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Infineon Technologies S28HS02GTFPBHM053
- Part No.:
- S28HS02GTFPBHM053
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S28HS02GTFPBHM053.pdf
- Description:
- IC FLASH 2GBIT SPI/OCTAL 24FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,634
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Product details
Overview
S28HS02GTFPBHM053 from Infineon is a 2 Gb (256 MB) octal SPI NOR flash memory in a 24-ball BGA (8 mm × 8 mm) package, built on 45-nm MIRRORBIT™ technology with dual-die MCP architecture. It supports JEDEC JESD251-compliant octal interface (8S-8S-8S/8D-8D-8D), delivers up to 332 MBps DDR read throughput at 166 MHz, and features ASIL-B functional safety compliance for automotive applications.
For engineers reviewing the S28HS02GTFPBHM053 datasheet, S28HS02GTFPBHM053 pinout, S28HS02GTFPBHM053 application, or S28HS02GTFPBHM053 equivalent, key selection criteria include octal DDR timing performance, 4 KB/256 KB hybrid sector architecture, integrated SECDED ECC, SafeBoot initialization reporting, and 1.7–2.0 V / 2.7–3.6 V dual-voltage operation.
Technical Context
This device implements a dual-die package (DDP) with two 1 Gb dies sharing common control signals (CS#, CK, RESET#, DQ[7:0], DS, INT#). Its embedded algorithm controller (EAC) manages all program/erase operations autonomously, while the host interface controller (HIC) handles command decoding and data transfer coordination.
The octal interface supports both SDR (up to 166 MBps) and DDR (up to 332 MBps) modes with data strobe (DS) for precise read capture. Sector architecture is configurable as uniform (all 256 KB) or hybrid (32 × 4 KB + remainder 256 KB), and page programming buffer is selectable between 256 B and 512 B for optimized throughput.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Gb (256 MB) total capacity, implemented as dual 1 Gb die in single-package MCP |
| Interface Standard | JEDEC JESD251-compliant octal peripheral interface (OPI); also supports legacy ×1 SPI |
| Max Read Throughput | 332 MBps in DDR mode (166 MHz clock, 8-bit bus, double-data-rate) |
| Endurance & Retention | 2,560,000 program-erase cycles (main array); 25-year data retention at 85 °C |
| Voltage Support | Dual supply: 1.7–2.0 V (HS-T core/I/O) or 2.7–3.6 V (HL-T core/I/O) |
| Safety Certification | ISO 26262 ASIL-B compliant; ASIL-D ready with SafeBoot and CRC-based integrity monitoring |
| ECC Capability | Built-in SECDED (single-error correction, double-error detection) on memory array data |
Pinout & Package
Package: 24-ball BGA, 8 mm × 8 mm, 0.8 mm pitch, RoHS-compliant. Pin assignment validated per Infineon Summary Datasheet 002-34695 Rev. ** (pp. 5–6).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select input | Active-low enable signal; initiates all transactions and places outputs in high-Z when deasserted |
| CK | Clock input | Rising-edge latched in SDR; both edges used in DDR; defines timing for all serial transfers |
| DS | Data Strobe output | Indicates valid read data timing; toggles during CS#-low read bursts to simplify high-speed capture |
| DQ[7:0] | Bidirectional data I/O | Octal data path for commands, addresses, and payload; supports ×1 SPI fallback using DQ0/DQ1 only |
| RESET# | Hardware reset input | Optional active-low signal with internal weak pull-up; forces re-initialization and array read state |
| INT# | Interrupt output | Open-drain indicator for internal events (e.g., erase completion, error detection); requires external 5–10 kΩ pull-up |
| VCC / VSS | Core power / ground | Supplies logic core (1.7–2.0 V or 2.7–3.6 V); separate from I/O domain |
| VCCQ / VSSQ | I/O power / ground | Supplies DQ[7:0], DS, INT#; matches core voltage domain for HS-T/HL-T operation |
Key Features
| Feature | Design Value |
|---|---|
| ASIL-B Functional Safety | SafeBoot reports initialization failures and configuration corruption; enables recovery without host intervention |
| Endurance Flex Architecture | Separate endurance/retention partitions allow high-cycle 4 KB sectors (300k cycles) alongside main array (2.56M cycles) |
| Hybrid Sector Configuration | Supports top/bottom 4 KB sector grouping or split (top + bottom), enabling boot code protection and firmware update flexibility |
| 512-byte Page Buffer | Enables highest programming throughput (898 KBps for 256 KB sectors) versus 256-byte buffer option |
| Serial Flash Discoverable Parameters (SFDP) | Standardized JEDEC register map allows automatic host configuration without hard-coded driver assumptions |
Applications
| Automotive ADAS ECU Boot Memory | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot code and safety-critical firmware for radar/LiDAR ECUs operating in -40 °C to +125 °C environments. IC Role / Device Role / Timing Role: Primary nonvolatile boot memory with deterministic read latency and ASIL-B runtime verification. Use Value: SafeBoot and CRC integrity checks ensure verified startup; octal DDR bandwidth meets real-time boot timing budgets under AEC-Q100 Grade 1 stress. | Use Scenario: Holds field-upgradable firmware and configuration data in programmable logic controllers deployed in factory automation systems. IC Role / Device Role / Timing Role: High-reliability storage for mission-critical control logic with secure over-the-air updates. Use Value: Hybrid sector architecture isolates 4 KB boot loader (300k endurance) from 256 KB application partition (2.56M cycles), extending field life. |
| Medical Imaging System Code Storage | Avionics Display Controller Memory |
Use Scenario: Stores certified imaging algorithms and calibration tables in FDA-regulated MRI/CT subsystems requiring long-term data integrity. IC Role / Device Role / Timing Role: Trusted code repository with SECDED ECC and 25-year retention at elevated ambient temperatures. Use Value: Built-in ECC corrects single-bit errors in-flight; data integrity CRC validates memory array before execution, satisfying IEC 62304 software safety requirements. | Use Scenario: Provides certified display firmware and graphics assets for DO-178C Level A flight-critical cockpit displays. IC Role / Device Role / Timing Role: Safety-certified NOR flash supporting deterministic read access and fault-reporting via INT# pin. Use Value: INT# asserts on detected configuration corruption or erase failure, enabling immediate system-level fail-safe response per DO-178C error handling mandates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar octal NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S26KS512SDPBHV020 | 512 Mb density; same 24-ball BGA; supports xSPI but lacks ASIL-B certification | Lower density limits use in full-featured ADAS boot; no SafeBoot or ASIL-B traceability | Select when cost-sensitive industrial designs require octal interface but not automotive safety certification |
| Winbond W25M02GVZEIG | 2 Gb, 24-ball BGA, octal interface; no ASIL-B; uses different ECC implementation (no SECDED) | Lacks functional safety features; lower endurance (100k cycles) and shorter retention (20 years) | Choose for consumer or non-safety-critical embedded systems where JEDEC xSPI compatibility is primary requirement |
Compared with S28HS02GTFPBHM053, the Cypress alternative offers smaller capacity and no safety certification, while the Winbond part omits SECDED and ASIL-B support-making the Infineon device uniquely suitable for ISO 26262-compliant automotive and medical systems requiring verified boot integrity and long-term reliability.
Availability
S28HS02GTFPBHM053 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial PLCs, medical imaging subsystems, and avionics display controllers requiring stable component supply across extended temperature ranges and functional safety compliance.
Supply support for S28HS02GTFPBHM053 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and safety-certified memory solutions.
The SEMPER™ Flash product line targets functional safety-critical applications in automotive, industrial, and medical systems, delivering high-speed octal NOR flash with ISO 26262 ASIL-B compliance, Endurance Flex architecture, and robust data integrity mechanisms.
FAQ
What voltage configurations does S28HS02GTFPBHM053 support?
S28HS02GTFPBHM053 operates in two voltage domains: HS-T mode (1.7–2.0 V for both VCC and VCCQ) and HL-T mode (2.7–3.6 V for both supplies). The device automatically detects and configures for the applied voltage range; no external selection is required. Both domains support full octal DDR functionality and ASIL-B safety features.
How does the hybrid sector architecture work in practice?
The hybrid sector architecture allows configuration of thirty-two 4 KB sectors either at the top or bottom of the address space (Configuration 1), or at both top and bottom (Configuration 2), with remaining sectors sized at 256 KB. This is set via nonvolatile configuration registers and enables independent protection and endurance management-for example, locking 4 KB boot code while permitting frequent updates to larger application partitions.
Is RESET# pin mandatory for safe operation?
No-RESET# is optional and includes an internal weak pull-up; leaving it unconnected defaults to HIGH. However, using RESET# provides deterministic hardware-initiated recovery from initialization failures or configuration corruption, which is recommended for ASIL-B systems. CS# alone cannot trigger SafeBoot recovery sequences-only RESET# or power cycle can.
What is the role of the DS (Data Strobe) signal during read operations?
DS toggles synchronously with valid read data output during CS#-low bursts in both SDR and DDR modes. It eliminates setup/hold timing uncertainty at the host receiver by providing a dedicated edge-aligned strobe-critical for reliable capture at 332 MBps DDR rates. DS remains inactive (high-Z) outside read transactions and is not used in legacy ×1 SPI mode.
S28HS02GTFPBHM053 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- SEMPER™
- Package/Case:
- 24-VBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- SPI - Octal I/O
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (8x8)
S28HS02GTFPBHM053 FAQ
1.How can I place an order for S28HS02GTFPBHM053 through Aetrix?
Please submit a Request for Quotation (RFQ) for S28HS02GTFPBHM053 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S28HS02GTFPBHM053 reliable?
The price and inventory of S28HS02GTFPBHM053 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S28HS02GTFPBHM053 is usually 5 days.
3.What payment methods are accepted for S28HS02GTFPBHM053?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S28HS02GTFPBHM053 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S28HS02GTFPBHM053?
S28HS02GTFPBHM053 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S28HS02GTFPBHM053 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S28HS02GTFPBHM053?
For technical support, including S28HS02GTFPBHM053 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S28HS02GTFPBHM053 requirements.
6.How does Aetrix verify that S28HS02GTFPBHM053 is sourced from the original manufacturer or authorized distributors?
All S28HS02GTFPBHM053 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S28HS02GTFPBHM053 meets industry standards.
7.What is the process for return or replacement of S28HS02GTFPBHM053?
All S28HS02GTFPBHM053 units undergo pre-shipment inspection (PSI). If there is an issue with S28HS02GTFPBHM053, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S28HS02GTFPBHM053 part is unused and in its original packaging.
Return procedure for S28HS02GTFPBHM053:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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