Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies S28HS512TGABHB013

Part No.:
S28HS512TGABHB013
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS28HS512TGABHB013.pdf
Description:
IC FLASH 512MBIT SPI/OCTL 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,789

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

S28HS512TGABHB013 from Cypress Semiconductor is a 512-Mb (64-MB), 1.8-V HS-T Semper® Flash NOR memory with Octal xSPI interface, ISO 26262 ASIL-B compliant functional safety architecture, 256 KB uniform sector erase, and 24-ball BGA (6 × 8 mm) package. It delivers up to 400 MBps DDR read throughput, supports EnduraFlex™ partitioning for high-endurance/long-retention use, and integrates SECDED ECC, interface CRC, and SafeBoot for automotive and industrial embedded boot storage.

For engineers reviewing the S28HS512TGABHB013 datasheet, S28HS512TGABHB013 pinout, S28HS512TGABHB013 application, or S28HS512TGABHB013 equivalent, key selection criteria include octal DDR timing compliance (JESD251), ASIL-B certification status, 25-year data retention, 1.28M program-erase cycles, and 24-ball BGA mechanical compatibility with automotive-grade thermal range (−40 °C to +105 °C).

Technical Context

This device implements Cypress's 45-nm MirrorBit® technology with dual-bit-per-cell storage and a dual-controller architecture: Host Interface Controller (HIC) handles SPI/OPI protocol timing and signal management, while Embedded Algorithm Controller (EAC) executes autonomous program/erase sequences, ECC generation, and SafeBoot initialization checks.

The octal interface operates in both SDR (200 MHz, 200 MBps) and DDR (200 MHz, 400 MBps) modes with mandatory Data Strobe (DS) for timing-critical read capture; it also retains legacy x1 SPI mode (166 MHz, 20.75 MBps) for backward compatibility and debug access.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density512 Mb (64 MB) - fixed address space supporting boot code, firmware, and configuration data in space-constrained systems.
Interface StandardJEDEC JESD251-compliant Octal Peripheral Interface (OPI) - enables 8-bit bidirectional DQ[7:0] transfers, reducing pin count vs parallel NOR.
Max Read Throughput400 MBps (DDR mode, 200 MHz clock) - supports real-time execution of code directly from flash (XIP) in high-performance ADAS controllers.
Endurance & Retention1,280,000 program-erase cycles (main array); 25 years data retention - validated for mission-critical automotive ECU firmware storage.
Safety CertificationISO 26262 ASIL-B compliant, ASIL-D ready - includes SafeBoot, interface CRC, data integrity CRC, and SECDED ECC for fault detection and recovery.
Supply Voltage1.7 V to 2.0 V core/I/O (HS-T) - optimized for low-power 1.8-V system rails common in modern automotive SoCs.
Operating Temperature−40 °C to +105 °C (Industrial Plus grade) - qualified per AEC-Q100 Grade 2 for under-hood and domain controller deployment.

Pinout & Package

Package: 24-ball BGA, 6 × 8 mm, 1.0-mm pitch, halogen-free and lead-free (RoHS compliant). Compatible with standard reflow profiles; ultrasonic cleaning prohibited.

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip SelectActive-low enable signal; all transactions begin/end on HIGH→LOW/LOW→HIGH transitions; places outputs in high-Z when deasserted.
CKClock InputRising-edge–latched in SDR; both-edge–latched in DDR; defines timing for command/address/data transfer across all interface modes.
DQ[7:0]Bidirectional Data BusOctal I/O for OPI commands/addresses/data; in legacy SPI mode, DQ0 = SI, DQ1 = SO; full 8-bit width required for DDR burst reads.
DSData Strobe OutputSource-synchronous toggle signal aligned with read data edges; essential for reliable capture at >133 MHz clock rates in DDR mode.
RESET#Hardware ResetOptional active-low reset with internal weak pull-up; forces device into array read state and disables DS/DQ outputs during assertion.
INT#Interrupt OutputOpen-drain status indicator signaling completion of program/erase or ECC error detection; requires external 5–10 kΩ pull-up.
VCC / VCCQPower SuppliesVCC = 1.7–2.0 V core supply; VCCQ = same voltage for I/O drivers - decoupling critical for signal integrity at 400 MBps.
VSS / VSSQGround ReturnsSeparate core (VSS) and I/O (VSSQ) grounds minimize noise coupling between logic and high-speed interface paths.

Key Features

FeatureDesign Value
EnduraFlex™ ArchitectureAllows host-defined partitions with independent endurance (up to 1M+ cycles) and retention (25 years) - enables mixed-criticality firmware storage in single device.
SafeBoot InitializationVerifies configuration registers and memory map integrity at power-on; triggers automatic recovery from corrupted boot sectors without host intervention.
SECDED ECC EngineOn-the-fly single-bit correction and double-bit detection across entire memory array - eliminates uncorrectable errors in XIP execution paths.
Interface CRC ProtectionPer-transaction CRC checksum over command/address/data - detects bit flips on CK/CS#/DQ lines caused by EMI or crosstalk in automotive harnesses.
AutoBoot ModeEnables immediate read access post-power-up without issuing initialization commands - reduces boot latency in time-sensitive safety-critical systems.

Applications

Automotive ADAS Domain ControllerIndustrial PLC Firmware Storage

Use Scenario: Stores boot loader, sensor fusion algorithms, and real-time OS kernel for radar/vision processing units operating in harsh under-hood environments.

IC Role / Device Role / Timing Role: Primary boot flash with XIP-capable octal DDR interface delivering deterministic <50 ns read latency for instruction fetch.

Use Value: ASIL-B certification and SafeBoot ensure fail-safe initialization; 1.28M cycle endurance supports over-the-air (OTA) update cycles across 15-year vehicle lifetime.

Use Scenario: Holds programmable logic controller firmware, motion control profiles, and secure configuration data in factory automation systems requiring long-term reliability.

IC Role / Device Role / Timing Role: Nonvolatile program memory with ECC-protected read/write and sector-level protection against accidental overwrite during field updates.

Use Value: EnduraFlex™ partitions allocate high-endurance zones for frequently updated parameters and long-retention zones for calibration constants - eliminating need for external EEPROM.

Medical Imaging System Boot ROMAvionics Flight Control Module

Use Scenario: Stores certified boot firmware and diagnostic routines for MRI/CT scanner subsystems where data integrity and regulatory traceability are mandated.

IC Role / Device Role / Timing Role: Safety-critical boot device with interface CRC, data integrity CRC, and tamper-evident Secure Silicon OTP region for cryptographic keys.

Use Value: 25-year retention and SECDED ECC meet IEC 62304 Class C software requirements; SFDP register enables automatic host configuration discovery.

Use Scenario: Provides certified boot image and flight control law parameters in DO-178C Level A avionics modules subject to rigorous environmental and EMI testing.

IC Role / Device Role / Timing Role: High-reliability NOR flash with dual-voltage monitoring (VCC/VCCQ), power-loss-aware sector erase status reporting, and deterministic reset behavior.

Use Value: −40 °C to +105 °C operation and AEC-Q100 Grade 2 qualification align with RTCA/DO-160 Section 21 Category M vibration and temperature profiles.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-reliability octal NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S28HL512TGABHB0133.0-V HL-T variant; lower max DDR throughput (332 MBps at 166 MHz); higher standby current (0.014 mA vs 0.011 mA)Targeted at legacy 3.3-V industrial systems; lacks ASIL-B certification documentation in public datasheetsSelect only if system uses 3.0-V I/O rails and does not require ISO 26262 compliance.
MX66UM1G45GXDIOMicron 1-Gb octal flash; 1.8-V, 400 MBps DDR; no ASIL-B certification; different SFDP parameter layout and reset timingUsed in cost-sensitive consumer electronics; lacks SafeBoot, EnduraFlex, and interface CRC featuresAcceptable for non-safety applications where density and speed match but functional safety is not required.

Compared with S28HL512TGABHB013 and MX66UM1G45GXDIO, the S28HS512TGABHB013 uniquely combines ASIL-B certification, EnduraFlex™ partitioning, and deterministic SafeBoot recovery - making it the only choice for automotive and medical systems requiring auditable safety lifecycle management.

Availability

S28HS512TGABHB013 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, industrial PLC firmware storage, and medical imaging system boot ROM requiring stable component supply across extended product lifecycles.

Supply support for S28HS512TGABHB013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance, safety-certified memory and microcontroller solutions for automotive, industrial, and communications markets.

The Semper® Flash family was developed specifically to replace parallel NOR and legacy SPI flash in safety-critical boot applications, delivering octal interface bandwidth, ISO 26262 compliance, and field-proven endurance for automotive ECUs and industrial controllers.

FAQ

What is the maximum clock frequency supported in DDR mode?

The S28HS512TGABHB013 supports DDR operation at up to 200 MHz, achieving 400 MBps read throughput. This is validated under HS-T (1.8-V) conditions with proper PCB layout, matched trace lengths, and termination for DQ/DS signals. The device automatically detects DDR mode via SFDP register settings; no external configuration resistor is required.

Does this part support both uniform and hybrid sector architectures?

Yes - the S28HS512TGABHB013 supports uniform (all 256 KB sectors), hybrid configuration 1 (32 × 4 KB sectors at top/bottom + remaining 256 KB), and hybrid configuration 2 (16 × 4 KB at top + 16 × 4 KB at bottom + remaining 256 KB). Sector architecture is configured via nonvolatile configuration registers and persists across power cycles.

How is SafeBoot recovery triggered after configuration corruption?

During power-on, SafeBoot verifies configuration registers and memory map integrity. If corruption is detected, the device enters SafeBoot recovery mode: it disables normal command execution, asserts INT# to alert the host, and exposes a dedicated recovery command sequence via CS#/CK/DQ0 that allows host firmware to restore valid configuration from backup sector or external source.

Can the 4 KB sectors be used for both code and data storage?

Yes - the thirty-two 4 KB sectors can be allocated anywhere in the address space (top, bottom, or split) and used for either executable code or configuration/data storage. Their higher endurance (300,000 cycles vs 1.28M for main array) makes them ideal for frequently updated parameters like calibration tables or OTA update staging buffers.

S28HS512TGABHB013 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
SEMPER™
Package/Case:
24-VBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR (SLC)
Memory Size:
512Mbit
Memory Organization:
64M x 8
Memory Interface:
SPI - Octal I/O
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
1.7ms
Access Time:
5.45 ns
Voltage - Supply:
1.7V ~ 2V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S28HS512TGABHB013 FAQ

1.How can I place an order for S28HS512TGABHB013 through Aetrix?

Please submit a Request for Quotation (RFQ) for S28HS512TGABHB013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S28HS512TGABHB013 reliable?

The price and inventory of S28HS512TGABHB013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S28HS512TGABHB013 is usually 5 days.

3.What payment methods are accepted for S28HS512TGABHB013?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S28HS512TGABHB013 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S28HS512TGABHB013?

S28HS512TGABHB013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S28HS512TGABHB013 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S28HS512TGABHB013?

For technical support, including S28HS512TGABHB013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S28HS512TGABHB013 requirements.

6.How does Aetrix verify that S28HS512TGABHB013 is sourced from the original manufacturer or authorized distributors?

All S28HS512TGABHB013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S28HS512TGABHB013 meets industry standards.

7.What is the process for return or replacement of S28HS512TGABHB013?

All S28HS512TGABHB013 units undergo pre-shipment inspection (PSI). If there is an issue with S28HS512TGABHB013, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S28HS512TGABHB013 part is unused and in its original packaging.

Return procedure for S28HS512TGABHB013:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S28HS512TGABHB013 Tags

  • S28HS512TGABHB013
  • S28HS512TGABHB013 PDF
  • S28HS512TGABHB013 Datasheet
  • S28HS512TGABHB013 Specifications
  • S28HS512TGABHB013 Images
  • Infineon Technologies
  • Infineon Technologies S28HS512TGABHB013
  • Buy S28HS512TGABHB013
  • S28HS512TGABHB013 Price
  • S28HS512TGABHB013 Distributor
  • S28HS512TGABHB013 Supplier
  • S28HS512TGABHB013 Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER