Infineon Technologies S28HS01GTFPBHI033

Overview

S28HS01GTFPBHI033 from Cypress Semiconductor is a 1-Gb (128-MB) high-reliability NOR flash memory with Octal xSPI interface, 1.8-V core/I/O supply (HS-T), and AEC-Q100 Grade 2 automotive qualification (−40 °C to +105 °C). It delivers up to 400 MBps DDR read throughput, supports 2.56M program-erase cycles in main array, features EnduraFlex™ partitioning for endurance/retention optimization, and integrates SECDED ECC, interface CRC, SafeBoot, and hardware reset via dedicated RESET# pin. Used in automotive ADAS domain controllers for boot code storage and firmware updates.

For engineers reviewing the S28HS01GTFPBHI033 datasheet, S28HS01GTFPBHI033 pinout, S28HS01GTFPBHI033 application, or S28HS01GTFPBHI033 equivalent, key selection criteria include ASIL-B compliance, octal DDR timing margin at 200 MHz, 8×8 mm 24-ball BGA package compatibility, and hybrid sector architecture support for secure firmware partitioning.

Technical Context

This device implements Cypress's 45-nm MirrorBit® technology with dual-bit-per-cell storage and a dual-controller architecture: Host Interface Controller (HIC) handles real-time signal management and data transfer, while Embedded Algorithm Controller (EAC) executes autonomous program/erase sequences and error recovery. The HIC supports both legacy SPI (1S-1S-1S) and JEDEC JESD251-compliant Octal Peripheral Interface (8S-8S-8S / 8D-8D-8D).

It features configurable page programming buffers (256/512 bytes), SFDP-based parameter discovery, and three sector architecture modes-uniform 256 KB, hybrid top/bottom 4 KB, or split 4 KB-enabling flexible firmware layout. Data integrity is enforced via on-the-fly interface CRC, memory array Data Integrity CRC, and SECDED ECC with address trapping on double-bit errors.

Key Specifications

Pinout & Package

Package: 24-ball BGA, 8 × 8 mm, 1.0-mm pitch (VAC024), halogen-free and lead-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-reliability NOR flash applications.

Compared with S28HL01GTFCBHI033 and MX66UM1G45GXDIO, the S28HS01GTFPBHI033 uniquely delivers ASIL-B certification, 25-year retention at 105 °C, and integrated SafeBoot recovery - making it the sole option for automotive safety-critical boot memory where certification evidence and autonomous fault recovery are mandatory.

Availability

S28HS01GTFPBHI033 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, industrial PLC firmware storage, and avionics flight management systems requiring stable component supply across extended product lifecycles.

Supply support for S28HS01GTFPBHI033 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance, reliable semiconductor solutions for automotive, industrial, and communications markets, with emphasis on functional safety and embedded systems.

The Semper® Flash with Octal Interface product line was developed specifically to replace legacy parallel NOR and quad-SPI flash in safety-critical automotive and industrial applications demanding ASIL-B compliance, high bandwidth, and long-term data integrity.

FAQ

Is S28HS01GTFPBHI033 pin-compatible with earlier Semper Flash devices like S28HS512T?

No - S28HS01GTFPBHI033 uses an 8 × 8 mm 24-ball BGA (VAC024), whereas S28HS512T uses a 6 × 8 mm 24-ball BGA (VAA024). Though both share identical pin functions and signal definitions, the ball pitch and footprint dimensions differ, requiring PCB redesign for migration. Mechanical drawings confirm distinct land patterns and solder mask openings.

Does this device support XIP (eXecute-In-Place) operation directly from flash?

Yes - the S28HS01GTFPBHI033 supports true XIP mode via its octal DDR interface, enabling CPU instruction fetch directly from flash memory without copying to RAM. This is validated by the 16-cycle initial access latency in DDR read mode and the presence of wrap-burst addressing mode in the command set, which maintains cache-line-aligned execution flow.

What is the purpose of the DNU pins in the 24-ball BGA package?

The DNU (Do Not Use) pins - located at positions A1, A2, B1, D1, and D5 - are reserved for future test or feature expansion and must remain unconnected in PCB layout. Connecting them may cause undefined behavior or damage, as confirmed in Cypress Application Note AN23881, Section 4.1, which explicitly prohibits routing or termination of DNU balls.

How does the EnduraFlex™ architecture allocate endurance and retention resources?

EnduraFlex™ allows host firmware to define up to four non-overlapping memory partitions via dedicated configuration registers. Each partition can be independently assigned either "High Endurance" (up to 1.28M cycles for 512 Mb-class equivalent) or "Long Retention" (25 years at 105 °C) attributes. Allocation is persistent across power cycles and enforced by the Embedded Algorithm Controller during program/erase operations.