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Infineon Technologies S28HS512TGABHM013
- Part No.:
- S28HS512TGABHM013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-VBGA
- Datasheet:
-
S28HS512TGABHM013.pdf
- Description:
- IC FLASH 512MBIT SPI/OCTL 24FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,488
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Product details
Overview
S28HS512TGABHM013 from Cypress Semiconductor is a 512-Mb (64-MB), 1.8-V HS-T Semper® Flash NOR memory with Octal xSPI interface, supporting DDR read rates up to 400 MBps and SDR up to 200 MBps. It features 256 KB uniform or hybrid sector architecture, 1,280,000 program-erase cycles for main array, and built-in SECDED ECC for single-bit correction and double-bit detection. Used in automotive ADAS ECUs requiring ASIL-B compliance and high-reliability boot code storage.
For engineers reviewing the S28HS512TGABHM013 datasheet, S28HS512TGABHM013 pinout, S28HS512TGABHM013 application, or S28HS512TGABHM013 equivalent, this page delivers verified technical context, validated pin functions, real-world automotive and industrial use cases, and confirmed alternative parts with documented functional differences.
Technical Context
This device implements Cypress's 45-nm MirrorBit® technology with two bits per cell and EnduraFlex™ architecture enabling configurable high-endurance (≥1M cycles) and long-retention (25-year) partitions. Its dual-controller architecture separates Host Interface Controller (HIC) for protocol handling from Embedded Algorithm Controller (EAC) for autonomous erase/program execution.
The Octal interface complies with JEDEC JESD251, supporting both 8S-8S-8S and 8D-8D-8D modes with Data Strobe (DS) for timing-critical DDR reads. SafeBoot monitors initialization integrity, while Interface CRC and Data Integrity CRC provide end-to-end error detection across bus and array.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (64 MB) - sufficient for full firmware images and secure boot code in automotive ECUs |
| Supply Voltage | 1.7 V to 2.0 V (HS-T) - optimized for low-power 1.8-V system rails with <11 µA deep power-down current |
| Read Throughput | Up to 400 MBps (DDR, 200 MHz) - enables sub-100 ms firmware load times from flash to RAM |
| Endurance | Min. 1,280,000 program-erase cycles (main array) - supports over 10 years of OTA update cycles in connected vehicles |
| Data Retention | Minimum 25 years - guaranteed retention at +125 °C (Grade 1 automotive), critical for safety-critical boot code |
| Error Correction | SECDED ECC - corrects single-bit errors and detects double-bit errors in real time during read operations |
| Interface Standard | JEDEC JESD251-compliant Octal xSPI - eliminates parallel bus complexity while maintaining bandwidth comparable to QSPI x4 |
Pinout & Package
24-ball BGA package, 6 × 8 mm, 1.0-mm pitch, halogen-free and lead-free (RoHS compliant). Designed for automotive-grade thermal cycling reliability and PCB assembly compatibility with standard reflow profiles.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Mandatory active-low enable signal; places device in standby when HIGH, ignores all other inputs |
| CK | Clock Input | Rising-edge–latched in SDR; both-edge–latched in DDR; defines timing for all serial transactions |
| DQ[7:0] | Bidirectional Data Bus | Octal I/O for command/address/data in x8 mode; DQ0/DQ1 revert to SI/SO in legacy SPI x1 mode |
| DS | Data Strobe Output | Synchronized toggle during read bursts; enables precise data capture at >166 MHz without external clock forwarding |
| RESET# | Hardware Reset | Optional active-low reset with internal weak pull-up; returns device to array-read state after POR-like initialization |
| INT# | Interrupt Output | Open-drain signal indicating completion of program/erase or ECC error detection; requires 5–10 kΩ external pull-up |
| VCC / VCCQ | Power Supplies | VCC = 1.7–2.0 V core supply; VCCQ = same voltage for I/O - decoupling required per JEDEC layout guidelines |
| VSS / VSSQ | Ground Returns | Separate core (VSS) and I/O (VSSQ) grounds - mandatory for noise isolation in high-speed DDR operation |
Key Features
| Feature | Design Value |
|---|---|
| ASIL-B Functional Safety Certification | ISO 26262-compliant design with SafeBoot, configuration corruption recovery, and failure reporting for automotive safety goals |
| EnduraFlex™ Partitioning | Allows host-defined allocation of sectors to high-endurance (>1M cycles) or long-retention (25 yr) modes - no hardware change required |
| Octal xSPI + Legacy SPI Dual Mode | Single device supports both high-bandwidth x8 DDR and backward-compatible x1 SPI - simplifies platform reuse across product generations |
| Embedded Diagnostics | Real-time reporting of program/erase status, sector erase counter, ECC error address trapping, and interface CRC failure flags |
| Secure Silicon Region | 1024-byte OTP array for cryptographic keys, device IDs, or secure boot configuration - immune to field reprogramming |
Applications
| Automotive ADAS ECU | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot firmware and sensor fusion algorithms in radar control units operating at −40 °C to +125 °C. IC Role / Device Role / Timing Role: Primary nonvolatile boot memory with deterministic read latency and SafeBoot validation before CPU execution. Use Value: ASIL-B certification and 25-year retention ensure functional safety compliance without external ECC logic or refresh management. |
Use Scenario: Holds field-upgradable ladder logic and motion control firmware in factory automation controllers. IC Role / Device Role / Timing Role: High-reliability code storage with hybrid sector architecture enabling fast updates to small configuration sectors while preserving large application blocks. Use Value: 1,280,000 program-erase cycles support daily firmware patches over 10+ years of continuous operation. |
| Medical Imaging System Boot | Avionics Display Processor |
Use Scenario: Stores certified boot loader and DICOM image processing firmware in MRI subsystems requiring Class III medical device traceability. IC Role / Device Role / Timing Role: Secure, tamper-resistant boot memory with OTP Secure Silicon region for cryptographic key binding. Use Value: Built-in Interface CRC and Data Integrity CRC eliminate need for host-side checksum verification, reducing boot time by ~12 ms. |
Use Scenario: Provides deterministic, radiation-tolerant firmware storage for flight display processors in commercial aircraft. IC Role / Device Role / Timing Role: High-speed Octal DDR interface enables rapid loading of graphics assets and real-time OS kernels into DDR3 memory. Use Value: 400 MBps read throughput reduces boot sequence duration below DO-178C Level A timing constraints for critical display initialization. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-reliability NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S28HL512TGABHM013 | 3.0-V HL-T variant; higher VCC/VCCQ (2.7–3.6 V); lower max DDR rate (332 MBps at 166 MHz) | Used where legacy 3.3-V power domains exist; less suitable for ultra-low-power battery-backed systems | Select when system already uses 3.0-V I/O rails and does not require <2.0-V operation. |
| MX25L51245GMI-10G | No ASIL-B certification; no EnduraFlex™; no DS signal; max Octal SDR only (200 MBps); no SafeBoot or embedded diagnostics | Limited to non-safety-critical consumer or industrial applications without functional safety requirements | Choose only for cost-sensitive designs lacking ISO 26262 or long-retention mandates. |
Compared with S28HL512TGABHM013 and MX25L51245GMI-10G, the S28HS512TGABHM013 uniquely delivers ASIL-B compliance, 25-year retention at +125 °C, and integrated diagnostics - making it the sole option for automotive Grade 1 and medical Class III boot memory where safety and longevity are non-negotiable.
Availability
S28HS512TGABHM013 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial PLCs, medical imaging subsystems, and avionics display processors requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S28HS512TGABHM013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a global leader in high-performance, reliable semiconductor solutions for automotive, industrial, and IoT applications, with deep expertise in nonvolatile memory and functional safety design.
This device belongs to the Semper® Flash with Octal Interface product line, engineered specifically for safety-critical systems demanding ASIL-B certification, deterministic boot behavior, and field-programmable endurance/retention trade-offs via EnduraFlex™ architecture.
FAQ
Is S28HS512TGABHM013 pin-compatible with S28HL512TGABHM013?
Yes - both use identical 24-ball BGA (6 × 8 mm) packaging and share identical pinout, signal definitions, and mechanical footprint. The only electrical difference is supply voltage range: S28HS512T requires 1.7–2.0 V, while S28HL512T operates at 2.7–3.6 V. Swapping requires corresponding power rail adjustment.
Does this device support Quad SPI mode?
No - S28HS512TGABHM013 supports only legacy Single I/O SPI (x1) and Octal I/O xSPI (x8) modes per JEDEC JESD251. It does not implement Quad SPI (x4) signaling; attempting Quad commands results in undefined behavior or command rejection.
What is the purpose of the DNU pins?
DNU (Do Not Use) pins - located at positions A1, A2, B1, C1, D1, and E1 in the 24-ball BGA - are electrically unconnected and must remain unpopulated on the PCB. Routing traces or applying solder paste to these balls risks internal shorting or package damage during reflow.
Can the Secure Silicon region be reprogrammed after initial programming?
No - the 1024-byte Secure Silicon region is one-time programmable (OTP). Once written, its contents cannot be erased or modified. It is intended for permanent storage of cryptographic keys, unique identifiers, or immutable boot configuration parameters.
S28HS512TGABHM013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- SEMPER™
- Package/Case:
- 24-VBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Octal I/O
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- 1.7ms
- Access Time:
- 5.45 ns
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-FBGA (6x8)
S28HS512TGABHM013 FAQ
1.How can I place an order for S28HS512TGABHM013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S28HS512TGABHM013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S28HS512TGABHM013 reliable?
The price and inventory of S28HS512TGABHM013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S28HS512TGABHM013 is usually 5 days.
3.What payment methods are accepted for S28HS512TGABHM013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S28HS512TGABHM013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S28HS512TGABHM013?
S28HS512TGABHM013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S28HS512TGABHM013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S28HS512TGABHM013?
For technical support, including S28HS512TGABHM013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S28HS512TGABHM013 requirements.
6.How does Aetrix verify that S28HS512TGABHM013 is sourced from the original manufacturer or authorized distributors?
All S28HS512TGABHM013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S28HS512TGABHM013 meets industry standards.
7.What is the process for return or replacement of S28HS512TGABHM013?
All S28HS512TGABHM013 units undergo pre-shipment inspection (PSI). If there is an issue with S28HS512TGABHM013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S28HS512TGABHM013 part is unused and in its original packaging.
Return procedure for S28HS512TGABHM013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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