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Infineon Technologies S28HS512TGABHM010
- Part No.:
- S28HS512TGABHM010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S28HS512TGABHM010.pdf
- Description:
- IC FLASH 512MBIT SPI/OCTL 24FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:619
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Product details
Overview
S28HS512TGABHM010 from Cypress Semiconductor (now Infineon) is a 512-Mb (64-MB) 1.8-V HS-T Semper® Flash NOR memory with Octal xSPI interface, ISO 26262 ASIL-B compliant safety architecture, 24-ball BGA (6 × 8 mm), and EnduraFlex™ partitioning for high-endurance/long-retention use in automotive ADAS boot code storage.
For engineers reviewing the S28HS512TGABHM010 datasheet, S28HS512TGABHM010 pinout, S28HS512TGABHM010 application, or S28HS512TGABHM010 equivalent, key selection criteria include octal DDR read throughput (400 MBps), ASIL-B functional safety certification, 1.8-V core/I/O voltage, 25-year data retention, and AEC-Q100 Grade 1 (−40 °C to +125 °C) qualification.
Technical Context
This device implements Cypress's 45-nm MirrorBit® technology with two bits per cell and supports both JEDEC JESD251-compliant Octal Peripheral Interface (OPI) and legacy SPI. It features dual-mode operation: SDR (200 MHz, 200 MBps) and DDR (200 MHz, 400 MBps) read modes with Data Strobe (DS) synchronization for reliable high-speed capture.
The embedded architecture separates Host Interface Controller (HIC) and Embedded Algorithm Controller (EAC), enabling autonomous program/erase execution, SafeBoot initialization validation, and real-time sector erase status reporting. ECC (SECDED) corrects single-bit errors and detects double-bit errors across the entire memory array.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (64 MB) - sufficient for full firmware images and secure boot partitions in automotive ECUs. |
| Interface Standard | JEDEC JESD251 Octal xSPI - reduces pin count vs parallel NOR while supporting DDR burst reads up to 400 MBps. |
| Read Throughput | 400 MBps (DDR mode, 200 MHz clock) - enables sub-100 ms boot time for large firmware loads. |
| Endurance | 1,280,000 program-erase cycles (main array) - supports over 10 years of OTA update cycles in telematics modules. |
| Data Retention | 25 years at +125 °C - validated for lifetime reliability in engine control units under thermal stress. |
| Safety Certification | ISO 26262 ASIL-B compliant, ASIL-D ready - meets functional safety requirements for automotive safety-critical boot memory. |
| Supply Voltage | 1.7–2.0 V (VCC/VCCQ) - compatible with low-voltage SoC power domains and reduces system-level power consumption. |
| Temperature Range | AEC-Q100 Grade 1 (−40 °C to +125 °C) - qualified for placement near powertrain or chassis controllers. |
Pinout & Package
Package: 24-ball BGA, 6 × 8 mm, 1.0-mm pitch, halogen-free, lead-free (RoHS compliant).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable signal; all transactions begin/end with CS# edge transitions; places device in standby when HIGH. |
| CK | Serial Clock | Rising-edge–latched SDR; both-edge–latched DDR; timing reference for command/address/data transfer. |
| DQ[7:0] | Bidirectional Data Bus | Octal I/O for command, address, and data; supports x1 SPI (DQ0/DQ1 only) or full x8 OPI operation. |
| DS | Data Strobe Output | Synchronized toggle during read bursts; eliminates setup/hold timing margin concerns at 200 MHz DDR. |
| RESET# | Hardware Reset Input | Asynchronous reset with weak internal pull-up; returns device to array-read state and forces DQ/DS into high-Z. |
| INT# | Interrupt Output | Open-drain signal indicating completion of program/erase or ECC error detection; requires external 5–10 kΩ pull-up. |
| VCC / VSS | Core Power / Ground | 1.8-V core supply and return; decoupling required within 10 mm of package for stable high-speed operation. |
| VCCQ / VSSQ | I/O Power / Ground | 1.8-V I/O supply and return; isolated from core rails to suppress switching noise on data lines. |
Key Features
| Feature | Design Value |
|---|---|
| EnduraFlex™ Architecture | Enables user-defined partitioning of memory into high-endurance (≥1M cycles) and long-retention (25 yr) zones for mixed-use firmware/storage. |
| SafeBoot Initialization | Verifies configuration integrity at power-on and recovers from corruption using redundant boot parameter storage. |
| Interface CRC | End-to-end checksum on all command/address/data transfers between host and flash, detecting bus-level transmission errors. |
| Data Integrity CRC | Per-sector CRC coverage of memory array contents, enabling host-initiated background scrubbing and field failure diagnostics. |
| OTP Secure Silicon | 1024-byte one-time-programmable region for cryptographic keys, device IDs, or calibration data with hardware lock protection. |
Applications
| ADAS Domain Controller Boot Memory | Automotive Gateway Firmware Storage |
|---|---|
Use Scenario: Stores boot firmware and safety monitor code for radar/vision ECU that must initialize within 150 ms after power-on. IC Role / Device Role / Timing Role: Primary nonvolatile boot memory with deterministic read latency and ASIL-B–certified startup sequence. Use Value: 400 MBps DDR read speed and SafeBoot ensure verified, tamper-resistant boot within functional safety timing constraints. | Use Scenario: Holds multi-protocol stack firmware (CAN FD, Ethernet AVB, LIN) and secure OTA update payload in central vehicle gateway. IC Role / Device Role / Timing Role: High-reliability firmware repository supporting concurrent updates and rollback via hybrid sector architecture. Use Value: 1.28M-cycle endurance and 4 KB sector granularity allow frequent OTA patching without wearing out critical boot sectors. |
| Engine Control Unit (ECU) Calibration Storage | Electric Powertrain Inverter Firmware |
Use Scenario: Stores engine calibration maps and diagnostic logs subject to repeated write/erase cycles during service and tuning. IC Role / Device Role / Timing Role: Endurance-optimized memory partition holding volatile calibration parameters with guaranteed 25-year retention at 125 °C. Use Value: EnduraFlex™ allows dedicated 4 KB sectors configured for >1M cycles, eliminating premature wear in calibration tables. | Use Scenario: Hosts motor control firmware and safety shutdown logic in traction inverter, operating continuously at junction temperatures >110 °C. IC Role / Device Role / Timing Role: Safety-critical NOR flash providing fail-safe boot and runtime firmware access under thermal stress. Use Value: AEC-Q100 Grade 1 rating and 25-year retention at +125 °C ensure uninterrupted operation over full vehicle lifetime. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-reliability automotive NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S28HL512TGABHM010 | 3.0-V HL-T variant; higher VCC/VCCQ (2.7–3.6 V); lower max DDR read rate (332 MBps at 166 MHz) | Used where legacy 3.3-V power domains persist; less suitable for ultra-low-power SoC integration | Select when system lacks 1.8-V rail or requires backward compatibility with older 3.3-V designs. |
| IS25LP512D-JBLE | No ASIL-B certification; no EnduraFlex™; 256 KB uniform sector only; 133 MHz max SPI clock | Limited to non-safety-critical infotainment or body control modules | Choose only for cost-sensitive, non-automotive applications lacking functional safety or endurance requirements. |
Compared with S28HL512TGABHM010 and IS25LP512D-JBLE, the S28HS512TGABHM010 uniquely delivers ASIL-B compliance, 400 MBps DDR throughput, and field-configurable endurance/retention-making it the only option qualified for safety-critical boot in Grade 1 automotive environments.
Availability
S28HS512TGABHM010 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, electric powertrain inverters, engine control units, and gateway modules requiring stable component supply across extended product lifecycles.
Supply support for S28HS512TGABHM010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor was acquired by Infineon Technologies in 2020; Semper Flash products are now part of Infineon's automotive and industrial memory portfolio.
This device belongs to the Semper® Flash with Octal Interface product line, engineered specifically for functional safety–critical automotive applications requiring high-speed, certified, and thermally robust nonvolatile memory.
FAQ
Is S28HS512TGABHM010 pin-compatible with earlier Semper Flash devices like S28HS256T?
Yes - all 24-ball BGA Semper Flash devices (S28HS256T/S28HS512T/S28HS01GT) share identical mechanical footprint, ball map, and signal assignment. The pinout is fully compatible across densities, enabling drop-in replacement in existing PCB layouts without redesign.
Does this device support both x1 SPI and x8 Octal modes on the same DQ pins?
Yes - DQ[7:0] operate in x1 SPI mode (DQ0 = SI, DQ1 = SO, others unused) or full x8 Octal mode (all eight lines active bidirectionally), selected via configuration register. No hardware reconfiguration is needed; mode is software-switchable at runtime.
What is the role of the DS (Data Strobe) pin during DDR read operations?
The DS pin toggles synchronously with output data edges during DDR reads, providing a dedicated clock-like signal for the host controller to latch valid data. This eliminates timing skew issues inherent in source-synchronous DDR interfaces and simplifies PCB layout for >166 MHz operation.
Can the 4 KB sectors be used independently for firmware update staging without affecting main array endurance?
Yes - the hybrid sector architecture allows thirty-two 4 KB sectors to be placed at top/bottom or split evenly. These sectors support 300,000 program-erase cycles and can serve as dedicated update buffers, isolating wear from the main 256 KB sectors used for static firmware storage.
S28HS512TGABHM010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- SEMPER™
- Package/Case:
- 24-VBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Octal I/O
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 1.7ms
- Access Time:
- 5.45 ns
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S28HS512TGABHM010 FAQ
1.How can I place an order for S28HS512TGABHM010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S28HS512TGABHM010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S28HS512TGABHM010 reliable?
The price and inventory of S28HS512TGABHM010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S28HS512TGABHM010 is usually 5 days.
3.What payment methods are accepted for S28HS512TGABHM010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S28HS512TGABHM010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S28HS512TGABHM010?
S28HS512TGABHM010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S28HS512TGABHM010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S28HS512TGABHM010?
For technical support, including S28HS512TGABHM010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S28HS512TGABHM010 requirements.
6.How does Aetrix verify that S28HS512TGABHM010 is sourced from the original manufacturer or authorized distributors?
All S28HS512TGABHM010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S28HS512TGABHM010 meets industry standards.
7.What is the process for return or replacement of S28HS512TGABHM010?
All S28HS512TGABHM010 units undergo pre-shipment inspection (PSI). If there is an issue with S28HS512TGABHM010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S28HS512TGABHM010 part is unused and in its original packaging.
Return procedure for S28HS512TGABHM010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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