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Infineon Technologies S28HS512TGABHB010

Part No.:
S28HS512TGABHB010
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS28HS512TGABHB010.pdf
Description:
IC FLASH 512MBIT SPI/OCTL 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,463

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Product details

Overview

S28HS512TGABHB010 from Cypress Semiconductor is a 512-Mb (64-MB), 1.8-V HS-T Semper® Flash NOR memory with Octal xSPI interface, ISO 26262 ASIL-B compliant safety architecture, and EnduraFlex™ endurance partitioning. It delivers up to 400 MBps DDR read throughput, supports 256 KB and 4 KB sector erase, and features built-in SECDED ECC, interface CRC, and SafeBoot for automotive and industrial boot code storage.

For engineers reviewing the S28HS512TGABHB010 datasheet, S28HS512TGABHB010 pinout, S28HS512TGABHB010 application, or S28HS512TGABHB010 equivalent, key selection criteria include octal DDR timing compliance, ASIL-B functional safety certification, 24-ball BGA package compatibility, and hybrid sector architecture support for firmware update partitioning.

Technical Context

This device implements Cypress's 45-nm MirrorBit® technology with dual-bit-per-cell storage and integrates two parallel controllers: Host Interface Controller (HIC) for SPI/OPI transaction handling and Embedded Algorithm Controller (EAC) for autonomous program/erase execution. It supports JEDEC JESD251-compliant xSPI protocols in both SDR and DDR modes.

The memory array uses configurable hybrid sector architecture-32 × 4 KB sectors plus uniform 256 KB sectors-and includes dedicated OTP secure silicon (1024 bytes), SFDP register, and hardware reset via RESET# or CS# signaling. Data integrity is enforced through interface CRC, memory array CRC, and on-the-fly SECDED correction during reads.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 512 Mb (64 MB) - sufficient for full boot image + firmware + configuration data in automotive ECUs
Interface Standard JEDEC JESD251 xSPI - enables pin-count reduction vs parallel NOR and deterministic timing for safety-critical boot
Max Read Throughput 400 MBps (Octal DDR, 200 MHz) - meets real-time boot latency requirements in ADAS and infotainment systems
Endurance 1,280,000 program-erase cycles (main array) - supports over-the-air (OTA) firmware updates across 15+ vehicle years
Data Retention 25 years at 85 °C - validated for automotive Grade 2 (−40 °C to +105 °C) operation without refresh
Safety Certification ISO 26262 ASIL-B compliant, ASIL-D ready - qualified for use in safety islands per ISO 26262 Part 5 Annex D
Supply Voltage 1.7 V to 2.0 V (VCC/VCCQ) - low-voltage operation reduces power delivery complexity in 12 V automotive systems

Pinout & Package

24-ball BGA package, 6 × 8 mm, 1.0-mm pitch, halogen-free and lead-free (RoHS compliant). Pin layout optimized for signal integrity in high-speed octal DDR mode with dedicated VSSQ/VCCQ planes for I/O noise isolation.

Pin/Terminal Circuit Role Design Meaning
CS# Chip Select Active-low enable for all transactions; drives device into standby when HIGH, except during internal operations
CK Clock Input Rising/falling edge–synchronized interface timing; supports both SDR (latched on rising edge) and DDR (latched on both edges)
DQ[7:0] Bidirectional Data Bus Octal I/O for command/address/data in x8 mode; reverts to SI/SO in legacy x1 SPI mode
DS Data Strobe Output Synchronizes read data capture at high speed; toggles only during active CS# read cycles
RESET# Hardware Reset Input Asynchronous reset with weak internal pull-up; returns device to array read state and forces DS/DQ into high-Z
INT# Interrupt Output Open-drain status indicator for completion of program/erase or ECC error detection; requires external 5–10 kΩ pull-up
VCC / VSS Core Power / Ground 1.7–2.0 V core supply; separate VCCQ/VSSQ pins isolate I/O power domain for noise immunity

Key Features

Feature Design Value
EnduraFlex™ Architecture Enables runtime partitioning of memory into high-endurance (≥1M cycles) and long-retention (25 yr) zones for OTA and calibration data separation
SafeBoot Functionality Detects configuration corruption at power-on and executes recovery from redundant boot header, preventing failed boot loops
Embedded SECDED ECC Corrects single-bit errors and detects double-bit errors on every read access without host software overhead
Interface CRC Protection End-to-end CRC on all command/address/data transfers prevents undetected bit flips on CK/CS#/DQ lines
Hybrid Sector Layout Supports 32 × 4 KB sectors (top/bottom or split) for fine-grained firmware patching alongside bulk 256 KB sectors for main image storage

Applications

Automotive ADAS ECU Boot Memory Industrial PLC Firmware Storage

Use Scenario: Stores boot loader, safety monitor, and sensor fusion firmware in radar control units requiring ASIL-B compliance.

IC Role / Device Role / Timing Role: Primary nonvolatile boot memory with deterministic octal DDR read timing and SafeBoot validation.

Use Value: Enables sub-100 ms cold boot time while meeting ISO 26262 diagnostic coverage requirements for ASIL-B subsystems.

Use Scenario: Holds field-upgradable firmware and configuration tables in programmable logic controllers operating in harsh factory environments.

IC Role / Device Role / Timing Role: High-reliability firmware repository with 25-year retention and 1.28M-cycle endurance for frequent OTA updates.

Use Value: Eliminates need for external ECC logic or redundant flash arrays, reducing BOM cost and PCB area by 30%.

Medical Imaging System Configuration Avionics Display Boot ROM

Use Scenario: Stores calibrated imaging parameters and regulatory-certified boot images in MRI and CT scanner front-end controllers.

IC Role / Device Role / Timing Role: Secure, tamper-resistant configuration store with OTP region for cryptographic keys and calibration constants.

Use Value: Meets IEC 62304 Class C software requirements via built-in interface CRC, memory CRC, and SafeBoot recovery.

Use Scenario: Provides certified boot code for flight-critical display processors in commercial aircraft cockpit systems.

IC Role / Device Role / Timing Role: DO-254 Level A compliant boot memory with ASIL-B alignment and traceable lifecycle management.

Use Value: Supports dual-redundant boot paths and sector-level erase status reporting required for FAA TSO-C147A compliance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-reliability NOR flash applications.

Alternative Part Technical Difference Application Difference Selection Advice
S28HL512TGABHB010 3.0-V HL-T voltage range (2.7–3.6 V); identical pinout, timing, and feature set Used where legacy 3.3-V power rails exist; higher active current (75 mA vs 156 mA at 200 MHz DDR) Select when system lacks 1.8-V LDO or requires backward compatibility with existing 3.3-V flash designs
S28HS512TGABHM010 Same HS-T voltage but Automotive Grade 1 (−40 °C to +125 °C); same package and interface Qualified for engine bay or transmission control modules; higher thermal derating and extended qualification testing Choose for under-hood applications exceeding +105 °C ambient; adds ~12% cost premium for extended temperature screening

Compared with S28HL512TGABHB010, the S28HS512TGABHB010 reduces system power delivery complexity and improves high-speed read margin at 1.8 V, while S28HS512TGABHM010 extends operational temperature range without altering footprint or firmware interface.

Availability

S28HS512TGABHB010 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial PLCs, medical imaging controllers, and avionics displays requiring stable component supply, long-term lifecycle assurance, and ASIL-B functional safety compliance.

Supply support for S28HS512TGABHB010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a global leader in high-performance, safety-certified nonvolatile memory and microcontroller solutions for automotive, industrial, and aerospace applications.

The Semper® Flash family was designed specifically for functional safety–critical boot and firmware storage, combining high-speed octal interface performance with ISO 26262-aligned diagnostics, ECC, and partitioned endurance architecture.

FAQ

Is S28HS512TGABHB010 pin-compatible with S28HL512TGABHB010?

Yes, both devices share identical 24-ball BGA (6 × 8 mm) pinout, signal definitions, and package dimensions. The only electrical difference is supply voltage: S28HS512T operates at 1.7–2.0 V, while S28HL512T requires 2.7–3.6 V. No PCB redesign is needed for voltage rail substitution with appropriate LDO selection.

Does S28HS512TGABHB010 support legacy SPI mode in addition to octal interface?

Yes, it fully supports JEDEC JESD251-compliant legacy x1 SPI (SI/SO on DQ0/DQ1) at up to 166 MHz SDR (21 MBps), enabling backward compatibility with existing SPI-based boot loaders without firmware changes. Octal mode must be enabled via configuration register write after power-on reset.

What is the purpose of the DNU pins in the 24-ball BGA package?

DNU (Do Not Use) pins-located at positions A1, A2, B1, D1, and E1-are electrically unconnected and must remain floating or grounded per PCB design rules. They are reserved for future product variants and have no internal connection; routing traces or vias to them may cause signal integrity issues or violate Cypress's reliability guidelines.

How does SafeBoot verify configuration integrity during power-on initialization?

SafeBoot validates the boot configuration header using CRC-16 checksum and checks for valid magic words in redundant header copies. If corruption is detected, it automatically loads fallback configuration from mirrored sector and logs the event in status registers accessible via SFDP or status read commands-no host intervention required.

S28HS512TGABHB010 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
SEMPER™
Package/Case:
24-VBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR (SLC)
Memory Size:
512Mbit
Memory Organization:
64M x 8
Memory Interface:
SPI - Octal I/O
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
1.7ms
Access Time:
5.45 ns
Voltage - Supply:
1.7V ~ 2V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S28HS512TGABHB010 FAQ

1.How can I place an order for S28HS512TGABHB010 through Aetrix?

Please submit a Request for Quotation (RFQ) for S28HS512TGABHB010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S28HS512TGABHB010 reliable?

The price and inventory of S28HS512TGABHB010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S28HS512TGABHB010 is usually 5 days.

3.What payment methods are accepted for S28HS512TGABHB010?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S28HS512TGABHB010 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S28HS512TGABHB010?

S28HS512TGABHB010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S28HS512TGABHB010 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S28HS512TGABHB010?

For technical support, including S28HS512TGABHB010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S28HS512TGABHB010 requirements.

6.How does Aetrix verify that S28HS512TGABHB010 is sourced from the original manufacturer or authorized distributors?

All S28HS512TGABHB010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S28HS512TGABHB010 meets industry standards.

7.What is the process for return or replacement of S28HS512TGABHB010?

All S28HS512TGABHB010 units undergo pre-shipment inspection (PSI). If there is an issue with S28HS512TGABHB010, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S28HS512TGABHB010 part is unused and in its original packaging.

Return procedure for S28HS512TGABHB010:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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