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Infineon Technologies S29AL016J70BFN023

Part No.:
S29AL016J70BFN023
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
48-VFBGA
Datasheet:
AetrixS29AL016J70BFN023.pdf
Description:
IC FLASH 16MBIT PARALLEL 48FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,339

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Product details

Overview

S29AL016J70BFN023 from Infineon Technologies (formerly Cypress) is a 16 Mbit (2M × 8-bit / 1M × 16-bit), 3.0 V-only boot sector Flash memory with 55 ns access time, AEC-Q100 Grade 1 (–40°C to +125°C) qualification, and flexible sector architecture including one 16 KB, two 8 KB, one 32 KB, and thirty-one 64 KB sectors. It supports in-system programming via standard 3.0 V VCC-no 12 V VPP required-and integrates hardware reset (RESET#), ready/busy (RY/BY#), and write-protect (WP#) pins for embedded boot code storage in automotive engine control units.

For engineers reviewing the S29AL016J70BFN023 datasheet, S29AL016J70BFN023 pinout, S29AL016J70BFN023 application, or S29AL016J70BFN023 equivalent, key selection criteria include boot-block configuration (top/bottom), sector protection granularity, CFI compliance for host auto-detection, erase suspend/resume capability, and compatibility with JEDEC single-power-supply Flash command sets.

Technical Context

The S29AL016J70BFN023 implements a command-register-driven state machine for Embedded Erase and Embedded Program algorithms, automatically timing pulse widths and verifying cell margin without host intervention. It supports both byte (x8) and word (x16) data interfaces via DQ7–DQ0 or DQ15–DQ0 respectively, with BYTE# pin selecting mode.

Hardware protection includes a low-VCC detector inhibiting writes during power transitions, sector group lock/unlock via WP# and command sequences, and temporary unprotect for in-field firmware updates. Erase suspend allows background read/program operations in non-erasing sectors while erase continues.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 16 Mbit (2,097,152 × 8 or 1,048,576 × 16)
Access Time (tACC) 55 ns - enables zero-wait-state operation with high-speed microcontrollers
Supply Voltage 2.7 V to 3.6 V - supports battery-powered and automotive 3.3 V rail systems
Cycling Endurance 1,000,000 cycles per sector - ensures long-term field reliability for firmware update partitions
Data Retention 20 years typical - meets automotive ECU lifetime requirements without refresh
Operating Temperature –40°C to +125°C (AEC-Q100 Grade 1) - qualified for under-hood engine control applications
Power Consumption 0.2 µA standby - enables ultra-low-power sleep modes in always-on vehicle modules

Pinout & Package

Package: 48-ball Fine-pitch BGA (VBK048), 0.8 mm pitch, 8.15 mm × 6.15 mm footprint.

Pin/Terminal Circuit Role Design Meaning
A0–A19 Address Inputs 20-bit address bus supporting full 2M-byte or 1M-word addressing
DQ0–DQ15 Data I/O (x16) / DQ0–DQ7 (x8) Bidirectional data bus; BYTE# selects x8/x16 mode; DQ15 doubles as A−1 for x8 mode
CE#, OE#, WE# Chip, Output, Write Enable Controls Independent enables eliminate bus contention; support standard microprocessor timing
RY/BY# Ready/Busy Output Active-low open-drain signal indicating active program/erase cycle completion
RESET# Hardware Reset Input Asynchronous reset to read mode; ties directly to system reset for boot recovery
WP# Write Protect Input Hardware lock for boot sector (16 KB); polarity and function depend on top/bottom configuration
BYTE# Data Bus Width Select High = x16 mode (DQ15–DQ0); Low = x8 mode (DQ7–DQ0); determines A−1 usage

Key Features

Feature Design Value
CFI Compliance Enables host software to auto-identify device geometry, sector map, and command set without hard-coded drivers
Erase Suspend/Resume Allows real-time interrupt of erase to service critical reads/writes in other sectors-enabling true background erase
Secured Silicon Sector 128-word factory-programmable serial number region, locked permanently for secure device identification
Unlock Bypass Mode Reduces multi-word programming time by 50% (2-cycle vs. 4-cycle command sequence)
Flexible Boot Configuration Top-boot or bottom-boot selectable at system level-supports dual-firmware fail-safe boot strategies

Applications

Engine Control Unit (ECU) Advanced Driver Assistance System (ADAS) Camera Module

Use Scenario: Storing calibrated engine maps, diagnostic routines, and over-the-air (OTA) update partitions in automotive powertrain ECUs.

IC Role / Device Role / Timing Role: Non-volatile boot code and parameter storage with AEC-Q100 Grade 1 temperature resilience and hardware write protection.

Use Value: Sector-level erase enables safe OTA updates without corrupting active calibration data; WP# pin prevents accidental overwrite during voltage transients.

Use Scenario: Holding camera firmware, lens correction tables, and sensor initialization sequences in compact ADAS vision modules.

IC Role / Device Role / Timing Role: High-reliability, low-latency Flash for boot and runtime code execution in space-constrained, thermally demanding environments.

Use Value: 55 ns access time eliminates wait states for ARM Cortex-R5 processors; 48-ball BGA minimizes PCB area versus TSOP alternatives.

Industrial PLC Firmware Storage Medical Imaging Device Boot Memory

Use Scenario: Retaining ladder logic programs, I/O configuration, and safety-critical firmware in programmable logic controllers operating in factory-floor environments.

IC Role / Device Role / Timing Role: Industrial-grade (–40°C to +85°C) Flash with sector protection for deterministic firmware integrity across power cycles.

Use Value: Temporary sector unprotect allows field technicians to reprogram specific logic blocks without erasing entire memory; CFI simplifies firmware loader portability.

Use Scenario: Securing boot firmware and regulatory-compliant calibration data in FDA-cleared ultrasound and MRI subsystems requiring traceable memory integrity.

IC Role / Device Role / Timing Role: Secure, long-retention Flash with Secured Silicon Sector for device serialization and anti-counterfeiting.

Use Value: Factory-lockable 256-byte serial number region provides immutable hardware identity for audit trails; 20-year data retention satisfies medical device lifecycle mandates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar boot-sector Flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
S29GL016S70TFV10 16 Mbit, 3 V, 70 ns access, 64-ball Fortified BGA only; no TSOP option; higher tACC reduces max CPU clock compatibility Lacks 48-pin TSOP and 48-ball BGA packages; not drop-in replaceable in legacy TSOP footprints Select when board layout accommodates larger 64-ball BGA and system timing budget permits 70 ns latency
MX29LV160EBTI-70G 16 Mbit, 3 V, 70 ns, top-boot only; no Secured Silicon Sector; no CFI support; requires external VPP for some operations Missing hardware security features and auto-detection capability; limited to top-boot configuration Choose only for cost-sensitive, non-secure, top-boot-only designs where CFI and serial ID are unnecessary

Compared with S29AL016J70BFN023, the S29GL016S70TFV10 trades package flexibility and speed for ruggedized BGA packaging, while the MX29LV160EBTI-70G sacrifices security, configurability, and JEDEC compliance to reduce bill-of-materials cost-making the S29AL016J70BFN023 optimal for safety-critical, field-upgradable, and multi-platform designs.

Availability

S29AL016J70BFN023 is available at Aetrix Electronics and suitable for automotive engine control units, ADAS camera modules, and industrial PLC firmware storage requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualified Flash memory.

Supply support for S29AL016J70BFN023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and memory solutions with emphasis on reliability, safety, and automotive-grade qualification.

The S29AL016J belongs to Infineon's legacy Cypress Flash memory product line, designed specifically for robust, in-system programmable boot code storage in safety-critical automotive and industrial control systems.

FAQ

What boot configurations does S29AL016J70BFN023 support?

The S29AL016J70BFN023 supports both top-boot and bottom-boot configurations, determined by hardware strapping or command sequence during initialization. In top-boot mode, the 16 KB boot sector resides at the highest address (0x1F0000–0x1FFFFF); in bottom-boot mode, it occupies the lowest address (0x000000–0x003FFF). This flexibility enables dual-firmware fail-safe architectures and platform reuse across different bootloader implementations.

Does S29AL016J70BFN023 require external high-voltage programming?

No. The S29AL016J70BFN023 performs all program and erase operations using only the standard 3.0 V supply (2.7–3.6 V range). Internally generated and regulated voltages handle Fowler-Nordheim tunneling (erase) and hot electron injection (program), eliminating the need for external 12 V VPP or 5 V programming supplies-simplifying system power design and enabling true in-system reprogramming.

How is sector protection implemented on this device?

Sector protection is implemented via three independent mechanisms: (1) hardware WP# pin locking the boot sector, (2) software command-based permanent lock of any sector group, and (3) temporary unprotect allowing limited reprogramming of locked sectors. Protection status is retained after power loss, and locked sectors reject all write/erase commands until explicitly unlocked via the defined command sequence.

Is the Secured Silicon Sector user-programmable after factory shipment?

Yes-the Secured Silicon Sector (128 words / 256 bytes) can be programmed and locked either at the factory or by the end customer using the documented command sequence. Once locked, the contents-including the 8-word electronic serial number-are permanently read-only and immune to erase or program commands, providing a tamper-resistant hardware identity for device authentication and traceability.

S29AL016J70BFN023 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
AL-J
Package/Case:
48-VFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
16Mbit
Memory Organization:
2M x 8, 1M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
70ns
Access Time:
70 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-FBGA (8.15x6.15)

S29AL016J70BFN023 FAQ

1.How can I place an order for S29AL016J70BFN023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29AL016J70BFN023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29AL016J70BFN023 reliable?

The price and inventory of S29AL016J70BFN023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29AL016J70BFN023 is usually 5 days.

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S29AL016J70BFN023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29AL016J70BFN023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29AL016J70BFN023?

For technical support, including S29AL016J70BFN023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29AL016J70BFN023 requirements.

6.How does Aetrix verify that S29AL016J70BFN023 is sourced from the original manufacturer or authorized distributors?

All S29AL016J70BFN023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29AL016J70BFN023 meets industry standards.

7.What is the process for return or replacement of S29AL016J70BFN023?

All S29AL016J70BFN023 units undergo pre-shipment inspection (PSI). If there is an issue with S29AL016J70BFN023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29AL016J70BFN023 part is unused and in its original packaging.

Return procedure for S29AL016J70BFN023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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