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Infineon Technologies S28HL512TFPBHV010

Part No.:
S28HL512TFPBHV010
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS28HL512TFPBHV010.pdf
Description:
IC FLASH 512MBIT SPI/OCTL 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,958

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Product details

Overview

S28HL512TFPBHV010 from Cypress Semiconductor is a 512-Mb (64-MB) 3.0-V Semper® Flash NOR memory with Octal xSPI interface, ISO 26262 ASIL-B compliant functional safety architecture, 24-ball 6×8 mm BGA package, and supports up to 400 MBps DDR read throughput at 200 MHz clock. It serves as high-reliability boot and code storage in automotive ADAS ECUs requiring deterministic startup and data integrity.

For engineers reviewing the S28HL512TFPBHV010 datasheet, S28HL512TFPBHV010 pinout, S28HL512TFPBHV010 application, or S28HL512TFPBHV010 equivalent, key selection criteria include octal DDR read performance, ASIL-B certification status, EnduraFlex™ partitioning for endurance/retention trade-offs, and hardware reset via dedicated RESET# pin.

Technical Context

This device implements Cypress's 45-nm MirrorBit® technology with dual-bit-per-cell storage and a dual-controller architecture: Host Interface Controller (HIC) handles real-time signal timing and transaction framing, while Embedded Algorithm Controller (EAC) executes autonomous program/erase sequences and SafeBoot initialization checks. It natively supports JEDEC JESD251-compliant xSPI protocols.

The memory array uses hybrid sector architecture-thirty-two 4 KB sectors (top/bottom configurable) plus uniform 256 KB sectors-and integrates SECDED ECC, interface CRC, Data Integrity CRC, and Sector Erase Status reporting to meet automotive functional safety requirements without external error-handling logic.

Key Specifications

ParameterValue and Actual Design Meaning
Density512 Mb (64 MB) main array with 1024-byte OTP secure silicon region
InterfaceOctal xSPI (8D-8D-8D DDR/SDR) + legacy SPI; supports JESD251 standard
Read ThroughputUp to 400 MBps (DDR mode, 200 MHz CK, HS-T); 332 MBps (DDR, HL-T)
EnduranceMin. 1,280,000 program-erase cycles for main array; 300,000 for 4 KB sectors
Data RetentionMinimum 25 years at +85 °C; extended via EnduraFlex™ long-retention partitions
Voltage RangeHL-T: 2.7 V to 3.6 V core/I/O; operates across Industrial Plus (−40 °C to +105 °C)
Safety CertificationISO 26262 ASIL-B compliant; ASIL-D ready with system-level integration

Pinout & Package

Package: 24-ball BGA, 6 × 8 mm, 1.0-mm pitch, halogen-free, lead-free (RoHS), VAA024 footprint.

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip SelectMandatory active-low enable; initiates all transactions and places outputs in high-Z when deasserted
CKClock InputMandatory rising/falling edge sampling; supports SDR (166 MHz) and DDR (200 MHz) modes
DQ[7:0]Bidirectional Data BusOctal I/O for command/address/data; also functions as SI/SO in legacy SPI mode
DSData Strobe OutputMandatory synchronized toggle during read; enables precise data capture at >166 MHz
RESET#Hardware ResetOptional active-low pin with internal weak pull-up; forces safe reinitialization independent of CS# state
INT#Interrupt OutputOpen-drain status indicator for completion of program/erase or ECC error detection
VCC / VCCQPower SuppliesVCC = core supply (2.7–3.6 V); VCCQ = I/O supply (same range); separate domains reduce noise coupling
VSS / VSSQGround ReturnsSeparate core and I/O grounds improve signal integrity and EMI performance

Key Features

FeatureDesign Value
EnduraFlex™ ArchitectureEnables runtime partitioning of memory into high-endurance (≥1M cycles) and long-retention (25-year) zones per application need
SafeBoot InitializationVerifies configuration integrity at power-on and auto-recovers from corruption using redundant boot parameters
Embedded SECDED ECCCorrects single-bit errors and detects double-bit errors on-the-fly during read without host intervention
Interface CRC ProtectionEnd-to-end checksum over command/address/data transfers prevents undetected communication corruption
AutoBoot ModeDelivers immediate array access post-power-up, eliminating wait states before first instruction fetch

Applications

Automotive ADAS Domain ControllerIndustrial PLC Firmware Storage

Use Scenario: Stores boot firmware and real-time sensor fusion algorithms in radar/EPS ECUs where deterministic startup and fault-free execution are mandatory.

IC Role / Device Role / Timing Role: Primary nonvolatile code storage with ASIL-B-certified integrity monitoring and SafeBoot recovery.

Use Value: Eliminates external error-checking logic and reduces BOM count while meeting ISO 26262 diagnostic coverage targets.

Use Scenario: Holds field-upgradable control logic and safety-critical motion profiles in programmable logic controllers operating in harsh factory environments.

IC Role / Device Role / Timing Role: High-endurance flash for frequent firmware updates with guaranteed 300K-cycle endurance in 4 KB sectors.

Use Value: Enables over-the-air updates without wear leveling firmware, reducing development effort and validation scope.

Medical Imaging System Boot ROMAvionics Display Processor Code Memory

Use Scenario: Stores certified boot loader and DICOM protocol stack in portable ultrasound devices requiring 25-year data retention under thermal cycling.

IC Role / Device Role / Timing Role: Long-retention partitioned memory with EnduraFlex™-configured zones for critical calibration data.

Use Value: Meets IEC 62304 Class C software lifecycle requirements without periodic refresh or backup mechanisms.

Use Scenario: Provides deterministic boot image for DO-254-compliant display processors in cockpit multifunction displays.

IC Role / Device Role / Timing Role: ASIL-B-aligned NOR flash with hardware reset (RESET#) and DS-synchronized reads for timing-critical frame buffer initialization.

Use Value: Guarantees sub-100 µs boot latency and eliminates jitter-induced display artifacts during power sequencing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-reliability NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S28HL512TFPBHV030Same die, 8×8 mm BGA (VAC024), higher thermal mass; identical electrical specs and safety certificationPreferred for high-vibration environments (e.g., off-road vehicle ECUs) due to larger pad area and improved mechanical robustnessSelect when board-level shock/vibe testing exceeds 50 g; no redesign needed beyond footprint change
S28HS512TGABHV0101.8-V HS-T variant; same 6×8 mm BGA; lower active current (156 mA vs. 75 mA @200 MHz DDR) but reduced voltage marginUsed in low-power battery-backed modules where 1.8-V rail stability is guaranteed and thermal headroom is constrainedChoose only if system power architecture mandates 1.8-V core; not drop-in compatible due to VCC/VCCQ voltage mismatch

Compared with S28HL512TFPBHV010, the 030 variant offers mechanical reliability gains without electrical trade-offs, while the HS-T alternative sacrifices voltage flexibility for lower dynamic power-making the HL-T version optimal for industrial-plus temperature and mixed-voltage systems.

Availability

S28HL512TFPBHV010 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, industrial PLC firmware storage, and medical imaging boot ROMs requiring stable component supply, long-term lifecycle support, and ASIL-B compliance documentation.

Supply support for S28HL512TFPBHV010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance, safety-certified memory and microcontroller solutions for automotive, industrial, and communications markets.

This part belongs to the Semper® Flash with Octal Interface product line, engineered specifically for functional safety-critical systems requiring deterministic boot, embedded ECC, and seamless integration with xSPI-capable SoCs.

FAQ

Is S28HL512TFPBHV010 pin-compatible with earlier Semper Flash devices like S28HL01GT?

No. While both use 24-ball BGA packages, S28HL01GT uses an 8×8 mm (VAC024) footprint versus the 6×8 mm (VAA024) of S28HL512TFPBHV010. Pin assignments differ significantly-especially for DNU locations and VCCQ/VSSQ distribution-requiring PCB layout revision for migration.

Does this device support Quad SPI mode, or only Octal and legacy SPI?

S28HL512TFPBHV010 does not support native Quad SPI (x4). It supports only legacy Single I/O SPI (x1) and full Octal I/O (x8) modes per JESD251. Quad mode is not implemented in its command set or pin mapping; DQ2–DQ7 are unused in SPI mode and reserved for octal operation.

What is the role of the DNU pins, and can they be left floating?

DNU (Do Not Use) pins-including balls A1, A2, D1, D2, and E1-are internally unconnected and must remain unpopulated or electrically isolated. They may not be tied to VCC, GND, or any signal. Leaving them floating is acceptable per Cypress design rules, but solder mask should fully cover them to prevent accidental shorts.

How does SafeBoot detect and recover from configuration corruption?

SafeBoot validates SFDP parameter headers, boot configuration registers, and redundant copy flags at power-on. If mismatches are found, it loads factory-default boot settings from protected ROM, logs the event via INT#, and enters a known-safe state-enabling host firmware to initiate repair without manual intervention or device replacement.

S28HL512TFPBHV010 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
SEMPER™
Package/Case:
24-VBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR (SLC)
Memory Size:
512Mbit
Memory Organization:
64M x 8
Memory Interface:
SPI - Octal I/O
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
1.7ms
Access Time:
6.5 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S28HL512TFPBHV010 FAQ

1.How can I place an order for S28HL512TFPBHV010 through Aetrix?

Please submit a Request for Quotation (RFQ) for S28HL512TFPBHV010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S28HL512TFPBHV010 reliable?

The price and inventory of S28HL512TFPBHV010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S28HL512TFPBHV010 is usually 5 days.

3.What payment methods are accepted for S28HL512TFPBHV010?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S28HL512TFPBHV010 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S28HL512TFPBHV010?

S28HL512TFPBHV010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S28HL512TFPBHV010 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S28HL512TFPBHV010?

For technical support, including S28HL512TFPBHV010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S28HL512TFPBHV010 requirements.

6.How does Aetrix verify that S28HL512TFPBHV010 is sourced from the original manufacturer or authorized distributors?

All S28HL512TFPBHV010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S28HL512TFPBHV010 meets industry standards.

7.What is the process for return or replacement of S28HL512TFPBHV010?

All S28HL512TFPBHV010 units undergo pre-shipment inspection (PSI). If there is an issue with S28HL512TFPBHV010, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S28HL512TFPBHV010 part is unused and in its original packaging.

Return procedure for S28HL512TFPBHV010:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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