My Inquiry
My Account
Infineon Technologies S29AL008J55TFNR10
- Part No.:
- S29AL008J55TFNR10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29AL008J55TFNR10.pdf
- Description:
- IC FLASH 8MBIT PARALLEL 48TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:200
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29AL008J55TFNR10 from Infineon Technologies (formerly Cypress) is an 8 Mbit (1M × 8-bit / 512K × 16-bit), 3.0 V-only boot sector Flash memory with 55 ns access time, automotive-grade AEC-Q100 Grade 1 support (–40°C to +125°C), and flexible sector architecture including one 16 KB, two 8 KB, one 32 KB, and fifteen 64 KB sectors. It operates across 2.7–3.6 V, supports in-system programming without VPP, and integrates Secured Silicon Sector with 128-word factory-programmable serial ID.
For engineers reviewing the S29AL008J55TFNR10 datasheet, S29AL008J55TFNR10 pinout, S29AL008J55TFNR10 application, or S29AL008J55TFNR10 equivalent, key selection criteria include boot-block configuration (top/bottom), CFI compliance for host auto-configuration, Erase Suspend/Resume capability for real-time firmware updates, and hardware write protection via WP# tied to boot-sector boundaries.
Technical Context
The S29AL008J55TFNR10 implements a command-register-driven state machine for Embedded Erase and Embedded Program algorithms, eliminating external timing control. It uses Fowler-Nordheim tunneling for erase and hot-electron injection for program operations, with internal voltage regulation enabling single 3.0 V supply operation.
Its dual-mode interface supports byte (x8, DQ7–DQ0) and word (x16, DQ15–DQ0) data widths via BYTE# pin, while RY/BY#, DQ7 (Data# Polling), and DQ6/DQ2 (toggle bits) provide concurrent hardware/software status monitoring during erase and program cycles.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 8 Mbit (1,048,576 × 8-bit or 524,288 × 16-bit) |
| Access Time | 55 ns max - enables zero-wait-state operation with high-speed microcontrollers |
| Voltage Range | 2.7–3.6 V - supports battery-powered and wide-input industrial systems |
| Cycling Endurance | 1,000,000 erase/program cycles per sector - ensures long-term field reliability |
| Data Retention | 20 years typical - meets automotive and industrial firmware storage requirements |
| Operating Temp | –40°C to +125°C (AEC-Q100 Grade 1) - qualified for under-hood and powertrain ECUs |
| Power Consumption | 0.2 µA standby/automatic sleep - critical for always-on automotive modules |
Pinout & Package
Package: 48-ball Fine-pitch BGA (VBK048), 0.8 mm pitch, 8.15 mm × 6.15 mm × 1.00 mm body.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus supporting full 1M-byte or 512K-word addressing |
| DQ0–DQ15 | Data I/O (x16) / DQ0–DQ7 (x8) | DQ15/A-1 serves as MSB data (word mode) or LSB address (byte mode); BYTE# selects width |
| CE#, OE#, WE# | Chip/Output/Write Enable | Independent controls eliminate bus contention; enable standard microprocessor timing |
| WP# | Hardware Write Protect | At VIL, locks first (bottom boot) or last (top boot) 16 KB sector - prevents accidental firmware overwrite |
| RY/BY# | Ready/Busy Output | Active-low open-drain signal indicates completion of erase/program operations |
| RESET# | Hardware Reset Input | Aborts ongoing operation and forces device into read-array mode - synchronizes boot sequence |
Key Features
| Feature | Design Value |
|---|---|
| CFI Compliance | Enables host software to auto-detect device geometry, timing, and command set - eliminates hardcoded Flash drivers |
| Erase Suspend/Resume | Pauses active sector erase to allow read/program in non-erasing sectors - supports real-time firmware patching |
| Secured Silicon Sector | 128-word (256-byte) factory- or customer-lockable region with 8-word electronic serial number - provides immutable device identity |
| Unlock Bypass Mode | Reduces multi-byte programming time by 50% (2-cycle vs. 4-cycle command sequence) - accelerates field firmware updates |
| Flexible Boot Block | Selectable top or bottom 16 KB boot sector - accommodates legacy BIOS/UEFI and custom bootloader partitioning |
Applications
| Automotive Powertrain Control Unit | Industrial PLC Firmware Storage |
|---|---|
|
Use Scenario: Storing calibrated engine maps and diagnostic code in ECU flash memory subject to frequent reprogramming over vehicle lifetime. IC Role / Device Role / Timing Role: Non-volatile firmware storage with AEC-Q100 Grade 1 qualification and 1M-cycle endurance. Use Value: Hardware WP# and sector protection prevent corruption during CAN-based OTA updates; 55 ns access enables fast boot from flash. |
Use Scenario: Holding ladder logic firmware and configuration data in modular PLCs requiring field-upgradable code without downtime. IC Role / Device Role / Timing Role: In-system programmable boot-sector Flash with Erase Suspend for background firmware validation. Use Value: CFI interface allows generic loader software to auto-configure; 20-year retention ensures 15+ year product lifecycle support. |
| Medical Imaging System Boot ROM | Avionics Display Controller Memory |
|
Use Scenario: Hosting certified boot firmware and safety-critical initialization routines in MRI/CT scanner controllers. IC Role / Device Role / Timing Role: Secure, tamper-resistant boot memory with Secured Silicon Sector for device authentication. Use Value: Factory-programmed 8-word serial number enables cryptographic binding to OEM firmware signing keys. |
Use Scenario: Storing display firmware and graphics assets in DO-178C-compliant cockpit displays with strict power budget constraints. IC Role / Device Role / Timing Role: Low-power Flash with 0.2 µA sleep current and extended temperature operation. Use Value: Automatic Sleep mode reduces idle power in always-on avionics subsystems; –40°C to +125°C rating covers cabin-to-avionics bay environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar boot-sector Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29AL008J70TFNR10 | 70 ns access time; otherwise identical architecture, pinout, and command set | Lower performance grade; suitable where microcontroller wait states are acceptable | Select when system clock speed ≤ 10 MHz or cost sensitivity outweighs timing margin |
| MX29LV008CTTI-55G | Macronix part; 55 ns access, same density and voltage range but non-CFI, no Secured Silicon Sector | Lacks CFI auto-configuration and hardware-secured ID - requires fixed driver integration | Choose only if legacy design uses Macronix-specific command sequences and security is handled externally |
Compared with S29AL008J70TFNR10 and MX29LV008CTTI-55G, the S29AL008J55TFNR10 uniquely combines fastest 55 ns timing, CFI interoperability, and factory-programmable secure ID - making it optimal for new automotive and safety-critical designs requiring both performance and traceability.
Availability
S29AL008J55TFNR10 is available at Aetrix Electronics and suitable for automotive powertrain control units, industrial PLC firmware storage, and medical imaging system boot ROMs requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualification.
Supply support for S29AL008J55TFNR10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and memory solutions with strong industrial and automotive focus.
The S29AL008J belongs to Infineon's legacy Cypress Flash memory portfolio, designed specifically for reliable, in-system programmable boot code storage in safety-critical automotive and industrial control systems.
FAQ
Is S29AL008J55TFNR10 pin-compatible with earlier S29AL008D devices?
Yes - the S29AL008J55TFNR10 is fully pin- and command-compatible with the 200 nm S29AL008D, as confirmed in the datasheet's "Manufactured on 110 nm Process Technology" section. Both share identical 48-ball BGA and 48-pin TSOP footprints, same pin functions, and JEDEC-standard command set, enabling drop-in replacement without PCB redesign.
Does S29AL008J55TFNR10 support both top-boot and bottom-boot configurations?
Yes - the device supports configurable boot block orientation via factory programming or on-board command sequence. The WP# pin protects either the first (bottom boot) or last (top boot) 16 KB sector depending on configuration, allowing flexibility for legacy BIOS or custom bootloader implementations.
What is the role of the BYTE# pin, and how does it affect data bus width?
The BYTE# pin selects between x8 (DQ7–DQ0 only) and x16 (DQ15–DQ0) data interfaces. When BYTE# = VIL, the device operates in byte mode; when BYTE# = VIH, it operates in word mode. DQ15/A-1 serves as data bit 15 in word mode or address bit A-1 (LSB) in byte mode - enabling shared pin functionality without external multiplexing.
How does the Secured Silicon Sector differ from standard Flash sectors?
The Secured Silicon Sector is a dedicated 128-word (256-byte) region with factory- or customer-programmable 8-word (16-byte) electronic serial number. Once locked, it cannot be erased or rewritten - providing permanent, tamper-resistant device identification essential for firmware authentication and anti-cloning in automotive and medical systems.
S29AL008J55TFNR10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- AL-J
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 8Mbit
- Memory Organization:
- 1M x 8, 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 55ns
- Access Time:
- 55 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP
S29AL008J55TFNR10 FAQ
1.How can I place an order for S29AL008J55TFNR10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29AL008J55TFNR10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29AL008J55TFNR10 reliable?
The price and inventory of S29AL008J55TFNR10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29AL008J55TFNR10 is usually 5 days.
3.What payment methods are accepted for S29AL008J55TFNR10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29AL008J55TFNR10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29AL008J55TFNR10?
S29AL008J55TFNR10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29AL008J55TFNR10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29AL008J55TFNR10?
For technical support, including S29AL008J55TFNR10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29AL008J55TFNR10 requirements.
6.How does Aetrix verify that S29AL008J55TFNR10 is sourced from the original manufacturer or authorized distributors?
All S29AL008J55TFNR10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29AL008J55TFNR10 meets industry standards.
7.What is the process for return or replacement of S29AL008J55TFNR10?
All S29AL008J55TFNR10 units undergo pre-shipment inspection (PSI). If there is an issue with S29AL008J55TFNR10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29AL008J55TFNR10 part is unused and in its original packaging.
Return procedure for S29AL008J55TFNR10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29AL008J55TFNR10 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
