Infineon Technologies S29AL008J70TFN020
- Part No.:
- S29AL008J70TFN020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29AL008J70TFN020.pdf
- Description:
- IC FLASH 8MBIT PARALLEL 48TSOP
- Quantity:
- Payment:

- Shipping:

Inventory:511
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29AL008J70TFN020 from Infineon Technologies (formerly Cypress) is an 8-Mbit (1M × 8-bit / 512K × 16-bit), 3.0 V-only boot sector Flash memory with 55 ns access time, 48-ball fine-pitch BGA (0.8 mm pitch) package, and AEC-Q100 Grade 1 qualification (–40°C to +125°C). It supports in-system programming via standard 3.0 V VCC - no 5 V or 12 V required - and features hardware sector protection, erase suspend/resume, and CFI compliance for automotive and industrial firmware storage.
For engineers reviewing the S29AL008J70TFN020 datasheet, S29AL008J70TFN020 pinout, S29AL008J70TFN020 application, or S29AL008J70TFN020 equivalent, key selection criteria include boot-block configuration (top/bottom), sector architecture flexibility (1×16 KB + 2×8 KB + 1×32 KB + 15×64 KB), Secured Silicon Sector (128-word ESN), RY/BY# and RESET# hardware signaling, and JEDEC software compatibility.
Technical Context
The S29AL008J70TFN020 implements a command-register-driven state machine for embedded program/erase algorithms, eliminating external timing control. It uses Fowler-Nordheim tunneling for erase and hot electron injection for programming, with automatic pulse width control and margin verification.
Its dual-mode interface (x8/x16) is selected via BYTE# pin, and sector group protection is enforced through dedicated WP# and hardware lock bits. The device supports autoselect mode for identification and CFI query mode for host software reconfiguration across Flash families.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 8 Mbit (1,048,576 × 8-bit or 524,288 × 16-bit) |
| Access Time (tACC) | 55 ns - enables zero-wait-state operation with high-speed microcontrollers |
| Supply Voltage Range | 2.7 V to 3.6 V - supports battery-powered and wide-input industrial rails |
| Operating Temperature | –40°C to +125°C (AEC-Q100 Grade 1) - qualified for under-hood automotive use |
| Erase/Program Endurance | 1,000,000 cycles per sector - ensures long-term field firmware update reliability |
| Data Retention | 20 years typical - meets automotive and industrial lifecycle requirements |
| Power Consumption (Read) | 7 mA typical at 5 MHz - minimizes active power in always-on control modules |
| Package | 48-ball VFBGA (8.15 mm × 6.15 mm × 1.00 mm, 0.8 mm pitch) - compact footprint for space-constrained ECUs |
Pinout & Package
Package: 48-ball Fine-pitch BGA (VBK048, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level (MSL) 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus supporting full 1M-byte or 512K-word addressing |
| DQ0–DQ15 | Data I/O (x16) / DQ0–DQ7 (x8) | Configurable byte/word data interface; DQ15/A-1 serves as LSB address in byte mode |
| BYTE# | Bus Width Select | Active-low input determining x8 (BYTE# = L) or x16 (BYTE# = H) operation |
| CE#, OE#, WE# | Chip/Output/Write Enable | Independent controls eliminate bus contention; support standard microprocessor timing |
| WP# | Hardware Write Protect | Protects boot sector (16 KB top or bottom) when pulled low; internal pull-up ensures safe default |
| RY/BY# | Ready/Busy Output | Open-drain status signal indicating active program/erase cycle completion |
| RESET# | Hardware Reset | Asynchronous reset to read mode; ties directly to system reset for boot recovery |
| VCC, VSS | Power Supply | Single 3.0 V supply only; internally generates all high-voltage programming/erase voltages |
Key Features
| Feature | Design Value |
|---|---|
| Boot Sector Architecture | Flexible top/bottom 16 KB boot block with independent hardware write protection (WP#) for secure bootloader storage |
| Secured Silicon Sector | 128-word (256-byte) factory- or customer-programmable region with 8-word electronic serial number for device authentication |
| Erase Suspend/Resume | Allows background erase interruption to service real-time reads/writes in non-erasing sectors - critical for deterministic firmware updates |
| Unlock Bypass Mode | Reduces multi-word programming time by halving required write cycles (2 vs. 4), accelerating field firmware patching |
| CFI Compliance | Enables host software to auto-detect geometry, timing, and command set - simplifies Flash abstraction layer in BSPs |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated engine maps and diagnostic routines in under-hood ECU modules exposed to thermal cycling and vibration. IC Role / Device Role / Timing Role: Nonvolatile boot code and runtime firmware storage with AEC-Q100 Grade 1 qualification and hardware sector locking. Use Value: Ensures bootloader integrity via WP#-protected boot sector and enables safe over-the-air updates using erase suspend to maintain real-time control during flash reprogramming. | Use Scenario: Holding ladder logic firmware and configuration data in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: High-reliability, long-retention Flash memory with 1M-cycle endurance for frequent firmware revisions and parameter backups. Use Value: Secured Silicon Sector provides unique device ID for license enforcement; CFI support simplifies firmware loader portability across PLC generations. |
| Medical Infusion Pump Controller | Railway Signaling System |
Use Scenario: Storing safety-critical dosing algorithms and calibration tables in battery-backed portable infusion pumps requiring fail-safe firmware recovery. IC Role / Device Role / Timing Role: Boot-sector Flash with hardware RESET# and RY/BY# signaling for deterministic startup and fault recovery. Use Value: Automatic Sleep mode reduces standby current to 0.2 µA, extending battery life; 20-year data retention meets medical device regulatory archiving requirements. | Use Scenario: Hosting fail-safe interlocking logic and communication protocol stacks in EN 5012x-certified railway signaling hardware deployed outdoors. IC Role / Device Role / Timing Role: Industrial-grade Flash with –40°C to +125°C operation and sector-level erase for modular firmware updates without system downtime. Use Value: Flexible sector architecture (15×64 KB + configurable boot blocks) allows independent update of communication stack vs. safety logic - minimizing validation scope per release. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar boot-sector Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29AL008J70TFI020 | Same die, TSOP-48 package (18.4 mm × 12.0 mm); lacks BGA thermal/mechanical robustness | Better suited for prototyping or legacy PCBs with through-hole or gull-wing layout constraints | Select when board assembly uses standard reflow-compatible TSOP rather than BGA placement capability |
| MX29LV008CTTI-70G | 8 Mbit, 3 V, 70 ns access; no Secured Silicon Sector; no CFI; different command set | Limited to basic firmware storage where device authentication and software auto-configuration are not required | Choose only if cost sensitivity outweighs need for ESN, CFI, and erase suspend functionality |
Compared with S29AL008J70TFN020, the TSOP variant trades BGA density and thermal performance for assembly simplicity, while the MX29LV008CTTI-70G omits security and advanced management features - making it unsuitable for AEC-Q100 or safety-critical designs requiring verified identity and deterministic update behavior.
Availability
S29AL008J70TFN020 is available at Aetrix Electronics and suitable for automotive ECU design, industrial PLC firmware upgrades, and medical device bootloader storage requiring stable component supply across extended product lifecycles.
Supply support for S29AL008J70TFN020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and memory solutions with strong industrial and automotive focus.
The S29AL008J belongs to Infineon's legacy Cypress Flash memory portfolio, designed specifically for reliable, secure, and high-endurance firmware storage in safety-critical automotive and industrial control systems.
FAQ
Is S29AL008J70TFN020 pin-compatible with earlier S29AL008D devices?
Yes - the S29AL008J70TFN020 maintains identical pinout and software command compatibility with the S29AL008D family, including TSOP-48 and BGA-48 variants. It is manufactured on 110 nm process but retains full functional and mechanical equivalence, enabling drop-in replacement in existing designs without layout or firmware changes.
What is the function of the BYTE# pin, and how does it affect data bus width?
The BYTE# pin selects between 8-bit (x8) and 16-bit (x16) data bus operation: when LOW, DQ0–DQ7 are active for byte mode; when HIGH, DQ0–DQ15 operate in word mode. In byte mode, DQ15 functions as A-1 (LSB address), enabling seamless integration with 8-bit microcontrollers without external demultiplexing.
How does the Secured Silicon Sector support device authentication in production?
The Secured Silicon Sector contains a factory-programmed or customer-programmable 8-word (16-byte) electronic serial number, accessible only via a protected command sequence. Once locked, it cannot be altered, providing immutable device identity for secure boot verification, license binding, or anti-counterfeiting in certified production lines.
Can S29AL008J70TFN020 be used in systems without a dedicated RY/BY# interrupt line?
Yes - while RY/BY# provides hardware-ready signaling, the device fully supports software polling via DQ7 (Data# Polling) and DQ6/DQ2 (toggle bits) to detect program/erase completion. This enables use in resource-constrained systems where GPIO pins are limited, though hardware polling adds latency versus interrupt-driven operation.
S29AL008J70TFN020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- AL-J
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 8Mbit
- Memory Organization:
- 1M x 8, 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 70ns
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP
S29AL008J70TFN020 FAQ
1.How can I place an order for S29AL008J70TFN020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29AL008J70TFN020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29AL008J70TFN020 reliable?
The price and inventory of S29AL008J70TFN020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29AL008J70TFN020 is usually 5 days.
3.What payment methods are accepted for S29AL008J70TFN020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29AL008J70TFN020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29AL008J70TFN020?
S29AL008J70TFN020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29AL008J70TFN020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29AL008J70TFN020?
For technical support, including S29AL008J70TFN020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29AL008J70TFN020 requirements.
6.How does Aetrix verify that S29AL008J70TFN020 is sourced from the original manufacturer or authorized distributors?
All S29AL008J70TFN020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29AL008J70TFN020 meets industry standards.
7.What is the process for return or replacement of S29AL008J70TFN020?
All S29AL008J70TFN020 units undergo pre-shipment inspection (PSI). If there is an issue with S29AL008J70TFN020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29AL008J70TFN020 part is unused and in its original packaging.
Return procedure for S29AL008J70TFN020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29AL008J70TFN020 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

