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Infineon Technologies S28HS01GTFPBHV033

Part No.:
S28HS01GTFPBHV033
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS28HS01GTFPBHV033.pdf
Description:
IC FLASH 1GBIT SPI/OCTAL 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,779

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Product details

Overview

S28HS01GTFPBHV033 from Cypress Semiconductor is a 1-Gb (128-MB) high-reliability NOR flash memory with Octal xSPI interface, operating at 1.7–2.0 V core/I/O (HS-T), supporting up to 400 MBps DDR read throughput and ISO 26262 ASIL-B compliance for automotive safety-critical boot code storage in ADAS ECUs.

For engineers reviewing the S28HS01GTFPBHV033 datasheet, S28HS01GTFPBHV033 pinout, S28HS01GTFPBHV033 application, or S28HS01GTFPBHV033 equivalent, key selection criteria include octal DDR timing performance, EnduraFlex™ partitioned endurance (2.56M P/E cycles main array), SECDED ECC, SafeBoot initialization reporting, and AEC-Q100 Grade 2 (−40 °C to +105 °C) qualification.

Technical Context

This device implements Cypress's 45-nm MirrorBit® architecture with dual-bit-per-cell storage and supports both JEDEC JESD251-compliant Octal Peripheral Interface (8D-8D-8D DDR/SDR) and legacy SPI (1S-1S-1S). It features two independent controller blocks: Host Interface Controller (HIC) for transaction management and Embedded Algorithm Controller (EAC) for autonomous program/erase execution.

The memory array offers hybrid sector architecture-thirty-two 4 KB sectors (top/bottom or split) plus uniform 256 KB sectors-and integrates Data Strobe (DS) for precise DDR read capture, Interface CRC for command/address integrity, and Data Integrity CRC for array-level error detection.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density1 Gb (128 MB) - sufficient for full firmware image + OTA update partition in automotive microcontrollers
Interface ProtocolOctal DDR (8D-8D-8D) up to 400 MBps - enables direct XIP execution from flash at CPU speeds >200 MHz
Supply Voltage1.7–2.0 V (HS-T) - compatible with low-voltage SoC I/O rails and reduces system power consumption
Endurance2,560,000 program/erase cycles (main array) - supports frequent firmware updates over 15-year vehicle lifetime
Data Retention25 years at 105 °C - validated for continuous operation in engine bay or ADAS sensor modules
Error CorrectionSECDED (Single-bit Error Correction, Double-bit Error Detection) - ensures bit-flip resilience without host software overhead
Temperature GradeAEC-Q100 Grade 2 (−40 °C to +105 °C) - qualified for under-hood and radar front-end applications

Pinout & Package

Package: 24-ball BGA, 8 × 8 mm, 1.0-mm pitch, halogen-free, lead-free (RoHS compliant).

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip SelectActive-low enable signal; drives device into standby when HIGH, enabling ultra-low 0.0013 mA deep power-down state
CKClock InputRising/falling edge-triggered for DDR; synchronizes all octal data transfers up to 200 MHz
DQ[7:0]Bidirectional Data BusOctal I/O lines carrying commands, addresses, and payload; support 8-bit parallel transfer in DDR mode
DSData Strobe OutputSource-synchronous strobe aligned to read data edges; eliminates setup/hold timing margin loss at 400 MBps
RESET#Hardware ResetAsynchronous reset with weak internal pull-up; restores array read state and clears pending operations on LOW-to-HIGH transition
INT#Open-Drain InterruptSignals completion of erase/program or ECC error detection; requires external 5–10 kΩ pull-up
VCC / VCCQPower SuppliesVCC = 1.7–2.0 V core; VCCQ = same voltage for I/O - eliminates level-shifting in 1.8-V systems
VSS / VSSQGround ReturnsSeparate core and I/O grounds reduce noise coupling during high-speed octal switching

Key Features

FeatureDesign Value
EnduraFlex™ ArchitectureAllows runtime partitioning of memory into high-endurance (≥1M cycles) and long-retention (25 yr) zones via host configuration
SafeBoot InitializationDetects corrupted configuration registers or failed power-on self-test and initiates recovery without host intervention
Interface CRC ProtectionEnd-to-end checksum over command, address, and data transfers prevents silent corruption from PCB noise or EMI
OTP Secure Silicon Array1024-byte one-time-programmable region stores cryptographic keys or calibration data with hardware lock protection
AutoBoot ModeEnables immediate array access after power-up - eliminates boot delay caused by configuration polling or register setup

Applications

ADAS Domain Controller Boot StorageAutomotive Radar Signal Processing Firmware

Use Scenario: Stores boot loader and safety-critical firmware for NVIDIA Orin or TI Jacinto 7-based ADAS domain controllers requiring ASIL-B compliance.

IC Role / Device Role / Timing Role: Primary nonvolatile boot memory with XIP-capable octal DDR interface, delivering deterministic <100 ns latency for first instruction fetch.

Use Value: Eliminates external RAM copy step during boot, reducing startup time by ≥30% versus quad-SPI NOR while maintaining functional safety certification.

Use Scenario: Holds real-time FFT and beamforming firmware for 77-GHz automotive radar modules operating continuously at 105 °C ambient.

IC Role / Device Role / Timing Role: High-temperature persistent code storage with 25-year retention guarantee and ECC-protected read path.

Use Value: Prevents field failures due to bit rot in radar DSP firmware, avoiding costly recalls in safety-critical sensing systems.

EV Battery Management System (BMS) Calibration DataCommercial Vehicle Telematics OTA Update Storage

Use Scenario: Stores cell-balancing algorithms and temperature-compensated SOC lookup tables updated monthly in high-vibration EV battery packs.

IC Role / Device Role / Timing Role: Endurance-optimized flash partition using EnduraFlex™ to sustain >500K write cycles across 10+ years of service life.

Use Value: Extends BMS field lifetime beyond 15 years without firmware corruption risk from repeated over-the-air calibration updates.

Use Scenario: Hosts dual-bank firmware images for cellular-connected telematics gateways requiring zero-downtime OTA updates in fleet vehicles.

IC Role / Device Role / Timing Role: Dual-image storage with atomic sector swap capability and SafeBoot validation of new image integrity pre-switch.

Use Value: Guarantees fail-safe rollback to known-good firmware if update interruption occurs during vehicle ignition cycle.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-reliability automotive NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Infineon S29GL512S11TFI010512-Mb density, parallel interface (not octal DDR); no ASIL-B certification; 110 MBps max read rateLimited to legacy MCU designs with parallel bus; unsuitable for XIP in modern SoCs requiring >200 MBps bandwidthSelect only for cost-sensitive industrial control where octal bandwidth and functional safety are not required
Macronix MX25LW12873FZBI128-Mb density, quad SPI only; no EnduraFlex™ or SafeBoot; 40 MBps max read rate; no AEC-Q100 Grade 2 ratingApplicable only to non-safety subsystems like infotainment UI assets; lacks diagnostic coverage for ISO 26262 workflowsUse only in consumer-grade telematics modules where functional safety and high endurance are not mandated

Compared with S28HS01GTFPBHV033, the Infineon part trades bandwidth and safety for legacy compatibility, while the Macronix part sacrifices density, speed, and automotive qualification - making S28HS01GTFPBHV033 the sole option meeting full ASIL-B, 1-Gb, and octal DDR requirements for next-gen ECU boot storage.

Availability

S28HS01GTFPBHV033 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, EV battery management systems, commercial vehicle telematics gateways, and radar signal processing units requiring stable component supply across extended product lifecycles.

Supply support for S28HS01GTFPBHV033 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance, safety-certified memory and programmable solutions for automotive, industrial, and communications markets.

The Semper® Flash family was engineered specifically for functional safety-critical boot and firmware storage in ISO 26262-compliant automotive ECUs, combining octal interface speed with built-in diagnostics and endurance management.

FAQ

What is the maximum clock frequency supported in DDR mode?

The S28HS01GTFPBHV033 supports a maximum clock frequency of 200 MHz in DDR mode, achieving 400 MBps effective read throughput. This is specified under HS-T (1.8-V) operation with CK duty cycle between 45% and 55%, and is validated across the full −40 °C to +105 °C temperature range per AEC-Q100 Grade 2 requirements.

Does this device support true XIP (eXecute-In-Place) from octal interface?

Yes - the device supports deterministic XIP execution via octal DDR interface with wrapped burst reads, enabling CPU cores to fetch instructions directly from flash without intermediate RAM buffering. Latency is guaranteed ≤100 ns for first-word access, and the DS signal ensures reliable data capture at 400 MBps without external timing compensation.

How is the 4 KB sector erase functionality implemented in hybrid sector architecture?

The device provides thirty-two dedicated 4 KB sectors that can be configured either at top/bottom (Configuration 1) or split equally (Configuration 2). Erase of these sectors uses the same command sequence as 256 KB sectors but completes in ~95 ms typical. Each 4 KB sector maintains independent erase status reporting and cycle counting via Sector Erase Counter registers.

Is the RESET# pin required for automotive applications?

No - RESET# is optional and internally weak-pulled high; it may be left unconnected. However, in AEC-Q100 Grade 2 systems, using RESET# improves robustness against brown-out conditions by forcing deterministic reinitialization. The device also supports hardware reset via CS# assertion per JEDEC standard, providing redundancy without additional pins.

S28HS01GTFPBHV033 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
SEMPER™
Package/Case:
24-VBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR (SLC)
Memory Size:
1Gbit
Memory Organization:
128M x 8
Memory Interface:
SPI - Octal I/O
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
1.7ms
Access Time:
5.45 ns
Voltage - Supply:
1.7V ~ 2V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (8x8)

S28HS01GTFPBHV033 FAQ

1.How can I place an order for S28HS01GTFPBHV033 through Aetrix?

Please submit a Request for Quotation (RFQ) for S28HS01GTFPBHV033 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S28HS01GTFPBHV033 reliable?

The price and inventory of S28HS01GTFPBHV033 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S28HS01GTFPBHV033 is usually 5 days.

3.What payment methods are accepted for S28HS01GTFPBHV033?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S28HS01GTFPBHV033 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S28HS01GTFPBHV033?

S28HS01GTFPBHV033 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S28HS01GTFPBHV033 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S28HS01GTFPBHV033?

For technical support, including S28HS01GTFPBHV033 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S28HS01GTFPBHV033 requirements.

6.How does Aetrix verify that S28HS01GTFPBHV033 is sourced from the original manufacturer or authorized distributors?

All S28HS01GTFPBHV033 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S28HS01GTFPBHV033 meets industry standards.

7.What is the process for return or replacement of S28HS01GTFPBHV033?

All S28HS01GTFPBHV033 units undergo pre-shipment inspection (PSI). If there is an issue with S28HS01GTFPBHV033, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S28HS01GTFPBHV033 part is unused and in its original packaging.

Return procedure for S28HS01GTFPBHV033:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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