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Infineon Technologies S28HS512TGABHV013

Part No.:
S28HS512TGABHV013
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-VBGA
Datasheet:
AetrixS28HS512TGABHV013.pdf
Description:
IC FLASH 512MBIT SPI/OCTL 24FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,391

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Product details

Overview

S28HS512TGABHV013 from Cypress Semiconductor is a 512-Mb (64-MB) high-reliability NOR flash memory with Octal xSPI interface, 1.8-V core/I/O supply, AEC-Q100 Grade 2 automotive qualification (−40 °C to +105 °C), and ISO 26262 ASIL-B compliant functional safety architecture. It delivers up to 400 MBps DDR read throughput via 8D-8D-8D interface, supports EnduraFlex™ partitioning for endurance/retention optimization, and integrates SECDED ECC, interface CRC, and SafeBoot for robust embedded boot and code storage in safety-critical automotive ECUs.

For engineers reviewing the S28HS512TGABHV013 datasheet, S28HS512TGABHV013 pinout, S28HS512TGABHV013 application, or S28HS512TGABHV013 equivalent, key selection considerations include octal DDR timing compliance (JESD251), ASIL-B certification status, 24-ball 6×8 mm BGA package compatibility, hybrid sector architecture (32 × 4 KB + remainder 256 KB), and EnduraFlex™ programmable endurance partitioning.

Technical Context

This device implements Cypress's 45-nm MirrorBit® technology with two bits per cell and dual-controller architecture: Host Interface Controller (HIC) handles protocol-level transactions (SPI/OPI), while Embedded Algorithm Controller (EAC) manages autonomous program/erase sequences, ECC generation, and SafeBoot initialization. The HIC supports both legacy x1 SPI (up to 21 MBps) and octal SDR/DDR modes (up to 400 MBps).

It features integrated diagnostics including interface CRC (for command/address/data integrity), data integrity CRC (memory array checksum), sector erase status reporting, and real-time ECC error trapping with address capture. The EnduraFlex™ architecture enables host-defined partitions-each configurable for either >1.28M P/E cycles or 25-year data retention-without hardware modification.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density512 Mb (64 MB) - sufficient for full firmware images and secure boot code in modern ADAS and powertrain ECUs.
Interface StandardJEDEC JESD251-compliant Octal Peripheral Interface (OPI) - enables high-bandwidth, low-pin-count connection to SoCs with xSPI controllers.
Max Read Throughput400 MBps (DDR mode, 200 MHz clock) - meets real-time code execution requirements for automotive microcontrollers without external cache.
Endurance (Main Array)Min. 1,280,000 program-erase cycles - supports frequent OTA update logging and configuration storage in telematics modules.
Data RetentionMinimum 25 years at 105 °C - validated for lifetime operation in under-hood automotive environments without refresh.
Sector ArchitectureHybrid: thirty-two 4 KB sectors + remaining 256 KB sectors - allows fine-grained update of boot code while preserving large application blocks.
Functional SafetyISO 26262 ASIL-B certified, ASIL-D ready - includes SafeBoot, ECC, interface CRC, and diagnostic registers required for FMEDA and safety case evidence.

Pinout & Package

Package: 24-ball BGA, 6 × 8 mm, 1.0-mm pitch, halogen-free, lead-free (RoHS compliant). Compatible with standard reflow profiles; ultrasonic cleaning prohibited.

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip SelectActive-low enable signal; all transactions begin/end on CS# edge; places outputs in high-Z when deasserted.
CKClock InputRising-edge latched in SDR; both edges used in DDR; defines timing for command, address, and data transfers.
DQ[7:0]Bidirectional Data BusOctal I/O for OPI commands/addresses/data; also supports legacy x1 SPI (DQ0 = SI, DQ1 = SO) when configured.
DSData Strobe OutputSynchronized toggle during read bursts; eliminates setup/hold timing margin concerns for high-speed data capture in SoC receivers.
RESET#Hardware Reset InputAsynchronous active-low reset with internal weak pull-up; returns device to array-read state independent of CS# state.
INT#Interrupt OutputOpen-drain signal indicating completion of program/erase or ECC error detection; requires external 5–10 kΩ pull-up.
VCC / VCCQPower SuppliesVCC = 1.7–2.0 V core supply; VCCQ = same voltage for I/O drivers - single-rail simplifies power design in 1.8-V systems.
VSS / VSSQGround ReturnsSeparate core (VSS) and I/O (VSSQ) grounds - reduces noise coupling between logic and high-speed interface paths.

Key Features

FeatureDesign Value
EnduraFlex™ ArchitectureEnables runtime partitioning of memory into high-endurance (≥1.28M cycles) and long-retention (25 yr) zones - critical for OTA update staging and calibration storage.
SafeBoot InitializationDetects configuration corruption at power-on and executes recovery from redundant boot sectors - ensures deterministic startup after brown-out or reset glitch.
SECDED ECC EngineCorrects single-bit errors and detects double-bit errors on-the-fly during read; includes address-trapped error reporting for system-level fault isolation.
Interface CRC ProtectionEnd-to-end CRC over command, address, and data payloads - prevents silent corruption from PCB noise or signal integrity issues on high-speed traces.
Hybrid Sector Layout32 × 4 KB sectors (top/bottom or split) + uniform 256 KB sectors - supports secure bootloader updates without erasing full application image.

Applications

ADAS Domain Controller Boot StorageElectric Powertrain ECU Firmware

Use Scenario: Stores boot ROM, secure bootloader, and ASIL-B safety monitor firmware in radar or camera processing units requiring guaranteed startup within 100 ms after power-on.

IC Role / Device Role / Timing Role: Primary nonvolatile boot memory with SafeBoot and ECC ensuring deterministic initialization and runtime code integrity verification.

Use Value: Eliminates need for external error-checking logic; ASIL-B certification reduces functional safety validation effort by 40% versus generic NOR flash.

Use Scenario: Holds motor control algorithms, torque maps, and calibration data in inverter control units operating continuously at 105 °C ambient.

IC Role / Device Role / Timing Role: High-endurance code and parameter storage with EnduraFlex™-configured 4 KB sectors for frequent map updates and 256 KB sectors for static firmware.

Use Value: Achieves >10 years field life at junction temperature without refresh cycles, validated per AEC-Q100 Grade 2 thermal stress profile.

Automotive Gateway Secure Firmware VaultInfotainment Head Unit OTA Update Buffer

Use Scenario: Stores cryptographic keys, secure boot certificates, and trusted execution environment (TEE) images in vehicle gateways handling CAN-FD and Ethernet communication.

IC Role / Device Role / Timing Role: Secure silicon region (1024-byte OTP) + ECC-protected main array for immutable root-of-trust and tamper-resistant firmware signing.

Use Value: Meets UNECE R155 cybersecurity management system (CSMS) requirements for hardware-based key protection and secure boot chain.

Use Scenario: Buffers full OTA firmware packages (up to 64 MB) prior to atomic flash update in head units with dual-bank memory architecture.

IC Role / Device Role / Timing Role: High-throughput octal DDR interface enables <5 s download time for 64 MB images over PCIe-connected SoC; hybrid sectors isolate update staging area.

Use Value: Reduces customer-perceived update downtime by 70% versus quad-SPI alternatives; DS signal simplifies timing closure on 200 MHz read bursts.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-reliability automotive NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S28HL512TGABHV0133.0-V core/I/O supply (2.7–3.6 V); identical density, package, temp grade, and feature set except voltage domain.Requires separate 3.0-V LDO; incompatible with 1.8-V SoC I/O rails; higher active current in DDR mode (75 mA vs. 156 mA at 200 MHz).Select only if system already uses 3.0-V I/O infrastructure and needs backward compatibility with legacy HL-T designs.
MX66UM1G45GXDIOMicron 1-Gb octal flash; 1.8-V; supports x4/x8/x16 OPI but lacks ASIL-B certification, SafeBoot, and EnduraFlex™ partitioning.No functional safety documentation or diagnostic coverage metrics; requires external ECC and boot validation logic.Acceptable for non-safety-critical infotainment subsystems where cost is prioritized over certification overhead.

Compared with S28HL512TGABHV013 and MX66UM1G45GXDIO, the S28HS512TGABHV013 uniquely combines ASIL-B certification, EnduraFlex™ endurance tuning, and SafeBoot in a 1.8-V octal NOR package - making it the only drop-in solution for new automotive ECU designs requiring zero safety case gaps.

Availability

S28HS512TGABHV013 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, electric powertrain ECUs, gateway security vaults, and infotainment OTA update buffers requiring stable component supply across extended product lifecycles.

Supply support for S28HS512TGABHV013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a leader in high-reliability memory and microcontroller solutions for automotive, industrial, and communications markets, with deep expertise in functional safety and embedded security.

The Semper® Flash with Octal Interface product line was designed specifically for next-generation automotive ECUs requiring ASIL-B-certified, high-bandwidth, low-pin-count code storage - addressing the convergence of safety, performance, and space constraints in Zonal and Centralized E/E architectures.

FAQ

What is the maximum clock frequency supported in DDR mode for S28HS512TGABHV013?

The device supports DDR operation at up to 200 MHz clock frequency, delivering 400 MBps effective read throughput. This is specified in the datasheet under "Octal Read DDR (HS-T)" with initial access latency of 23 cycles. The 200 MHz limit applies strictly to the CK input; exceeding it violates timing margins and may cause read data corruption or command rejection.

Does S28HS512TGABHV013 require external ECC circuitry?

No. The device integrates a hardware SECDED (Single Error Correction, Double Error Detection) engine that operates transparently during all read operations. It corrects single-bit errors and reports double-bit errors with trapped address information via status registers - eliminating need for external ECC logic or software correction routines.

How does SafeBoot verify configuration integrity at power-on?

SafeBoot performs CRC checks on configuration registers and boot sector headers during initialization. If corruption is detected, it automatically switches to a redundant backup configuration or boot sector and signals failure via INT# or status register bits. Recovery is autonomous and requires no host intervention, ensuring deterministic startup even after power glitches.

Can the 4 KB sectors be programmed independently of the 256 KB sectors?

Yes. The hybrid sector architecture allows individual 4 KB sectors to be erased and programmed without affecting adjacent 256 KB sectors. This is essential for updating bootloader parameters or calibration tables while preserving main application firmware - verified in the datasheet's "Sector Erase Status indicator" and "Hybrid Configuration 1/2" sections.

S28HS512TGABHV013 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
SEMPER™
Package/Case:
24-VBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR (SLC)
Memory Size:
512Mbit
Memory Organization:
64M x 8
Memory Interface:
SPI - Octal I/O
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
1.7ms
Access Time:
5.45 ns
Voltage - Supply:
1.7V ~ 2V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-FBGA (6x8)

S28HS512TGABHV013 FAQ

1.How can I place an order for S28HS512TGABHV013 through Aetrix?

Please submit a Request for Quotation (RFQ) for S28HS512TGABHV013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S28HS512TGABHV013 reliable?

The price and inventory of S28HS512TGABHV013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S28HS512TGABHV013 is usually 5 days.

3.What payment methods are accepted for S28HS512TGABHV013?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S28HS512TGABHV013 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S28HS512TGABHV013?

S28HS512TGABHV013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S28HS512TGABHV013 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S28HS512TGABHV013?

For technical support, including S28HS512TGABHV013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S28HS512TGABHV013 requirements.

6.How does Aetrix verify that S28HS512TGABHV013 is sourced from the original manufacturer or authorized distributors?

All S28HS512TGABHV013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S28HS512TGABHV013 meets industry standards.

7.What is the process for return or replacement of S28HS512TGABHV013?

All S28HS512TGABHV013 units undergo pre-shipment inspection (PSI). If there is an issue with S28HS512TGABHV013, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S28HS512TGABHV013 part is unused and in its original packaging.

Return procedure for S28HS512TGABHV013:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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