Infineon Technologies S28HS01GTFPBHI030
- Part No.:
- S28HS01GTFPBHI030
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S28HS01GTFPBHI030.pdf
- Description:
- IC FLASH 1GBIT SPI/OCTAL 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,161
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S28HS01GTFPBHI030 from Cypress Semiconductor is a 1-Gb (128-MB) high-reliability NOR flash memory with Octal xSPI interface, operating at 1.7–2.0 V core/I/O (HS-T), housed in an 8×8 mm 24-ball BGA package. It delivers up to 400 MBps DDR read throughput, supports ISO 26262 ASIL-B compliance and ASIL-D readiness, and features EnduraFlex™ architecture for configurable endurance/retention partitions-used in automotive ADAS boot code storage and industrial controller firmware.
For engineers reviewing the S28HS01GTFPBHI030 datasheet, S28HS01GTFPBHI030 pinout, S28HS01GTFPBHI030 application, or S28HS01GTFPBHI030 equivalent, key selection criteria include octal DDR timing compliance, 2.56M program-erase cycles, SFDP support, SafeBoot initialization reporting, and AEC-Q100 Grade 2 (−40 °C to +105 °C) qualification.
Technical Context
This device implements Cypress's 45-nm MirrorBit® technology with two bits per cell and supports both uniform (all 256 KB sectors) and hybrid sector architectures (32 × 4 KB + remainder 256 KB). Its Host Interface Controller (HIC) and Embedded Algorithm Controller (EAC) operate in parallel to manage JEDEC JESD251-compliant xSPI transactions and autonomous embedded algorithms for erase/program.
The octal interface operates in SDR (200 MHz, 200 MBps) or DDR (200 MHz, 400 MBps) modes with mandatory Data Strobe (DS) for timing-critical read capture. Built-in SECDED ECC corrects single-bit errors and detects double-bit errors in the main array, while Interface CRC and Data Integrity CRC protect communication and stored data respectively.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Gb (128 MB) - provides sufficient space for full automotive boot images and secure firmware partitions |
| Interface Standard | JEDEC JESD251 xSPI compliant octal (8D-8D-8D) - reduces pin count vs parallel NOR while enabling DDR burst reads |
| Max Read Throughput | 400 MBps (DDR mode, 200 MHz clock) - enables sub-300 ms boot time for 128 MB firmware image |
| Endurance | 2,560,000 program-erase cycles (main array) - supports >10 years of field firmware updates in industrial gateways |
| Data Retention | 25 years minimum at 85 °C - ensures long-term reliability in uncooled automotive ECUs |
| Functional Safety | ISO 26262 ASIL-B compliant, ASIL-D ready - meets requirements for safety-critical boot memory in ADAS systems |
| Operating Voltage | 1.7 V to 2.0 V (HS-T) - compatible with low-voltage SoC I/O domains and reduces system power consumption |
| Temperature Range | −40 °C to +105 °C (AEC-Q100 Grade 2) - qualified for under-hood automotive applications |
Pinout & Package
Package: 24-ball BGA, 8 mm × 8 mm, 1.0 mm pitch, halogen-free and lead-free (RoHS compliant).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable signal; all transactions begin/end with CS# edge transitions; places outputs in high-Z when deasserted |
| CK | Clock Input | Rising-edge latched in SDR; both edges used in DDR; defines timing for command/address/data transfer |
| DQ[7:0] | Bidirectional Data I/O | Octal data bus for commands, addresses, and payload; supports legacy SPI (DQ0/DQ1 only) and full x8 mode |
| DS | Data Strobe Output | Source-synchronous strobe toggling during read bursts; simplifies high-speed data capture without external PLL |
| RESET# | Hardware Reset Input | Asynchronous active-low reset; forces device into array read state and disables DQ/DS; includes internal weak pull-up |
| INT# | Interrupt Output | Open-drain status indicator; asserts LOW on completion of program/erase or ECC error detection with address trapping |
| VCC / VCCQ | Power Supplies | VCC = 1.7–2.0 V core supply; VCCQ = same voltage for I/O drivers - eliminates level-shifting in 1.8 V systems |
| VSS / VSSQ | Ground Returns | Separate core (VSS) and I/O (VSSQ) grounds reduce noise coupling between logic and interface circuits |
Key Features
| Feature | Design Value |
|---|---|
| EnduraFlex™ Architecture | Enables host-defined partitions with up to 1M+ cycles (high-endurance) or 25-year retention (long-life), configurable per application need |
| SafeBoot Initialization | Detects configuration corruption at power-on and executes recovery routines - prevents boot failure due to flash metadata corruption |
| Sector Erase Status Reporting | Per-sector flag indicates success/failure after erase - allows host to handle partial failures without full chip reinitialization |
| Serial Flash Discoverable Parameters (SFDP) | Standardized JEDEC register map enables automatic driver configuration without hard-coded timing parameters |
| OTP Secure Silicon Array | 1024-byte one-time-programmable region stores cryptographic keys, device IDs, or calibration data with hardware lock protection |
| AutoBoot Mode | Immediate memory access post-power-on without host command sequence - reduces boot latency in safety-critical systems |
Applications
| Automotive ADAS ECU Boot Memory | Industrial PLC Firmware Storage |
|---|---|
|
Use Scenario: Stores boot code and safety monitor firmware for radar processing units requiring ASIL-B compliance. IC Role / Device Role / Timing Role: Primary nonvolatile boot memory with deterministic read latency and SafeBoot validation. Use Value: 400 MBps DDR read speed enables <300 ms cold boot; ASIL-B certification eliminates need for external safety co-processor. |
Use Scenario: Holds field-upgradable control logic and configuration data in programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: High-endurance firmware repository supporting over-the-air updates every 3 months for 10+ years. Use Value: 2.56M program-erase cycles and EnduraFlex partitioning extend service life beyond 15 years without replacement. |
| Medical Imaging System Configuration | Avionics Display Module Code Storage |
|
Use Scenario: Stores calibrated sensor profiles and UI assets in portable ultrasound devices requiring data integrity verification. IC Role / Device Role / Timing Role: Secure configuration store with Data Integrity CRC and OTP-locked calibration constants. Use Value: Built-in SECDED ECC and dual-CRC protection ensure zero uncorrectable bit errors over 25-year product lifecycle. |
Use Scenario: Holds certified display boot firmware and graphics assets in DO-178C Level A avionics displays. IC Role / Device Role / Timing Role: Certified nonvolatile memory with traceable SafeBoot reporting and sector-level erase status. Use Value: AEC-Q100 Grade 2 qualification plus −40 °C to +105 °C operation meets extended temperature requirements for cockpit displays. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-reliability NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S28HL01GTFCBHI030 | 3.0 V HL-T variant (2.7–3.6 V); lower max DDR throughput (332 MBps at 166 MHz); identical package and pinout | Used where legacy 3.3 V I/O domains dominate; lacks ASIL-D readiness path; higher standby current (0.014 mA vs 0.011 mA) | Select when interfacing with older 3.3 V microcontrollers and ASIL-D readiness is not required. |
| MX66UM1G45GXDIO | Micron 1 Gb octal flash; 1.7–2.0 V; 400 MBps DDR; no built-in ASIL-B certification; uses different SFDP layout and ECC implementation | Requires external safety monitoring for functional safety use; lacks SafeBoot and EnduraFlex; supports Xccela™ but not full JESD251 compliance | Choose for cost-sensitive industrial applications where ISO 26262 compliance is not mandated. |
Compared with S28HL01GTFCBHI030 and MX66UM1G45GXDIO, the S28HS01GTFPBHI030 uniquely combines ASIL-B certification, SafeBoot, and EnduraFlex in a single 1.8 V octal flash-enabling certified boot solutions without external safety logic or endurance management firmware.
Availability
S28HS01GTFPBHI030 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial PLCs, and medical imaging systems requiring stable component supply, long-term lifecycle support, and certified functional safety compliance.
Supply support for S28HS01GTFPBHI030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance, safety-certified memory and microcontroller solutions for automotive, industrial, and aerospace applications.
The Semper® Flash family targets functional safety-critical systems requiring certified boot memory, offering integrated diagnostics, configurable endurance, and JEDEC-standardized xSPI interfaces for seamless SoC integration.
FAQ
Does S28HS01GTFPBHI030 support both SDR and DDR octal read modes?
Yes, it supports both SDR (200 MHz, 200 MBps) and DDR (200 MHz, 400 MBps) octal read modes per JEDEC JESD251. The DS signal is active in both modes to synchronize read data capture. Mode selection is configured via status register bits and requires no hardware change.
What is the purpose of the DNU pins in the 24-ball BGA package?
DNU (Do Not Use) pins are reserved, unconnected die pads with no internal bonding. They must remain floating and unconnected on PCB layout to prevent electrical interference or mechanical stress. Cypress explicitly warns against ultrasonic cleaning or exposure above 150 °C due to BGA package sensitivity.
How does SafeBoot detect and recover from configuration corruption?
SafeBoot validates boot configuration registers and SFDP parameter tables at power-on. If corruption is detected, it triggers a fallback to factory-default settings and reports the event via INT# assertion and status register flags, allowing host firmware to initiate recovery without manual intervention.
Can the 4 KB sectors be programmed independently of the 256 KB sectors?
Yes, the hybrid sector architecture allows independent programming and erasing of 4 KB and 256 KB sectors. Each 4 KB sector has its own protection register and erase counter. Programming uses the same 256/512-byte page buffer regardless of sector size, with verified write-through behavior per JEDEC spec.
S28HS01GTFPBHI030 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- SEMPER™
- Package/Case:
- 24-VBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Octal I/O
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- 1.7ms
- Access Time:
- 5.45 ns
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (8x8)
S28HS01GTFPBHI030 FAQ
1.How can I place an order for S28HS01GTFPBHI030 through Aetrix?
Please submit a Request for Quotation (RFQ) for S28HS01GTFPBHI030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S28HS01GTFPBHI030 reliable?
The price and inventory of S28HS01GTFPBHI030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S28HS01GTFPBHI030 is usually 5 days.
3.What payment methods are accepted for S28HS01GTFPBHI030?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S28HS01GTFPBHI030 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S28HS01GTFPBHI030?
S28HS01GTFPBHI030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S28HS01GTFPBHI030 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S28HS01GTFPBHI030?
For technical support, including S28HS01GTFPBHI030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S28HS01GTFPBHI030 requirements.
6.How does Aetrix verify that S28HS01GTFPBHI030 is sourced from the original manufacturer or authorized distributors?
All S28HS01GTFPBHI030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S28HS01GTFPBHI030 meets industry standards.
7.What is the process for return or replacement of S28HS01GTFPBHI030?
All S28HS01GTFPBHI030 units undergo pre-shipment inspection (PSI). If there is an issue with S28HS01GTFPBHI030, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S28HS01GTFPBHI030 part is unused and in its original packaging.
Return procedure for S28HS01GTFPBHI030:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S28HS01GTFPBHI030 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

