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Infineon Technologies S28HS02GTFPBHB050
- Part No.:
- S28HS02GTFPBHB050
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S28HS02GTFPBHB050.pdf
- Description:
- IC FLASH 2GBIT SPI/OCTAL 24FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,332
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Product details
Overview
S28HS02GTFPBHB050 from Infineon Technologies is a 2 Gb (256 MB) Octal SPI NOR Flash memory with dual-die package (DDP), 1.8 V core/I/O supply, industrial-plus temperature grade (–40 °C to +105 °C), and JEDEC JESD251-compliant xSPI interface supporting up to 332 MBps DDR read throughput. It integrates MIRRORBIT™ 45-nm technology, SECDED ECC, SafeBoot recovery, and 4 KB/256 KB hybrid sector architecture for automotive and industrial firmware storage.
For engineers reviewing the S28HS02GTFPBHB050 datasheet, S28HS02GTFPBHB050 pinout, S28HS02GTFPBHB050 application, or S28HS02GTFPBHB050 equivalent, key selection criteria include ASIL-B functional safety compliance, octal DDR timing margin at 166 MHz, 25-year data retention, and 2.56M program-erase cycles in main array - critical for ADAS boot code and real-time control firmware.
Technical Context
This device implements a dual-die MCP architecture with shared control signals (CS#, CK, RESET#) across both 1 Gb dies, enabling unified command execution and seamless address mapping. Its embedded algorithm controller (EAC) manages all erase and program operations autonomously, while host interface controller (HIC) handles protocol-level signaling including octal SDR/DDR and legacy SPI modes.
The flash supports three sector configurations (uniform 256 KB, hybrid grouped, hybrid split), configurable 256/512-byte page buffers, and integrated data integrity features: on-the-fly CRC for array reads, SFDP v1.6 parameter tables, and OTP secure silicon region (1024 bytes). DS signal enables precise read-data capture in high-speed systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 2 Gb (256 MB) total capacity, implemented as two 1 Gb dies in DDP configuration |
| Interface standard | JEDEC JESD251-compliant xSPI with octal (8D-8D-8D) and legacy SPI (1S-1S-1S) support |
| Max read speed | 332 MBps DDR mode (166 MHz clock, 8-bit bus, double data rate) |
| Endurance & retention | 2,560,000 program-erase cycles (main array); 25 years data retention at +105 °C |
| Voltage range | 1.7–2.0 V core/I/O (HS-T grade), compatible with low-power 1.8 V systems |
| Safety certification | ISO 26262 ASIL-B compliant, ASIL-D ready; includes SafeBoot, ECC (SECDED), and CRC error detection |
| Temperature grade | Industrial Plus: –40 °C to +105 °C, qualified per AEC-Q100 Grade 2 |
Pinout & Package
24-ball BGA package, 8 mm × 8 mm, 0.8 mm pitch, RoHS-compliant. Pinout optimized for high-speed octal signaling with dedicated DS, separate VCC/VCCQ, and VSS/VSSQ grounds to minimize noise coupling between core and I/O domains.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for all transactions; drives device into standby when HIGH, except during internal operations |
| CK | Serial Clock | Rising-edge latched in SDR; both edges latched in DDR; defines timing for command/address/data transfer |
| DS | Data Strobe | Output-only strobe synchronized to read data; enables reliable capture in high-speed DDR systems without external PLL |
| DQ[7:0] | Bidirectional Data Bus | Octal I/O lines used for command, address, and data in xSPI mode; SI/SO in legacy SPI |
| RESET# | Hardware Reset | Optional active-low reset with internal weak pull-up; forces array read state and tri-states DQ/DS on assertion |
| INT# | Interrupt Output | Open-drain status indicator for completion of erase/program or error events; requires external 5–10 kΩ pull-up |
| VCC / VSS | Core Power/Ground | 1.8 V core supply and return; isolated from I/O domain to reduce switching noise impact on memory array |
| VCCQ / VSSQ | I/O Power/Ground | 1.8 V I/O supply and return; decoupled from core rails to maintain signal integrity on DQ/DS/CK |
Key Features
| Feature | Design Value |
|---|---|
| ASIL-B functional safety | Full ISO 26262 development lifecycle compliance with SafeBoot initialization reporting and configuration corruption detection |
| Hybrid sector architecture | Configurable 4 KB sectors (top/bottom or both) for bootloader partitioning, plus uniform 256 KB sectors for application code storage |
| Endurance Flex architecture | Dedicated high-endurance partitions with extended cycle count and retention guarantees for critical firmware metadata |
| On-chip ECC (SECDED) | Single-bit error correction and double-bit error detection applied automatically during every read operation on main memory array |
| Program buffer flexibility | Selectable 256-byte or 512-byte page buffer; 512-byte mode increases programming throughput by >50% vs. 256-byte mode |
Applications
| Automotive ADAS ECU Boot Memory | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot code and safety-critical firmware for radar/LiDAR ECUs requiring rapid, deterministic startup and runtime integrity verification. IC Role / Device Role / Timing Role: Primary nonvolatile boot memory with ASIL-B certified SafeBoot and CRC-checked read path; provides sub-100 µs initialization reporting. Use Value: Eliminates external error-checking logic and reduces boot time uncertainty via on-die ECC and deterministic erase status reporting. | Use Scenario: Holds field-upgradable control firmware and configuration data in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: High-reliability firmware store with 25-year retention at +105 °C and 2.56M endurance cycles; supports remote OTA updates with sector-level protection. Use Value: Enables zero-downtime firmware updates using hybrid sector architecture - 4 KB protected boot sector remains intact during 256 KB application rewrites. |
| Medical Imaging System Configuration | Avionics Display Module Code Storage |
Use Scenario: Stores calibration profiles, image processing algorithms, and regulatory-compliant boot images in MRI/CT scanner subsystems. IC Role / Device Role / Timing Role: Secure, tamper-resistant configuration memory with 1024-byte OTP region for cryptographic keys and device-specific parameters. Use Value: Meets IEC 62304 software safety classification via built-in data integrity checks and ASIL-B traceable development artifacts. | Use Scenario: Hosts display firmware and graphics assets in DO-178C-certified cockpit display units requiring guaranteed read performance and radiation-tolerant data retention. IC Role / Device Role / Timing Role: High-throughput code execution memory with 332 MBps DDR read bandwidth and DS-synchronized data capture for real-time rendering pipelines. Use Value: Reduces external FIFO buffering requirements and simplifies timing closure by delivering deterministic burst reads aligned to system clock domain. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-reliability NOR Flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY15B102QN-SXIT | 2 Mb FRAM (not Flash); unlimited endurance; no erase latency; 1.8 V only; no octal interface | Best for frequent write logging; unsuitable for large boot images due to density limit and lack of xSPI | Select only if write-cycle count dominates over code size and DDR bandwidth requirements |
| S25HS512TDFBHI010 | 512 Mb (64 MB), same SEMPER family, single-die, 1.8 V, ASIL-B, but lower density and 166 MBps max SDR read (no DDR) | Lower cost for space-constrained designs where 256 MB is excessive and DDR timing margin is unnecessary | Choose when full 2 Gb capacity and 332 MBps DDR throughput are not required |
Compared with CY15B102QN-SXIT and S25HS512TDFBHI010, the S28HS02GTFPBHB050 uniquely delivers 2 Gb density with ASIL-B-certified DDR octal interface, making it the only option among the three capable of hosting full automotive boot+application images with deterministic high-speed execution.
Availability
S28HS02GTFPBHB050 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial PLCs, medical imaging subsystems, and avionics display modules requiring stable component supply, long-term lifecycle assurance, and functional safety certification.
Supply support for S28HS02GTFPBHB050 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and safety-certified memory solutions, with global R&D and manufacturing infrastructure.
The SEMPER™ Flash product line targets functional safety-critical applications in automotive, industrial, and medical systems, delivering NOR Flash with integrated ISO 26262-compliant safety mechanisms and high-speed xSPI interfaces.
FAQ
What voltage levels does the S28HS02GTFPBHB050 support?
The S28HS02GTFPBHB050 operates exclusively at 1.8 V (HS-T grade), with VCC and VCCQ both rated 1.7–2.0 V. It does not support 3.0 V operation - that capability belongs to the HL-T variants (e.g., S28HS02GTFLBHB050). This strict 1.8 V requirement ensures compatibility with low-power SoCs and reduces dynamic power consumption during high-speed DDR reads.
Does this part include hardware reset functionality?
Yes, the S28HS02GTFPBHB050 includes a dedicated RESET# pin with internal weak pull-up. When asserted LOW, it forces the device into array read state, clears internal state machines, and places DQ[7:0] and DS into high-impedance mode. Unlike CS#-only reset methods, RESET# guarantees full initialization regardless of ongoing embedded operations like erase or program.
How is sector protection implemented on this device?
Sector protection uses two independent mechanisms: legacy block protection (BP bits in status register) for coarse-grained locking of top/bottom/middle blocks, and advanced sector protection (ASP) enabling individual 4 KB or 256 KB sector lock/unlock via dedicated commands. ASP supports volatile and nonvolatile locking, allowing runtime protection changes without permanent configuration commitment.
Can the S28HS02GTFPBHB050 be used with standard SPI controllers?
Yes - it supports legacy ×1 SPI (SI/SO on DQ0/DQ1) in addition to octal xSPI. In SPI mode, it delivers up to 20.75 MBps (166 MHz SDR), fully compliant with JEDEC JESD251. However, SPI mode disables DS, DDR, and octal features; full performance and safety features (e.g., SafeBoot reporting) require xSPI command set and octal-capable host controller.
S28HS02GTFPBHB050 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- SEMPER™
- Package/Case:
- 24-VBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- SPI - Octal I/O
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (8x8)
S28HS02GTFPBHB050 FAQ
1.How can I place an order for S28HS02GTFPBHB050 through Aetrix?
Please submit a Request for Quotation (RFQ) for S28HS02GTFPBHB050 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S28HS02GTFPBHB050 reliable?
The price and inventory of S28HS02GTFPBHB050 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S28HS02GTFPBHB050 is usually 5 days.
3.What payment methods are accepted for S28HS02GTFPBHB050?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S28HS02GTFPBHB050 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S28HS02GTFPBHB050?
S28HS02GTFPBHB050 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S28HS02GTFPBHB050 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S28HS02GTFPBHB050?
For technical support, including S28HS02GTFPBHB050 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S28HS02GTFPBHB050 requirements.
6.How does Aetrix verify that S28HS02GTFPBHB050 is sourced from the original manufacturer or authorized distributors?
All S28HS02GTFPBHB050 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S28HS02GTFPBHB050 meets industry standards.
7.What is the process for return or replacement of S28HS02GTFPBHB050?
All S28HS02GTFPBHB050 units undergo pre-shipment inspection (PSI). If there is an issue with S28HS02GTFPBHB050, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S28HS02GTFPBHB050 part is unused and in its original packaging.
Return procedure for S28HS02GTFPBHB050:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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