My Inquiry
My Account
Infineon Technologies S29AL008J70TFI023
- Part No.:
- S29AL008J70TFI023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29AL008J70TFI023.pdf
- Description:
- IC FLASH 8MBIT PARALLEL 48TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,468
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29AL008J70TFI023 from Infineon Technologies (formerly Cypress) is an 8 Mbit (1M × 8-bit / 512K × 16-bit), 3.0 V-only boot sector Flash memory with 55 ns access time, AEC-Q100 Grade 1 (–40°C to +125°C) qualification, and flexible sector architecture including one 16 KB, two 8 KB, one 32 KB, and fifteen 64 KB sectors. It supports in-system programming via standard 3.0 V VCC-no 5 V or 12 V required-and integrates hardware write protection, erase suspend/resume, and CFI compliance for automotive and industrial firmware storage.
For engineers reviewing the S29AL008J70TFI023 datasheet, S29AL008J70TFI023 pinout, S29AL008J70TFI023 application, or S29AL008J70TFI023 equivalent, key selection criteria include boot-block configuration (top/bottom), sector lock/unlock behavior, RY/BY# and RESET# timing compatibility, and TSOP-48 vs. VFBGA-48 package integration constraints.
Technical Context
The S29AL008J70TFI023 implements a command-register-driven state machine for embedded program/erase algorithms, using Fowler-Nordheim tunneling for erase and hot electron injection for programming. It features dual-mode data bus (x8/x16) via DQ0–DQ7 (byte) or DQ0–DQ15 (word), with DQ15/A-1 serving as LSB address input in byte mode.
Hardware protection includes VCC detector–enabled write inhibition during power transitions, WP#-controlled boot-sector lock, and sector group protection with temporary unprotect capability. Erase suspend allows concurrent read/program in non-erasing sectors, enabling true background operations in real-time firmware updates.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 8 Mbit (1,048,576 × 8 or 524,288 × 16) |
| Access Time (tACC) | 55 ns - enables zero-wait-state operation with high-speed microcontrollers |
| Supply Voltage Range | 2.7 V to 3.6 V - supports battery-powered and wide-input industrial rails |
| Operating Temperature | –40°C to +125°C (AEC-Q100 Grade 1) - qualified for under-hood automotive use |
| Erase/Program Endurance | 1,000,000 cycles per sector - ensures long-term field reliability in frequent update scenarios |
| Data Retention | 20 years typical - meets automotive ECU and industrial controller lifetime requirements |
| Power Consumption (Read) | 7 mA typical at 5 MHz - reduces thermal load in dense PCB layouts |
| Package | 48-ball Fine-pitch BGA (VBK048, 8.15 mm × 6.15 mm × 1.00 mm) - surface-mount compatible with automated assembly |
Pinout & Package
Package: 48-ball Fine-pitch BGA (VBK048), 0.8 mm pitch, 8.15 mm × 6.15 mm footprint, 1.00 mm height.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus supporting full 1M-byte or 512K-word addressing |
| DQ0–DQ14 | Data I/O (x16 mode) | 15-bit bidirectional data path; DQ15/A-1 serves as DQ15 (x16) or A-1 (x8 LSB) |
| BYTE# | Bus Width Select | Active-low input selecting 8-bit (BYTE# = L) or 16-bit (BYTE# = H) data interface |
| CE#, OE#, WE# | Chip/Output/Write Enable | Independent controls eliminate bus contention; support standard microprocessor timing |
| WP# | Hardware Write Protect | Locks boot sector (16 KB) when pulled low; internal pull-up enables VIH default |
| RY/BY# | Ready/Busy Output | Open-drain active-low signal indicating active program/erase cycle completion |
| RESET# | Hardware Reset | Asynchronous reset of internal state machine to read mode; ties to system reset rail |
| VCC, VSS | Power Supply | Single 3.0 V supply only; internally generates all high-voltage programming/erase voltages |
Key Features
| Feature | Design Value |
|---|---|
| CFI Compliance | Enables automatic host software reconfiguration across different Flash devices without firmware changes |
| Erase Suspend/Resume | Allows interruption of erase to service real-time read/write requests in other sectors |
| Unlock Bypass Mode | Reduces multi-byte programming time by cutting command sequence from 4 to 2 write cycles |
| Secured Silicon Sector | 128-word factory-programmable region with 8-word electronic serial number for secure device ID |
| Flexible Boot Sector | Configurable top or bottom 16 KB block for bootloader storage with independent hardware lock |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated engine maps and diagnostic routines subject to over-the-air updates. IC Role / Device Role / Timing Role: Nonvolatile boot code and parameter storage with AEC-Q100 Grade 1 temperature resilience. Use Value: Hardware sector protection prevents accidental overwrite of critical bootloader during field updates. | Use Scenario: Holding ladder logic firmware and I/O configuration data in programmable logic controllers. IC Role / Device Role / Timing Role: In-system reprogrammable Flash with 55 ns access for deterministic scan-cycle execution. Use Value: Erase suspend enables background firmware validation while maintaining real-time I/O control. |
| Medical Diagnostic Imaging Bootloader | Railway Signaling System Configuration |
Use Scenario: Secure boot image storage for MRI/CT scanner mainboards requiring regulatory traceability. IC Role / Device Role / Timing Role: Secured Silicon Sector provides tamper-evident 128-word ID space for calibration certificate embedding. Use Value: Factory-lockable silicon sector ensures immutable device identity across production batches. | Use Scenario: Storing fail-safe interlocking logic and safety-critical configuration tables in ERTMS-compliant signaling hardware. IC Role / Device Role / Timing Role: High-reliability Flash with 1M-cycle endurance and 20-year data retention for SIL-4 systems. Use Value: Dual VCC detector and hardware RESET# guarantee safe recovery after brownout events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar boot sector Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29AL008J70TFI020 | Same die, TSOP-48 package (18.4 mm × 12.0 mm); no BGA mechanical footprint | Preferred for through-hole prototyping or legacy board redesigns with TSOP sockets | Select when board layout lacks BGA reflow capability or requires manual rework access |
| MX29LV008CTTI-70G | 8 Mbit, 3 V, 70 ns access; lacks CFI, erase suspend, and secured silicon sector | Suitable for cost-sensitive consumer electronics where advanced features are unused | Choose only if bootloader size fits single sector and no field update security is required |
Compared with S29AL008J70TFI020, the BGA variant offers higher board density and thermal performance; versus MX29LV008CTTI-70G, it delivers certified automotive reliability, secure identification, and background erase-critical for safety-critical firmware.
Availability
S29AL008J70TFI023 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware deployment, and medical imaging system boot storage requiring stable component supply across extended product lifecycles.
Supply support for S29AL008J70TFI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and memory solutions with ISO/TS 16949-certified manufacturing.
The S29AL008J belongs to Infineon's automotive-qualified parallel NOR Flash product line, engineered specifically for mission-critical firmware storage in harsh-environment applications demanding AEC-Q100 compliance and long-term data integrity.
FAQ
Is S29AL008J70TFI023 pin-compatible with earlier S29AL008D variants?
Yes-S29AL008J70TFI023 maintains identical pinout and command-set compatibility with the S29AL008D family. The J-series uses 110 nm process technology but retains full electrical and mechanical equivalence in both TSOP-48 and VBK048 packages, enabling drop-in replacement without layout or firmware changes.
What boot configuration does S29AL008J70TFI023 support?
S29AL008J70TFI023 supports both top-boot and bottom-boot configurations via hardware strapping or command sequence. The boot sector location (first or last 16 KB) is determined by the BYTE# and WP# pin states at power-up, allowing flexible bootloader placement without mask ROM dependency.
Does this device require external high-voltage circuitry for programming?
No-S29AL008J70TFI023 operates exclusively from a single 3.0 V supply (2.7–3.6 V). All internal high-voltage generation for programming and erasing is handled on-chip via integrated charge pumps; no external VPP or 5 V sources are needed, simplifying power design and reducing BOM count.
How is the Secured Silicon Sector programmed and locked?
The Secured Silicon Sector (128 words) is programmed using the standard command sequence (unlock bypass + program), then permanently locked via the "Sector Protect" command. Once locked, it cannot be unlocked or rewritten-even with power cycling-ensuring permanent device identification and calibration data integrity.
S29AL008J70TFI023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- AL-J
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 8Mbit
- Memory Organization:
- 1M x 8, 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 70ns
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP
S29AL008J70TFI023 FAQ
1.How can I place an order for S29AL008J70TFI023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29AL008J70TFI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29AL008J70TFI023 reliable?
The price and inventory of S29AL008J70TFI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29AL008J70TFI023 is usually 5 days.
3.What payment methods are accepted for S29AL008J70TFI023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29AL008J70TFI023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29AL008J70TFI023?
S29AL008J70TFI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29AL008J70TFI023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29AL008J70TFI023?
For technical support, including S29AL008J70TFI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29AL008J70TFI023 requirements.
6.How does Aetrix verify that S29AL008J70TFI023 is sourced from the original manufacturer or authorized distributors?
All S29AL008J70TFI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29AL008J70TFI023 meets industry standards.
7.What is the process for return or replacement of S29AL008J70TFI023?
All S29AL008J70TFI023 units undergo pre-shipment inspection (PSI). If there is an issue with S29AL008J70TFI023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29AL008J70TFI023 part is unused and in its original packaging.
Return procedure for S29AL008J70TFI023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29AL008J70TFI023 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
