Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29AS008J70BFI043

Name: S29AS008J70BFI043
Brand: Infineon Technologies
SKU: S29AS008J70BFI043
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: S29AS008J70BFI043

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 48-VFBGA

Datasheet:: S29AS008J70BFI043.pdf

Description:: IC FLASH 8MBIT PARALLEL 48FBGA

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:3,405

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

S29AS008J70BFI043 from Infineon Technologies (formerly Cypress) is an 8 Mbit, 1.8 V-only boot sector Flash memory organized as 1M × 8-bit or 512K × 16-bit, featuring top/bottom configurable boot blocks, 70 ns access time, and industrial temperature range (–40°C to +85°C). It supports in-system programming/erasure via standard 1.8 V V_CC, includes Secured Silicon Sector with 256-byte factory-programmable serial number, and is used in embedded firmware storage for microcontroller boot code and configuration data.

For engineers reviewing the S29AS008J70BFI043 datasheet, S29AS008J70BFI043 pinout, S29AS008J70BFI043 application, or S29AS008J70BFI043 equivalent, key selection criteria include boot sector architecture flexibility, JEDEC-compliant command set, hardware write protection (WP#), RY/BY# status signaling, and support for both x8/x16 bus modes in TSOP and FBGA packages.

Technical Context

The S29AS008J70BFI043 implements a sector-erase Flash architecture with eight 8 KB + fifteen 64 KB sectors (byte mode) or eight 4 Kword + fifteen 32 Kword sectors (word mode), enabling selective firmware updates without full chip erase. Its internal state machine executes Embedded Program and Embedded Erase algorithms, automatically managing pulse widths, pre-programming, and margin verification.

Hardware features include dedicated RY/BY# for cycle completion detection, RESET# for immediate operation abort and array read recovery, and WP# for permanent protection of outermost boot sectors independent of software lock status. The device uses Fowler-Nordheim tunneling for erase and hot electron injection for program operations.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	8 Mbit (1,048,576 × 8-bit or 524,288 × 16-bit)
Supply Voltage	1.65–1.95 V single supply - enables direct integration into 1.8 V logic domains without level shifting
Access Time	70 ns max - supports zero-wait-state operation with high-speed microprocessors
Programming Time	6 µs typical per word - accelerated by Unlock Bypass mode reducing command overhead
Endurance	1,000,000 erase/program cycles per sector - ensures long-term field reliability for firmware update routines
Data Retention	20 years typical - maintains boot code integrity across product lifecycle without refresh
Operating Temp	–40°C to +85°C - qualified for industrial-grade embedded control and automotive body electronics

Pinout & Package

Package: 48-ball Fine-Pitch Ball Grid Array (FBGA), 8.15 mm × 6.15 mm, RoHS-compliant.

Pin/Terminal	Circuit Role	Design Meaning
A0–A18	Address Inputs	19-bit address bus supporting full 8 Mbit addressing; A-1 multiplexed on DQ15 in byte mode
DQ0–DQ15 (A-1)	Data I/O / LSB Address	16-bit bidirectional data bus in word mode; DQ15 functions as A-1 (LSB) in byte mode
CE#, OE#, WE#	Chip/Output/Write Enable	Independent control lines eliminate bus contention; enable standard microprocessor timing
RY/BY#	Ready/Busy Output	Active-low open-drain signal indicating active program/erase - enables hardware polling
RESET#	Hardware Reset Input	Asynchronous reset that terminates ongoing operations and restores read mode - ties directly to system reset
WP#	Write Protect Input	Hardware lock for two outermost boot sectors - active regardless of software sector group protection state
BYTE#	Bus Width Select	Configures x8 (BYTE# = LOW) or x16 (BYTE# = HIGH) data interface - determines DQ15 function

Key Features

Feature	Design Value
Secured Silicon Sector	256-byte factory- or customer-programmable region with 16-byte electronic serial number - enables secure device identification and anti-cloning
Erase Suspend/Resume	Allows temporary halt of sector erase to read/program non-erasing sectors - enables true background firmware updates
CFI Compliance	JEDEC-standard Common Flash Interface provides runtime device parameter discovery - simplifies host driver portability across Flash families
Automatic Sleep Mode	Enters 15 µA ultra-low-power state after address stability - reduces standby power in battery-powered edge devices
Hardware Data Protection	Integrated low-V_CC detector inhibits writes during power ramp-up/down - prevents corruption during brown-out conditions

Applications

Industrial PLC Firmware Storage

Automotive Body Control Module (BCM)

Use Scenario: Storing boot loader and application firmware in programmable logic controllers requiring field-upgradable code without external voltage sources.

IC Role / Device Role / Timing Role: Non-volatile boot memory providing x16 interface to ARM Cortex-M7 MCU with 70 ns access for deterministic startup timing.

Use Value: Top/bottom boot sector architecture allows safe dual-image storage; hardware WP# protects primary boot sector during over-the-air updates.

Use Scenario: Holding calibration data and control logic for door module ECUs operating in under-hood environments with wide thermal cycling.

IC Role / Device Role / Timing Role: 1.8 V Flash memory interfacing to CAN-enabled microcontroller via x8 bus, leveraging RY/BY# for interrupt-driven erase completion.

Use Value: –40°C to +85°C rating and 1M-cycle endurance ensure 15-year functional safety compliance; Secured Silicon Sector stores unique VIN-linked identifiers.

Medical Infusion Pump Boot Memory

Smart Energy Meter Firmware

Use Scenario: Hosting certified bootloader and safety-critical motor control firmware in Class II medical devices requiring traceable firmware revisions.

IC Role / Device Role / Timing Role: Boot sector Flash accessed at 70 ns with CE#/OE# isolation - guarantees sub-100 µs response to watchdog-triggered reboot.

Use Value: CFI compliance enables automated firmware validation during production test; 20-year data retention meets FDA 21 CFR Part 11 archival requirements.

Use Scenario: Storing AMI firmware, tariff tables, and cryptographic keys in utility meters deployed in unattended outdoor locations for >10 years.

IC Role / Device Role / Timing Role: Industrial-grade Flash with automatic sleep mode (15 µA) minimizing battery drain during meter wake-up intervals.

Use Value: Hardware RESET# synchronizes firmware recovery with power-on-reset; sector group protection isolates crypto key storage from application updates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar boot sector Flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL032N90TFI020	32 Mbit density, 90 ns access, 3.0 V supply - larger capacity but incompatible voltage domain	Requires level-shifting circuitry in 1.8 V systems; lacks Secured Silicon Sector	Select only when higher density and legacy 3.0 V infrastructure exist; not drop-in compatible
MX29GL032EHTI-90G	32 Mbit, 90 ns, 1.8 V supply, CFI-compliant - same voltage but no boot sector protection or WP# pin	No hardware write protect for boot sectors; relies solely on software locking	Prefer where cost-sensitive designs accept reduced security; verify sector protection robustness in failure modes

Compared with S29AS008J70BFI043, the S29GL032N90TFI020 offers greater density but mandates 3.0 V design changes, while the MX29GL032EHTI-90G matches voltage but removes hardware-level boot sector protection - making S29AS008J70BFI043 uniquely suited for safety-critical 1.8 V boot memory requiring tamper-resistant sector locking.

Availability

S29AS008J70BFI043 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive body control modules, and medical infusion pump boot memory requiring stable component supply, long-term lifecycle support, and guaranteed RoHS-compliant FBGA packaging.

Supply support for S29AS008J70BFI043 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensor solutions, and secure microcontrollers with strong heritage in Flash memory through its acquisition of Cypress Semiconductor.

The S29AS008J belongs to Infineon's AS-series boot sector Flash portfolio, designed specifically for reliable, low-voltage firmware storage in safety-critical embedded systems where hardware-based sector protection and deterministic timing are mandatory.

FAQ

Is S29AS008J70BFI043 pin-compatible with earlier S29AS008J variants?

Yes - the '70BFI043' suffix denotes the 70 ns speed grade in 48-ball FBGA package with industrial temperature range (–40°C to +85°C); all S29AS008J FBGA variants share identical pinout, ball map, and mechanical dimensions per Infineon document 002-00870 Rev. *L, page 53.

Does the Secured Silicon Sector support customer programming in-system?

Yes - the 256-byte Secured Silicon Sector can be programmed and permanently locked either at the factory or by the end customer using the documented command sequence (Section 10.4 of datasheet), with lock status verified via CFI query or read-back of protected region.

What is the function of the BYTE# pin during power-up?

BYTE# must be driven to a valid logic level (HIGH for x16, LOW for x8) prior to V_CC stabilization; floating BYTE# may cause undefined bus width configuration, leading to incorrect DQ15 interpretation and potential data corruption during initialization.

Can Erase Suspend be used during Chip Erase operation?

No - Erase Suspend/Erase Resume is supported only for Sector Erase commands (not Chip Erase), as confirmed in Section 10.9 of the datasheet; attempting suspend during chip erase results in undefined behavior and requires full reset recovery.

S29AS008J70BFI043 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: AS-J

Package/Case:: 48-VFBGA

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 8Mbit

Memory Organization:: 1M x 8, 512K x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 70ns

Access Time:: 70 ns

Voltage - Supply:: 1.65V ~ 1.95V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 48-FBGA (8.15x6.15)

S29AS008J70BFI043 FAQ

1.How can I place an order for S29AS008J70BFI043 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29AS008J70BFI043 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29AS008J70BFI043 reliable?

The price and inventory of S29AS008J70BFI043 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29AS008J70BFI043 is usually 5 days.

3.What payment methods are accepted for S29AS008J70BFI043?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29AS008J70BFI043 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29AS008J70BFI043?

S29AS008J70BFI043 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29AS008J70BFI043 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29AS008J70BFI043?

For technical support, including S29AS008J70BFI043 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29AS008J70BFI043 requirements.

6.How does Aetrix verify that S29AS008J70BFI043 is sourced from the original manufacturer or authorized distributors?

All S29AS008J70BFI043 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29AS008J70BFI043 meets industry standards.

7.What is the process for return or replacement of S29AS008J70BFI043?

All S29AS008J70BFI043 units undergo pre-shipment inspection (PSI). If there is an issue with S29AS008J70BFI043, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29AS008J70BFI043 part is unused and in its original packaging.

Return procedure for S29AS008J70BFI043:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

2026-08-11 LDO Regulator: Dropout Voltage, Noise, PSRR and Power Dissipation

LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…

2026-08-06 Conditional Access Module: CAM, CI/CI+ and DVB Security

Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…

2026-08-03 Electronic Component Obsolescence: EOL Risks, Replacement Options and Last-Time Buy Strategy

Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

2026-07-29 18650 Battery: Voltage, Capacity, Charging and Pack Design

18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…