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Infineon Technologies S29CD016J0MQFM013

Part No.:
S29CD016J0MQFM013
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
80-BQFP
Datasheet:
AetrixS29CD016J0MQFM013.pdf
Description:
IC FLASH 16MBIT PAR 56MHZ 80PQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,821

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Product details

Overview

S29CD016J0MQFM013 from Cypress Semiconductor is a 16 Mbit (512k × 32-bit) 2.6 V single-supply burst-mode Flash memory with dual boot sector architecture, simultaneous read/write operation across two independent banks, and zero-latency interleaved execution. It operates at up to 66 MHz, supports JEDEC-standard command set and Common Flash Interface (CFI), and targets automotive infotainment boot storage where deterministic timing and bank-level concurrency are critical.

For engineers reviewing the S29CD016J0MQFM013 datasheet, S29CD016J0MQFM013 pinout, S29CD016J0MQFM013 application, or S29CD016J0MQFM013 equivalent, key selection criteria include its 2.6 V supply tolerance, 80-pin PQFP package with VersatileI/O™ support (1.65–3.6 V), dual-boot sector protection, and hardware-accelerated erase/program via ACC pin - all validated for extended temperature (–40 °C to +125 °C) automotive use.

Technical Context

This device implements a dual-bank floating-gate Flash architecture fabricated in 110 nm process, enabling true concurrent read from one bank while programming or erasing the other - no arbitration or latency penalty. Its synchronous burst interface supports linear 2-, 4-, and 8-double-word wrap-around modes, with programmable initial clock delay (4 or 5 cycles) and dedicated ADV#, IND#, and WAIT# signals for precise bus timing control.

The memory features persistent and password-based Advanced Sector Protection, a factory- or customer-lockable Secured Silicon Sector, and hardware write protection (WP#) for the two outermost sectors of the large bank. Data retention is rated at 20 years typical, with 1 million program/erase cycles per sector, and full CFI compliance enables automatic configuration detection by host systems.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density16 Mbit (512k × 32-bit) - provides sufficient code storage for dual-image firmware in automotive ECUs.
Supply Voltage2.5 V to 2.75 V - single-rail compatibility with 2.6 V system power domains, eliminating level-shifting overhead.
Max Clock Frequency66 MHz - enables 264 MB/s burst read throughput on x32 bus, meeting real-time boot latency budgets.
Access Time54 ns asynchronous tACC - ensures deterministic response for legacy microcontroller interfaces without clock synchronization.
Data Retention20 years typical - validated for lifetime reliability in under-hood automotive environments.
Endurance1 million write cycles per sector - supports frequent over-the-air (OTA) update partitioning without wear-out risk.
Operating Temperature–40 °C to +125 °C - qualified for extended temperature automotive applications per AEC-Q100 stress requirements.

Pinout & Package

Package: 80-pin Plastic Quad Flat Package (PQFP), 20.0 mm × 14.0 mm body, 0.65 mm pitch, lead-free (Pb-free) option confirmed.

Pin/TerminalCircuit RoleDesign Meaning
A18–A0Address Input19-bit address bus for 512k-word addressing; A9 supports 12 V autoselect voltage for ID detection.
DQ31–DQ0Bi-directional Data Busx32 data path enabling full-word parallel access; compatible with 32-bit microprocessor buses.
CE#, OE#, WE#Chip/Output/Write EnableAsynchronous control inputs - enable low-latency command execution independent of CLK timing.
CLK, ADV#, IND#, WAIT#Burst Timing ControlSupports synchronous burst reads with programmable latency; IND# flags last word, WAIT# confirms data validity in continuous mode.
ACC, WP#, RESET#, RY/BY#Function Control & StatusACC accelerates erase/program; WP# hardware-locks outer sectors; RY/BY# open-drain ready/busy indicator requires external pull-up.

Key Features

FeatureDesign Value
Dual-Bank Simultaneous Read/WriteEnables zero-latency firmware execution from one bank while updating the other - eliminates boot interruption during OTA updates.
Dual Boot Sector ArchitectureTop-and-bottom configurable boot sectors allow redundant firmware images and safe fallback recovery after failed updates.
VersatileI/O™ InterfaceAccepts 1.65–3.6 V I/O voltage independently of VCC - simplifies interfacing with mixed-voltage SoCs without level shifters.
Secured Silicon SectorFactory- or customer-programmable locked region stores cryptographic keys or calibration data immune to field reprogramming.
Advanced Sector ProtectionPersistent lock bits and password-based protection prevent unauthorized firmware modification - meets ISO 21434 cybersecurity requirements.

Applications

Automotive Instrument ClusterADAS Domain Controller Boot Storage

Use Scenario: Stores primary and backup firmware images for real-time digital instrument clusters requiring seamless failover.

IC Role / Device Role / Timing Role: Dual-boot Flash memory providing concurrent read (active UI rendering) and write (firmware patching) with sub-100 µs latency.

Use Value: Eliminates display blackouts during updates by leveraging bank interleaving - critical for ASIL-B functional safety compliance.

Use Scenario: Hosts boot code and secure bootloader for radar/vision fusion processors in Level 2+ ADAS systems.

IC Role / Device Role / Timing Role: Trusted non-volatile storage with Secured Silicon Sector for cryptographic root-of-trust key storage and authenticated boot verification.

Use Value: Prevents tampering of boot firmware via hardware-enforced password and persistent lock bits - satisfies UNECE R155 cybersecurity management system (CSMS) requirements.

Engine Control Unit (ECU)Telematics Control Unit (TCU)

Use Scenario: Stores calibrated engine maps and diagnostic routines updated via dealership service tools.

IC Role / Device Role / Timing Role: High-endurance Flash with 1M-cycle sector endurance and hardware WP# protection for safety-critical calibration data.

Use Value: Guarantees 15+ year data integrity and update resilience under thermal cycling - aligned with OEM 15-year vehicle lifecycle expectations.

Use Scenario: Holds cellular modem firmware, GNSS stack, and OTA update staging area in connected vehicle gateways.

IC Role / Device Role / Timing Role: Burst-mode Flash supporting fast sequential reads for modem initialization and parallel erase/write for background update staging.

Use Value: Reduces TCU boot time by 40% vs. legacy SPI NOR; simultaneous bank operation cuts OTA staging latency by >60%.

Equivalent & Alternatives

The following parts are listed as comparable options for similar burst-mode Flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S29CL016J0MQFM0133.3 V supply (3.0–3.6 V), same density/package/timing - no 2.6 V compatibility.Targets 3.3 V industrial or infotainment subsystems; not suitable for 2.6 V automotive power domains.Select only if system VCC is fixed at 3.3 V and extended temperature rating is required.
MX29LV160ETTI-90G3.0 V supply, 16 Mbit, x16 bus, no simultaneous read/write, slower 90 ns access.Lacks dual-bank concurrency and burst interface - limits OTA update performance and real-time responsiveness.Consider only for cost-sensitive, non-automotive designs where bank interleaving and high-speed burst are unnecessary.

Compared with S29CL016J0MQFM013, this part enables lower-power 2.6 V operation critical for modern automotive power architectures; versus MX29LV160ETTI-90G, it delivers 2.2× faster effective throughput and deterministic concurrent execution essential for ASIL-B software update pipelines.

Availability

S29CD016J0MQFM013 is available at Aetrix Electronics and suitable for automotive instrument clusters, ADAS domain controllers, engine control units, and telematics control units requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S29CD016J0MQFM013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a global leader in embedded solutions, specializing in high-reliability memory, PSoC programmable systems-on-chip, and automotive-grade interface ICs.

The S29CD-J series was designed specifically for automotive and industrial applications demanding concurrent code execution and firmware update resilience - emphasizing dual-bank architecture, extended temperature operation, and hardware security primitives.

FAQ

What is the purpose of the ACC pin on S29CD016J0MQFM013?

The ACC (Acceleration) pin accepts a 12 V signal to accelerate internal erase and program operations, reducing double-word programming time to 18 µs and sector erase to 1.0 s. When unused, ACC must be tied to VSS or VCC - floating is prohibited. This feature is essential for minimizing OTA update windows in automotive ECU applications.

Does S29CD016J0MQFM013 support Common Flash Interface (CFI)?

Yes, the device fully supports JEDEC-standard Common Flash Interface (CFI) as defined in Appendix 1 of the datasheet. CFI enables host systems to auto-detect device geometry, timing parameters, and command sets at runtime - eliminating hardcoded configuration and improving firmware portability across Flash variants.

How does the dual boot sector configuration work in practice?

The device offers top-boot or bottom-boot sector options (selected via ordering code), with eight 2k double-word sectors at each end and thirty 16k double-word sectors in the middle. This allows independent locking and updating of primary and recovery firmware images - enabling atomic firmware swaps and guaranteed bootability after partial failures.

Is the 80-pin PQFP package RoHS-compliant and lead-free?

Yes, the "F" in the ordering code S29CD016J0MQFM013 explicitly denotes the Pb-free (RoHS-compliant) material set. The package uses lead-free solderable terminations and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL-3), with floor life of 168 hours at ≤30 °C/60% RH.

S29CD016J0MQFM013 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
CD-J
Package/Case:
80-BQFP
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
16Mbit
Memory Organization:
512K x 32
Memory Interface:
Parallel
Clock Frequency:
56 MHz
Write Cycle Time - Word, Page:
60ns
Access Time:
54 ns
Voltage - Supply:
1.65V ~ 2.75V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
80-PQFP (14x20)

S29CD016J0MQFM013 FAQ

1.How can I place an order for S29CD016J0MQFM013 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29CD016J0MQFM013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29CD016J0MQFM013 reliable?

The price and inventory of S29CD016J0MQFM013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29CD016J0MQFM013 is usually 5 days.

3.What payment methods are accepted for S29CD016J0MQFM013?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29CD016J0MQFM013 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29CD016J0MQFM013?

S29CD016J0MQFM013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29CD016J0MQFM013 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29CD016J0MQFM013?

For technical support, including S29CD016J0MQFM013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29CD016J0MQFM013 requirements.

6.How does Aetrix verify that S29CD016J0MQFM013 is sourced from the original manufacturer or authorized distributors?

All S29CD016J0MQFM013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29CD016J0MQFM013 meets industry standards.

7.What is the process for return or replacement of S29CD016J0MQFM013?

All S29CD016J0MQFM013 units undergo pre-shipment inspection (PSI). If there is an issue with S29CD016J0MQFM013, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29CD016J0MQFM013 part is unused and in its original packaging.

Return procedure for S29CD016J0MQFM013:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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