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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29AL008J70BFM023

Name: S29AL008J70BFM023
Brand: Infineon Technologies
SKU: S29AL008J70BFM023
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29AL008J70BFM023

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 48-VFBGA

Datasheet:: S29AL008J70BFM023.pdf

Description:: IC FLASH 8MBIT PARALLEL 48FBGA

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Product details

Overview

S29AL008J70BFM023 from Infineon Technologies (formerly Cypress) is an 8 Mbit (1 M × 8-bit / 512 K × 16-bit), 3.0 V-only boot sector Flash memory with 55 ns access time, automotive-grade AEC-Q100 Grade 1 support (–40 °C to +125 °C), and flexible sector architecture including one 16 KB, two 8 KB, one 32 KB, and fifteen 64 KB sectors. It operates across 2.7–3.6 V, supports in-system programming without high-voltage VPP, and integrates Secured Silicon Sector with 128-word electronic serial number for secure device identification in automotive firmware storage.

For engineers reviewing the S29AL008J70BFM023 datasheet, S29AL008J70BFM023 pinout, S29AL008J70BFM023 application, or S29AL008J70BFM023 equivalent, key selection criteria include boot-block configuration (top/bottom), CFI compliance for host auto-reconfiguration, Erase Suspend/Resume capability for real-time firmware updates, and hardware write protection via WP# tied to boot-sector lock.

Technical Context

The S29AL008J70BFM023 implements a JEDEC-compliant single-power-supply Flash command set with embedded algorithms for automatic program pulse timing and erase margin verification. Its internal state machine latches addresses and data during write cycles and supports both byte (x8) and word (x16) configurations via BYTE# pin control.

Hardware features include RY/BY# for cycle completion detection, RESET# for immediate operation termination and array read recovery, and WP# that protects the first or last 16 KB sector depending on boot configuration. The device uses Fowler-Nordheim tunneling for erase and hot electron injection for programming, with full sector erase architecture enabling independent reprogramming without affecting adjacent sectors.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	8 Mbit (1,048,576 × 8-bit or 524,288 × 16-bit)
Access Time (tACC)	55 ns - enables zero-wait-state operation with high-speed microcontrollers
Supply Voltage Range	2.7 V to 3.6 V - supports battery-powered and automotive systems with wide input tolerance
Operating Temperature	–40 °C to +125 °C - qualified per AEC-Q100 Grade 1 for under-hood automotive use
Erase/Program Endurance	1,000,000 cycles per sector - ensures long-term field reliability in firmware update applications
Data Retention	20 years typical - guarantees nonvolatile storage integrity over vehicle lifetime
Power Consumption (Read)	7 mA typical at 5 MHz - minimizes active power draw in always-on ECUs
Standby/Automatic Sleep Current	0.2 µA - enables ultra-low-power firmware storage in sleep-mode vehicle networks

Pinout & Package

Package: 48-ball Fine-pitch BGA (VBK048), 0.8 mm pitch, 8.15 mm × 6.15 mm × 1.00 mm body.

Pin/Terminal	Circuit Role	Design Meaning
A0–A18	Address Inputs	19-bit address bus supporting full 1 Mbyte addressing in byte mode or 512 Kword in word mode
DQ0–DQ14	Data I/O (x16)	15-bit bidirectional data bus; DQ15/A-1 serves as LSB address in byte mode
DQ15/A-1	Data I/O or Address LSB	Configurable pin: DQ15 in x16 mode; A-1 (address bit 0) in x8 mode for byte alignment
BYTE#	Bus Width Select	Active-low input determining x8 (BYTE# = L) or x16 (BYTE# = H) data interface
CE#, OE#, WE#	Chip/Output/Write Enable	Independent controls eliminate bus contention and enable precise timing of read/write operations
WP#	Hardware Write Protect	Locks boot sector (first or last 16 KB) when pulled low; internal pull-up ensures safe default state
RY/BY#	Ready/Busy Output	Open-drain signal indicating active program/erase cycle; used for hardware flow control
RESET#	Hardware Reset	Asynchronous reset that terminates all operations and returns device to read mode instantly

Key Features

Feature	Design Value
CFI Compliance	Enables host software to auto-detect device geometry and command set without hardcoded parameters
Erase Suspend/Resume	Allows interruption of erase to service real-time read/program requests in other sectors - critical for OTA firmware patching
Unlock Bypass Mode	Reduces multi-byte programming time by halving required write cycles (2 vs. 4) while maintaining command-set compatibility
Secured Silicon Sector	128-word factory- or customer-programmable region with 8-word ESN for tamper-resistant device identity binding
Top/Bottom Boot Configuration	Hardware-selectable boot block location ensures compatibility with legacy bootloader memory maps across platforms

Applications

Automotive Engine Control Unit (ECU)

Advanced Driver Assistance Systems (ADAS)

Use Scenario: Storing calibrated engine maps, diagnostic routines, and fail-safe boot code in under-hood environments.

IC Role / Device Role / Timing Role: Nonvolatile firmware storage with AEC-Q100 Grade 1 qualification and 125 °C operation.

Use Value: Ensures deterministic boot execution and field-upgradable calibration data retention over 20 years despite thermal cycling.

Use Scenario: Hosting sensor fusion firmware and safety-critical boot images in radar or camera control modules.

IC Role / Device Role / Timing Role: Secure, high-reliability Flash with Secured Silicon Sector for anti-cloning and firmware version binding.

Use Value: Prevents unauthorized firmware modification via hardware-locked identity region and sector-level erase isolation.

Industrial PLC Firmware Storage

Medical Diagnostic Equipment Boot Memory

Use Scenario: Retaining ladder logic programs and configuration data across power cycles in factory automation controllers.

IC Role / Device Role / Timing Role: Boot-sector Flash with WP#-enabled hardware protection against accidental overwrite during runtime.

Use Value: Eliminates need for external supervision circuitry by providing in-device sector locking and automatic sleep mode (0.2 µA).

Use Scenario: Storing FDA-certified boot firmware and calibration constants in portable ultrasound or imaging devices.

IC Role / Device Role / Timing Role: Low-power, high-integrity Flash with 55 ns access for fast system initialization and CFI-assisted field upgrades.

Use Value: Meets IEC 62304 software lifecycle requirements through verified 1M-cycle endurance and 20-year data retention.

Equivalent & Alternatives

The following parts are listed as comparable options for similar boot-sector Flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29AL008J70TFM020	Same die, TSOP-48 package (18.4 mm × 12.0 mm); no BGA mechanical footprint	Preferred for through-hole or wave-soldered industrial boards where BGA rework is impractical	Select when board assembly process lacks fine-pitch BGA capability or requires manual inspection access
MX29LV008CTTI-70G	8 Mbit, 3 V, 70 ns access; lacks CFI, Erase Suspend, and Secured Silicon Sector	Suitable for cost-sensitive consumer applications without security or real-time interrupt requirements	Choose only if firmware update frequency is low and host system does not require auto-reconfiguration or secure ID binding

Compared with S29AL008J70TFM020 and MX29LV008CTTI-70G, the S29AL008J70BFM023 uniquely delivers BGA space savings, CFI-driven software portability, and hardware-enforced firmware security - making it optimal for next-generation automotive and medical edge devices requiring compact, upgradable, and certified memory.

Availability

S29AL008J70BFM023 is available at Aetrix Electronics and suitable for automotive ECU firmware storage, ADAS sensor module boot memory, and industrial PLC configuration retention requiring stable component supply across extended product lifecycles.

Supply support for S29AL008J70BFM023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and secure memory solutions with ISO/TS 16949 and IATF 16949 certified manufacturing.

The S29AL008J belongs to Infineon's automotive-qualified parallel NOR Flash portfolio, engineered specifically for mission-critical firmware storage in engine control, braking, and driver assistance systems where data integrity, security, and temperature resilience are non-negotiable.

FAQ

Is S29AL008J70BFM023 pin-compatible with earlier S29AL008D variants?

Yes - the S29AL008J70BFM023 maintains identical pinout and command-set compatibility with the S29AL008D family, including TSOP-48 and VBK048 BGA packages. It is manufactured on 110 nm process but retains full functional and timing equivalence, allowing drop-in replacement without PCB or firmware changes.

What boot configuration does S29AL008J70BFM023 support?

The S29AL008J70BFM023 supports both top-boot and bottom-boot configurations via hardware strapping: bottom boot is selected when A-1 (DQ15) is driven low during power-up; top boot when A-1 is high. This flexibility matches legacy bootloader memory maps across multiple ECU platforms.

How is the Secured Silicon Sector programmed and locked?

The Secured Silicon Sector is programmed using the standard Word Program Command Sequence and locked via the Sector Protection Command. Locking can occur at the factory (permanent) or by the customer in-system. Once locked, the 128-word region becomes read-only and immune to erase or program commands, preserving its 8-word electronic serial number.

Does S29AL008J70BFM023 support simultaneous read-while-erase operations?

No - it supports Erase Suspend/Erase Resume, which pauses an ongoing sector erase to allow reads or writes in *other* unselected sectors, then resumes the original erase. True concurrent read-while-erase is not supported; the suspended erase must be explicitly resumed to complete.

S29AL008J70BFM023 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: AL-J

Package/Case:: 48-VFBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 8Mbit

Memory Organization:: 1M x 8, 512K x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 70ns

Access Time:: 70 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 125°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 48-FBGA (8.15x6.15)

S29AL008J70BFM023 FAQ

1.How can I place an order for S29AL008J70BFM023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29AL008J70BFM023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29AL008J70BFM023 reliable?

The price and inventory of S29AL008J70BFM023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29AL008J70BFM023 is usually 5 days.

3.What payment methods are accepted for S29AL008J70BFM023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29AL008J70BFM023 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29AL008J70BFM023?

S29AL008J70BFM023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29AL008J70BFM023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29AL008J70BFM023?

For technical support, including S29AL008J70BFM023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29AL008J70BFM023 requirements.

6.How does Aetrix verify that S29AL008J70BFM023 is sourced from the original manufacturer or authorized distributors?

All S29AL008J70BFM023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29AL008J70BFM023 meets industry standards.

7.What is the process for return or replacement of S29AL008J70BFM023?

All S29AL008J70BFM023 units undergo pre-shipment inspection (PSI). If there is an issue with S29AL008J70BFM023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29AL008J70BFM023 part is unused and in its original packaging.

Return procedure for S29AL008J70BFM023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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