Infineon Technologies S28HS512TGABHV010

Overview

S28HS512TGABHV010 from Cypress Semiconductor is a 512-Mb (64-MB) high-reliability NOR flash memory with Octal xSPI interface, 1.8-V core/I/O supply, AEC-Q100 Grade 2 qualification (−40 °C to +105 °C), and ISO 26262 ASIL-B compliance for automotive safety-critical boot code storage. It supports DDR octal read at up to 400 MBps, features EnduraFlex™ partitioning for endurance/retention optimization, and integrates SECDED ECC, interface CRC, and SafeBoot for fault detection and recovery.

For engineers reviewing the S28HS512TGABHV010 datasheet, S28HS512TGABHV010 pinout, S28HS512TGABHV010 application, or S28HS512TGABHV010 equivalent, key selection considerations include octal DDR timing margin, ASIL-B functional safety certification, hybrid sector architecture (32 × 4 KB + remainder 256 KB), 1.28M program-erase cycles, and 24-ball 6×8 mm BGA packaging with VCCQ/VSSQ separation.

Technical Context

This device implements Cypress's 45-nm MirrorBit® technology with dual-bit-per-cell storage and a dual-controller architecture: Host Interface Controller (HIC) handles protocol-level transactions (SPI/OPI), while Embedded Algorithm Controller (EAC) manages autonomous erase/program algorithms, ECC generation, and SafeBoot initialization sequences.

It supports JEDEC JESD251-compliant octal interface in both SDR (200 MHz, 200 MBps) and DDR (200 MHz, 400 MBps) modes with Data Strobe (DS) for precise read-data capture, plus legacy x1 SPI fallback. Sector architecture is configurable as uniform 256 KB or hybrid (top/bottom 4 KB sectors), and page programming buffer is selectable between 256 B and 512 B.

Key Specifications

Pinout & Package

24-ball BGA package (6×8 mm, 1.0-mm pitch), halogen-free and lead-free, with separate core (VCC/VSS) and I/O (VCCQ/VSSQ) power domains to minimize noise coupling during high-speed octal reads.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-reliability NOR flash applications.

Compared with S28HS512TGABHV010, the 030 variant offers identical functionality in a larger package for thermal margin, while the HL-T version trades speed and safety readiness for 3.0-V compatibility-neither is pin- or timing-compatible without redesign.

Availability

S28HS512TGABHV010 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, industrial PLCs, and medical imaging systems requiring stable component supply across extended product lifecycles.

Supply support for S28HS512TGABHV010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance, safety-certified memory and microcontroller solutions for automotive, industrial, and communications markets.

S28HS512TGABHV010 belongs to the Semper® Flash with Octal Interface product line, engineered specifically for functional safety-critical boot and firmware storage in automotive ECUs and industrial control systems demanding ASIL-B compliance and 25-year data retention.

FAQ

What is the maximum clock frequency supported in DDR octal mode?

The S28HS512TGABHV010 supports DDR octal operation at up to 200 MHz, delivering 400 MBps effective throughput. This requires matched trace lengths and proper termination per JEDEC JESD251 guidelines. The device uses CK and DS signals synchronously to ensure setup/hold timing margins are met at this rate.

Does this part require external hardware reset circuitry?

No. The RESET# pin has an internal weak pull-up, so it may be left unconnected if hardware reset is not needed. When asserted, it forces immediate reinitialization and places DQ/DS/INT# in high-impedance state. For automotive systems, a dedicated reset supervisor IC is recommended to meet cold-cranking voltage thresholds.

How does EnduraFlex™ architecture affect partition configuration?

EnduraFlex™ allows the host to define up to four non-overlapping partitions via SFDP-defined commands, each assigned either high-endurance (≥1.28M cycles) or long-retention (25 yr) behavior. Partition boundaries must align with sector boundaries (4 KB or 256 KB); no runtime reconfiguration is permitted after initial setup.

Is the 24-ball BGA package compatible with standard reflow profiles?

Yes-the S28HS512TGABHV010 uses a standard SnAgCu (SAC305) solder paste profile with peak temperature ≤260 °C. However, ultrasonic cleaning is prohibited, and exposure above 150 °C for prolonged periods risks package delamination or data corruption per Cypress advisory.