Infineon Technologies S28HL512TFPBHV013
- Part No.:
- S28HL512TFPBHV013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S28HL512TFPBHV013.pdf
- Description:
- IC FLASH 512MBIT SPI/OCTL 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,184
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Product details
Overview
S28HL512TFPBHV013 from Cypress Semiconductor (now Infineon) is a 512-Mb (64-MB), 3.0-V supply, Octal-interface NOR flash memory with JEDEC JESD251 compliance, 400 MBps DDR read throughput, and ISO 26262 ASIL-B compliance for automotive safety-critical boot code storage in ADAS ECUs.
For engineers reviewing the S28HL512TFPBHV013 datasheet, S28HL512TFPBHV013 pinout, S28HL512TFPBHV013 application, or S28HL512TFPBHV013 equivalent, key selection criteria include octal DDR timing margin, EnduraFlex partitioning for mixed endurance/retention requirements, SafeBoot initialization reporting, and AEC-Q100 Grade 2 (−40 °C to +105 °C) qualification.
Technical Context
This device implements Cypress's 45-nm MirrorBit® technology with dual-bit-per-cell storage and supports both uniform (all 256 KB sectors) and hybrid sector architectures (32 × 4 KB + remainder 256 KB). Its Host Interface Controller (HIC) and Embedded Algorithm Controller (EAC) operate in parallel to decouple host command handling from embedded erase/program execution.
The octal interface operates in SDR (up to 166 MHz / 166 MBps) or DDR (up to 166 MHz / 332 MBps) modes with mandatory Data Strobe (DS) for timing-critical read capture. Built-in SECDED ECC corrects single-bit errors and detects double-bit errors across the main array, while Interface CRC validates all command/address/data transfers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (64 MB) - sufficient for full firmware image + OTA update partition in automotive domain controllers |
| Supply Voltage | 2.7 V to 3.6 V (HL-T) - compatible with standard 3.3-V industrial and automotive power rails |
| Read Throughput | 332 MBps (Octal DDR @ 166 MHz) - enables sub-200 ms full-image boot from flash in real-time systems |
| Endurance | 1.28M program-erase cycles (main array) - supports frequent firmware updates over 15+ year vehicle lifetime |
| Data Retention | 25 years at +105 °C - validated for Industrial Plus and AEC-Q100 Grade 2 operation |
| Safety Certification | ISO 26262 ASIL-B compliant, ASIL-D ready - meets functional safety requirements for boot ROM in safety islands |
| Interface Standard | JEDEC JESD251 eXpanded SPI (xSPI) - ensures interoperability with modern SoC boot controllers (e.g., NXP S32G, Renesas RH850) |
Pinout & Package
24-ball BGA package (6 × 8 mm, 1.0-mm pitch), halogen-free and lead-free, qualified for reflow per J-STD-020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable signal; drives device into standby when HIGH; required for all transactions |
| CK | Clock Input | Rising-edge–latched in SDR; both-edge–latched in DDR; defines timing for all serial transfers |
| DQ[7:0] | Bidirectional Data Bus | Octal I/O for command/address/data in x8 mode; DQ0/DQ1 used as SI/SO in legacy x1 SPI fallback |
| DS | Data Strobe Output | Source-synchronous toggle signal aligned with read data edges; essential for reliable capture at >100 MHz |
| RESET# | Hardware Reset | Optional active-low reset with internal weak pull-up; returns device to array-read state independent of CS# state |
| INT# | Interrupt Output | Open-drain status indicator for completion of program/erase or ECC error detection; requires external 5–10 kΩ pull-up |
| VCC / VCCQ | Power Supplies | VCC = core logic (2.7–3.6 V); VCCQ = I/O drivers (same voltage); separate supplies reduce noise coupling |
| VSS / VSSQ | Ground Returns | VSS = core ground; VSSQ = I/O ground; split grounds improve signal integrity for high-speed octal interface |
Key Features
| Feature | Design Value |
|---|---|
| EnduraFlex™ Architecture | Enables runtime partitioning of memory into high-endurance (1M+ cycles) and long-retention (25-year) zones via host configuration |
| SafeBoot Initialization | Reports boot failure causes (e.g., configuration corruption, CRC mismatch) and provides recovery paths without host intervention |
| Sector Erase Status Indicator | Per-sector flag indicating successful/failed erase completion - critical for robust power-loss recovery in field updates |
| Serial Flash Discoverable Parameters (SFDP) | Standardized JEDEC register map enabling automatic host controller configuration without hard-coded timing tables |
| OTP Secure Silicon Array | 1024-byte one-time-programmable region for storing cryptographic keys, calibration data, or unique device IDs |
Applications
| Automotive ADAS ECU Boot Memory | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot code and safety monitor firmware for radar processing units requiring ASIL-B compliance and fast cold-boot. IC Role / Device Role / Timing Role: Primary nonvolatile boot ROM accessed directly by ARM Cortex-R5F during POR sequence; delivers executable code via octal DDR burst reads. Use Value: 332 MBps read rate reduces boot time by >40% vs. quad-SPI alternatives; SafeBoot ensures deterministic initialization under voltage transients. | Use Scenario: Holds firmware and configuration data for programmable logic controllers operating in harsh factory environments with wide temperature swings. IC Role / Device Role / Timing Role: System-level firmware repository supporting field upgrades and secure parameter storage; accessed via SPI fallback during diagnostics. Use Value: 25-year retention at +105 °C eliminates need for periodic refresh; EnduraFlex allows dedicated 4 KB sectors for frequently updated I/O mapping tables. |
| Medical Imaging Subsystem Code Storage | Avionics Display Unit Boot Image |
Use Scenario: Stores certified boot loader and DICOM protocol stack in portable ultrasound devices requiring FDA Class II software validation. IC Role / Device Role / Timing Role: Trusted execution root-of-trust component; verified by hardware-assisted secure boot chain prior to loading application firmware. Use Value: Interface CRC prevents undetected corruption during ESD events; built-in ECC eliminates need for software-level checksum overhead. | Use Scenario: Holds boot firmware and graphics assets for cockpit display units subject to DO-160 lightning-induced transient testing. IC Role / Device Role / Timing Role: High-reliability code storage with redundant read verification; configured with hybrid sector architecture for fast partial updates. Use Value: AEC-Q100 Grade 2 qualification ensures operation up to +105 °C; DS-strobed reads maintain timing margin under EMI stress. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NOR flash boot memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S28HS512TGABHV013 | 1.8-V supply (HS-T), same density and package; 400 MBps DDR at 200 MHz vs. 332 MBps at 166 MHz | Requires 1.8-V rail; better suited for low-power infotainment SoCs with integrated 1.8-V LDOs | Select when system power architecture uses 1.8-V core/I/O and higher clock stability permits 200 MHz DDR |
| MX66UM1G45GXDIO | Micron 1-Gb octal flash; 400 MBps DDR @ 200 MHz; no ASIL-B certification; different SFDP layout | Lacks ISO 26262 qualification; requires additional host-side safety mechanisms for automotive use | Consider only for non-safety-critical industrial applications where cost sensitivity outweighs functional safety requirements |
Compared with S28HL512TFPBHV013, the HS-T variant trades supply voltage compatibility for higher DDR bandwidth, while the Micron alternative offers greater density but omits automotive safety certification and requires redesign of boot ROM initialization routines.
Availability
S28HL512TFPBHV013 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial PLCs, medical imaging subsystems, and avionics display units requiring stable component supply across extended product lifecycles.
Supply support for S28HL512TFPBHV013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor was acquired by Infineon Technologies in 2020 and now operates as Infineon's Memory Solutions division, specializing in high-reliability nonvolatile memory for automotive, industrial, and aerospace applications.
This part belongs to the Semper® Flash with Octal Interface product line, engineered specifically for functional safety–critical boot and firmware storage in next-generation automotive domain controllers and real-time embedded systems.
FAQ
What is the purpose of the DS (Data Strobe) pin on S28HL512TFPBHV013?
The DS pin is a source-synchronous output that toggles in phase with read data on DQ[7:0] during octal interface operations. It enables precise data capture at high frequencies (up to 166 MHz DDR) by providing a dedicated timing reference, eliminating setup/hold margin constraints imposed by clock-to-out skew in conventional interfaces.
Does S28HL512TFPBHV013 support legacy SPI mode in addition to octal interface?
Yes - it supports x1 SPI (SI/SO on DQ0/DQ1) as a fallback interface per JEDEC JESD251. This mode operates at up to 166 MHz SDR (20.75 MBps), allowing compatibility with legacy boot controllers while retaining access to SFDP, ECC, and SafeBoot features without requiring octal-capable hardware.
How does EnduraFlex™ Architecture affect memory partitioning in practice?
EnduraFlex allows the host to define nonvolatile partitions with distinct endurance/retention profiles using dedicated configuration commands. For example, 32 × 4 KB sectors can be assigned to high-endurance mode (1.28M cycles) for logging buffers, while the remaining 256 KB sectors remain in long-retention mode (25 years) for immutable firmware images - all within the same physical die.
Is RESET# pin required for normal operation of S28HL512TFPBHV013?
No - RESET# is optional and internally pulled up. The device performs full initialization on power-on reset (POR) and remains functional with CS# control alone. RESET# is provided for synchronous system-level reset events; when asserted, it forces immediate return to array-read state and places DQ/DS in high-impedance, independent of CS# level.
S28HL512TFPBHV013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- SEMPER™
- Package/Case:
- 24-VBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Octal I/O
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- 1.7ms
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S28HL512TFPBHV013 FAQ
1.How can I place an order for S28HL512TFPBHV013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S28HL512TFPBHV013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S28HL512TFPBHV013 reliable?
The price and inventory of S28HL512TFPBHV013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S28HL512TFPBHV013 is usually 5 days.
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4.How is shipping managed for S28HL512TFPBHV013?
S28HL512TFPBHV013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S28HL512TFPBHV013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S28HL512TFPBHV013?
For technical support, including S28HL512TFPBHV013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S28HL512TFPBHV013 requirements.
6.How does Aetrix verify that S28HL512TFPBHV013 is sourced from the original manufacturer or authorized distributors?
All S28HL512TFPBHV013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S28HL512TFPBHV013 meets industry standards.
7.What is the process for return or replacement of S28HL512TFPBHV013?
All S28HL512TFPBHV013 units undergo pre-shipment inspection (PSI). If there is an issue with S28HL512TFPBHV013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S28HL512TFPBHV013 part is unused and in its original packaging.
Return procedure for S28HL512TFPBHV013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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