Infineon Technologies S28HS01GTFPBHM030
- Part No.:
- S28HS01GTFPBHM030
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S28HS01GTFPBHM030.pdf
- Description:
- IC FLASH 1GBIT SPI/OCTAL 24FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,389
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Product details
Overview
S28HS01GTFPBHM030 from Cypress Semiconductor is a 1-Gb (128-MB) high-reliability NOR flash memory with Octal xSPI interface, operating at 1.7–2.0 V (HS-T), featuring ISO 26262 ASIL-B compliance and ASIL-D readiness for automotive safety-critical systems. It delivers up to 400 MBps DDR read throughput, supports 256 KB and 4 KB sector erase, and integrates EnduraFlex™ architecture for configurable endurance/retention partitions.
For engineers reviewing the S28HS01GTFPBHM030 datasheet, S28HS01GTFPBHM030 pinout, S28HS01GTFPBHM030 application, or S28HS01GTFPBHM030 equivalent, key selection criteria include octal DDR timing performance, functional safety certification status, sector protection granularity, ECC implementation (SECDED), and automotive-grade temperature support (−40 °C to +125 °C).
Technical Context
This device implements Cypress's 45-nm MirrorBit® technology with two bits per cell and dual-controller architecture: Host Interface Controller (HIC) handles protocol-level transactions (SPI/OPI), while Embedded Algorithm Controller (EAC) manages program/erase sequences, SafeBoot initialization, and error recovery autonomously. It supports JEDEC JESD251-compliant xSPI protocols including 8S-8S-8S SDR and 8D-8D-8D DDR modes.
The memory array uses hybrid sector architecture-32 × 4 KB sectors (top/bottom or split) plus uniform 256 KB sectors-and includes dedicated OTP secure silicon (1024 bytes), interface CRC, data integrity CRC, and hardware reset via RESET# or CS# signaling. Page programming buffer is configurable to 256 or 512 bytes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Gb (128 MB) - provides sufficient code storage for complex boot firmware and real-time OS in automotive ECUs. |
| Interface Protocol | Octal xSPI (8D-8D-8D DDR) - enables 400 MBps burst reads at 200 MHz clock, reducing host bus loading vs. quad-SPI. |
| Supply Voltage | 1.7–2.0 V core/I/O - compatible with low-voltage SoC domains and reduces power consumption in always-on modules. |
| Endurance | 2.56M program-erase cycles (main array) - supports frequent OTA update logging in telematics gateways. |
| Data Retention | 25 years minimum - ensures long-term reliability for infotainment firmware without refresh cycles. |
| Temperature Grade | AEC-Q100 Grade 1 (−40 °C to +125 °C) - qualified for engine control unit and ADAS sensor fusion applications. |
| ECC | SECDED (Single-bit Error Correction, Double-bit Error Detection) - corrects bit flips in memory array during read operations. |
Pinout & Package
Package: 24-ball BGA, 8 × 8 mm, 1.0-mm pitch (VAC024), halogen-free and lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable signal; drives device into standby when HIGH, except during internal operations. |
| CK | Serial Clock | Rising-edge latched for SDR; both edges for DDR; defines timing for command/address/data transfer. |
| DQ[7:0] | Bidirectional Data Bus | Carries commands, addresses, and data in octal mode; DQ0/DQ1 used as SI/SO in legacy SPI fallback. |
| DS | Data Strobe Output | Synchronizes output data capture in high-speed DDR reads; toggles only during active CS# read transactions. |
| RESET# | Hardware Reset Input | Asynchronous reset with weak internal pull-up; returns device to array read state on LOW-to-HIGH transition. |
| INT# | Interrupt Output | Open-drain signal indicating completion of program/erase or ECC error detection; requires external 5–10 kΩ pull-up. |
| VCC / VCCQ | Power Supplies | VCC powers core logic; VCCQ powers I/O drivers - allows independent voltage scaling for signal integrity. |
| VSS / VSSQ | Ground Returns | Separate analog/digital ground paths minimize noise coupling between memory array and interface circuitry. |
Key Features
| Feature | Design Value |
|---|---|
| ISO 26262 ASIL-B Compliance | Validated functional safety architecture enabling use in automotive safety-related systems without additional external safety mechanisms. |
| EnduraFlex™ Partitioning | Allows runtime configuration of memory regions for high-endurance (≥1M cycles) or long-retention (25-year) operation per application need. |
| SafeBoot Initialization | Detects configuration corruption at power-on and executes recovery routines to ensure deterministic boot behavior. |
| Interface CRC Protection | End-to-end checksum validation on all command/address/data transfers prevents miscommunication-induced corruption. |
| AutoBoot Mode | Enables immediate memory access after power-up without host-initiated configuration, reducing boot latency. |
Applications
| Automotive Engine Control Unit (ECU) | ADAS Sensor Fusion Module |
|---|---|
Use Scenario: Stores calibrated engine maps, diagnostic firmware, and real-time control algorithms requiring guaranteed execution on power-up. IC Role / Device Role / Timing Role: Primary nonvolatile code storage with SafeBoot and AutoBoot ensuring deterministic boot sequence within <50 ms. Use Value: ASIL-B compliance eliminates need for external safety monitors; 125 °C rating supports under-hood placement. | Use Scenario: Holds multi-sensor calibration data, neural network weights, and sensor preprocessing firmware updated over CAN FD. IC Role / Device Role / Timing Role: High-bandwidth code/data storage interfaced via octal DDR to reduce CPU wait states during image processing pipelines. Use Value: 400 MBps read speed accelerates firmware load time; SECDED ECC maintains integrity of critical AI model parameters. |
| Telematics Control Unit (TCU) | Infotainment Head Unit |
Use Scenario: Stores OTA update staging area, secure boot keys, and cellular modem firmware with frequent reprogramming cycles. IC Role / Device Role / Timing Role: Dual-partition EnduraFlex™ enables one region for high-cycle OTA updates and another for permanent firmware retention. Use Value: 2.56M endurance supports >10 years of daily OTA updates; interface CRC prevents corrupted downloads. | Use Scenario: Hosts Linux kernel, GUI assets, and voice recognition models requiring fast sequential read access and long-term data stability. IC Role / Device Role / Timing Role: Boot-time memory-mapped execution source with linear burst reads across full 128 MB address space. Use Value: 25-year data retention avoids periodic refresh; hybrid sector architecture allows fine-grained update of UI assets without erasing full firmware. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-reliability automotive NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Infineon S29GL512S11TFI010 | 512 Mb density, parallel interface (not xSPI), no ASIL-B certification, 166 MHz max read speed | Limited to legacy microcontroller designs lacking octal interface; unsuitable for new ASIL-B systems | Select only for cost-sensitive legacy platforms where bandwidth and safety certification are not required. |
| Macronix MX25L1G45GMI-13G | 1 Gb density, quad-SPI only (no octal DDR), no functional safety qualification, 133 MHz max read speed | Supports basic OTA but lacks SafeBoot, ECC, and automotive temperature grade beyond +105 °C | Acceptable for consumer-grade infotainment where safety and extended temperature are not mandated. |
Compared with S28HS01GTFPBHM030, the Infineon part trades bandwidth and safety for legacy compatibility, while the Macronix part offers density at lower interface performance and zero functional safety assurance-neither matches the integrated safety, speed, and temperature capability required for next-gen automotive ECU designs.
Availability
S28HS01GTFPBHM030 is available at Aetrix Electronics and suitable for automotive engine control units, ADAS sensor fusion modules, telematics control units, and infotainment head units requiring stable component supply across extended product lifecycles.
Supply support for S28HS01GTFPBHM030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a leader in high-reliability memory and microcontroller solutions for automotive, industrial, and communications markets.
This device belongs to the Semper® Flash with Octal Interface product line, designed specifically to meet functional safety requirements and high-bandwidth code storage needs in automotive electronic control units and ADAS systems.
FAQ
What is the difference between HS-T and HL-T voltage variants?
The HS-T variant (e.g., S28HS01GT) operates at 1.7–2.0 V and targets low-power, high-performance applications such as ADAS processors and domain controllers. The HL-T variant (e.g., S28HL01GT) uses 2.7–3.6 V and suits legacy 3.3-V system designs. Both share identical architecture, timing, and feature sets except for voltage tolerance and current consumption profiles.
Does S28HS01GTFPBHM030 support legacy SPI mode?
Yes-it supports standard 1S-1S-1S SPI mode alongside octal xSPI, using DQ0 as SI and DQ1 as SO. This fallback mode runs up to 21 MBps (166 MHz clock) and maintains JEDEC JESD251 compliance. The device automatically detects interface mode based on initial command sequence, enabling seamless migration from legacy to high-speed interfaces.
How does SafeBoot detect and recover from configuration corruption?
SafeBoot validates SFDP parameter tables, register settings, and boot configuration flags at power-on. If mismatched or invalid values are found, it triggers automatic recovery by reloading factory defaults from protected ROM or initiating a safe boot path from a known-good sector. Status is reported via INT# assertion and readable status registers, allowing host software to log or escalate faults.
Can the 4 KB and 256 KB sectors be mixed in the same memory map?
Yes-the hybrid sector architecture supports two configurations: either 32 × 4 KB sectors grouped at top or bottom (Configuration 1), or equally split between top and bottom (Configuration 2), with remaining address space allocated to uniform 256 KB sectors. This enables flexible firmware partitioning-for example, small 4 KB sectors for frequently updated calibration data and large 256 KB blocks for stable application code.
S28HS01GTFPBHM030 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- SEMPER™
- Package/Case:
- 24-VBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- SPI - Octal I/O
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- 1.7ms
- Access Time:
- 5.45 ns
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (8x8)
S28HS01GTFPBHM030 FAQ
1.How can I place an order for S28HS01GTFPBHM030 through Aetrix?
Please submit a Request for Quotation (RFQ) for S28HS01GTFPBHM030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S28HS01GTFPBHM030 reliable?
The price and inventory of S28HS01GTFPBHM030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S28HS01GTFPBHM030 is usually 5 days.
3.What payment methods are accepted for S28HS01GTFPBHM030?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S28HS01GTFPBHM030 transactions.
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4.How is shipping managed for S28HS01GTFPBHM030?
S28HS01GTFPBHM030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S28HS01GTFPBHM030 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S28HS01GTFPBHM030?
For technical support, including S28HS01GTFPBHM030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S28HS01GTFPBHM030 requirements.
6.How does Aetrix verify that S28HS01GTFPBHM030 is sourced from the original manufacturer or authorized distributors?
All S28HS01GTFPBHM030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S28HS01GTFPBHM030 meets industry standards.
7.What is the process for return or replacement of S28HS01GTFPBHM030?
All S28HS01GTFPBHM030 units undergo pre-shipment inspection (PSI). If there is an issue with S28HS01GTFPBHM030, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S28HS01GTFPBHM030 part is unused and in its original packaging.
Return procedure for S28HS01GTFPBHM030:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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