for real-time boot |
| Endurance | 1,280,000 program-erase cycles (main array) - supports frequent OTA updates over 15+ years |
| Data Retention | 25 years minimum - validated across −40 °C to +125 °C (AEC-Q100 Grade 1) |
| ECC | SECDED (Single-bit Error Correction, Double-bit Error Detection) - ensures bit-level reliability without host intervention |
| Sector Architecture | Hybrid: thirty-two 4 KB sectors + remaining 256 KB sectors - enables atomic firmware patching and secure bootloader isolation |
Pinout & Package
24-ball BGA package, 6 × 8 mm, 1.0-mm pitch (VAA024), halogen-free and lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable signal; controls device entry into active/standby modes and gates all interface activity |
| CK | Clock Input | Rising/falling edge–synchronized timing reference for SDR/DDR serial transfers; supports up to 200 MHz |
| DQ[7:0] | Bidirectional Data Bus | Octal I/O for command/address/data in OPI mode; DQ0/DQ1 used as SI/SO in legacy SPI fallback |
| DS | Data Strobe Output | Synchronizes read data output in high-speed DDR mode; eliminates setup/hold timing margin concerns at 400 MBps |
| RESET# | Hardware Reset | Asynchronous reset with weak internal pull-up; forces SafeBoot reinitialization and clears pending operations |
| INT# | Interrupt Output | Open-drain status indicator for completion of program/erase or ECC error detection; reduces polling overhead |
| VCC / VCCQ | Power Supplies | VCC = core logic (2.7–3.6 V); VCCQ = I/O drivers (2.7–3.6 V); independent regulation prevents noise coupling |
| VSS / VSSQ | Ground Returns | Separate core and I/O ground planes minimize switching noise on read/write paths |
Key Features
| Feature | Design Value |
|---|---|
| ISO 26262 ASIL-B Compliance | Validated functional safety architecture with SafeBoot, configuration corruption recovery, and failure reporting for automotive ECU boot memory |
| EnduraFlex™ Partitioning | Allows runtime definition of high-endurance (1M+ cycles) and long-retention (25 yr) memory regions for mixed-criticality firmware storage |
| Interface CRC & Data Integrity CRC | End-to-end error detection on command/data transfers and memory array contents - prevents silent data corruption in safety-critical systems |
| Octal DDR + Legacy SPI Fallback | Single device supports high-bandwidth boot loading (DDR) and debug/programming via standard SPI tools without redesign |
| 24-Ball BGA Footprint | Compact 6 × 8 mm layout enables dense PCB routing in space-constrained ADAS and gateway modules |
Applications
| Automotive ADAS Domain Controller Boot | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot firmware and safety monitor code for radar/vision fusion ECUs requiring AEC-Q100 Grade 1 qualification. IC Role / Device Role / Timing Role: Primary nonvolatile boot memory with deterministic <100 µs SafeBoot initialization and ASIL-B-certified startup sequence. Use Value: Enables certified cold-start within 250 ms while maintaining ECC-protected integrity of safety-critical boot images. |
Use Scenario: Holds field-upgradable control logic and configuration parameters in programmable logic controllers operating continuously at 85 °C. IC Role / Device Role / Timing Role: High-reliability firmware repository supporting 10K+ annual OTA updates with hybrid sector architecture. Use Value: Delivers 1.28M program-erase cycles and 25-year retention to eliminate field replacement due to wear-out. |
| Medical Imaging System Configuration | 5G Baseband Radio Firmware |
Use Scenario: Stores calibration tables, sensor profiles, and regulatory-compliant boot images in FDA-cleared diagnostic equipment. IC Role / Device Role / Timing Role: Secure, tamper-resistant configuration store with OTP Secure Silicon and interface CRC for audit trail integrity. Use Value: Meets IEC 62304 software lifecycle requirements through SafeBoot validation and sector-erase status reporting. |
Use Scenario: Provides low-latency, high-throughput boot image access for FPGA-based radio processing units in massive MIMO base stations. IC Role / Device Role / Timing Role: High-speed octal DDR flash delivering 400 MBps reads to meet strict 5G NR boot timing budgets. Use Value: Reduces boot latency by 65% vs. quad-SPI alternatives, enabling faster network synchronization and service restoration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-reliability NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S28HS512TGABHM010 | 1.8-V HS-T variant; lower standby current (0.011 mA vs. 0.014 mA); same 24-ball BGA but rated for −40 °C to +105 °C only | Lacks AEC-Q100 Grade 1 (125 °C) rating; unsuitable for under-hood automotive use | Select when system operates ≤105 °C and ultra-low power is prioritized over extended temperature range |
| MX66UM1G45GXDIO | Micron 1-Gb octal flash; 3.0-V HL-T; supports 400 MBps DDR but lacks ISO 26262 certification and EnduraFlex™ partitioning | No ASIL-B compliance path; requires external ECC and safety monitoring logic | Choose for cost-sensitive industrial applications where functional safety certification is not mandated |
Compared with S28HL512TFPBHM013, the HS-T alternative trades temperature grade and power for voltage compatibility, while the Micron part offers higher density without integrated safety features-making the Cypress device uniquely suited for certified automotive boot storage where ASIL-B and endurance partitioning are mandatory.
Availability
S28HL512TFPBHM013 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, industrial PLCs, medical imaging systems, and 5G baseband radios requiring stable component supply, long-term lifecycle support, and AEC-Q100 Grade 1 qualification.
Supply support for S28HL512TFPBHM013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and microcontroller solutions for automotive, industrial, and communications markets, with emphasis on functional safety and long-lifecycle support.
This device belongs to the Semper® Flash with Octal Interface product line, engineered specifically for safety-critical boot and firmware storage in automotive ECUs and industrial controllers demanding ASIL-B compliance, high endurance, and deterministic initialization.
FAQ
What is the maximum clock frequency supported in DDR mode?
The S28HL512TFPBHM013 supports DDR operation at up to 200 MHz, delivering 400 MBps effective read throughput. This is confirmed in the performance summary table (Page 2 of datasheet 002-23881 Rev. *A) and validated across all temperature grades including AEC-Q100 Grade 1 (−40 °C to +125 °C).
Does this part support both octal and legacy SPI interfaces simultaneously?
No - the interface mode is selected at power-on via SFDP register configuration; it operates exclusively in either octal (x8) or legacy SPI (x1) mode. The DQ[7:0] pins function as bidirectional octal I/O in OPI mode or as SI/SO plus hold/write-protect in SPI mode, per Table 1 (Page 5).
How is SafeBoot functionality triggered and verified?
SafeBoot activates automatically during power-on reset and validates configuration registers, memory array integrity, and embedded algorithm controller readiness. Failure triggers INT# assertion and reports status via Status Register bits (SR[15:12]), documented in Section "SafeBoot" (Page 6) and register map (Page 8).
What package variant does the '013' suffix indicate?
The '013' suffix denotes the x1 default boot configuration in the 24-ball BGA, 6 × 8 mm package (VAA024), halogen-free and lead-free, with AEC-Q100 Grade 1 temperature rating (−40 °C to +125 °C), as defined in the Ordering Information table (Page 7).
S28HL512TFPBHM013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- SEMPER™
- Package/Case:
- 24-VBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Octal I/O
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- 1.7ms
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S28HL512TFPBHM013 FAQ
1.How can I place an order for S28HL512TFPBHM013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S28HL512TFPBHM013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S28HL512TFPBHM013 reliable?
The price and inventory of S28HL512TFPBHM013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S28HL512TFPBHM013 is usually 5 days.
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S28HL512TFPBHM013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S28HL512TFPBHM013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S28HL512TFPBHM013?
For technical support, including S28HL512TFPBHM013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S28HL512TFPBHM013 requirements.
6.How does Aetrix verify that S28HL512TFPBHM013 is sourced from the original manufacturer or authorized distributors?
All S28HL512TFPBHM013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S28HL512TFPBHM013 meets industry standards.
7.What is the process for return or replacement of S28HL512TFPBHM013?
All S28HL512TFPBHM013 units undergo pre-shipment inspection (PSI). If there is an issue with S28HL512TFPBHM013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S28HL512TFPBHM013 part is unused and in its original packaging.
Return procedure for S28HL512TFPBHM013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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