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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29CD016J0MQFM030

Name: S29CD016J0MQFM030
Brand: Infineon Technologies
SKU: S29CD016J0MQFM030
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29CD016J0MQFM030

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 80-BQFP

Datasheet:: S29CD016J0MQFM030.pdf

Description:: IC FLASH 16MBIT PAR 56MHZ 80PQFP

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Product details

Overview

S29CD016J0MQFM030 from Cypress Semiconductor is a 16 Mbit (512k × 32-bit) 2.6 V single-supply burst-mode Flash memory with simultaneous read/write capability across two independent banks, dual boot sector architecture (top/bottom), and VersatileI/O™ support (1.65–3.6 V). It operates at up to 66 MHz with 54 ns asynchronous access time and targets automotive infotainment boot code storage and firmware update partitions.

For engineers reviewing the S29CD016J0MQFM030 datasheet, S29CD016J0MQFM030 pinout, S29CD016J0MQFM030 application, or S29CD016J0MQFM030 equivalent, key selection criteria include dual-bank zero-latency operation, 1 million program/erase cycles per sector, 20-year data retention, industrial/extended temperature range (–40 °C to +125 °C), and JEDEC-standard command set compatibility.

Technical Context

This device implements a dual-bank floating-gate Flash architecture fabricated in 110 nm process, enabling concurrent read from one bank while programming or erasing the other-no arbitration or latency penalty. Its x32 data bus, synchronous burst interface (configurable 2/4/8 double-word wrap-around), and dedicated ADV#, IND#, and WAIT# signals support high-throughput microprocessor boot and firmware execution.

Advanced protection includes persistent and password-based sector locking, hardware WP# protection of outermost large-bank sectors, and a factory- or customer-lockable Secured Silicon Sector. Command execution status is reported via RY/BY# output and Data Polling bits, with suspend/resume support for both program and erase operations.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	16 Mbit (512k × 32-bit) - supports full 32-bit data path for MCU boot ROM mapping
Supply Voltage	2.5 V to 2.75 V - single-rail operation eliminates level-shifting in 2.6 V systems
Max Clock Frequency	66 MHz - enables burst read throughput up to 264 MB/s (8-word burst)
Asynchronous Access Time	54 ns - meets timing closure for legacy 80 MHz bus interfaces
Program/Erase Endurance	1 million cycles per sector - supports field firmware updates over 10+ years in automotive ECUs
Data Retention	20 years (typical) - validated for under-hood applications at 125 °C junction temperature
Operating Temperature	–40 °C to +125 °C - qualified for extended-temperature automotive modules
Burst Configuration	Linear 2/4/8 double-word with wrap-around - reduces instruction fetch stalls in real-time OS kernels

Pinout & Package

Package: 80-ball Fortified BGA (11 × 9 mm, 1.0 mm pitch), Pb-free, RoHS-compliant.

Pin/Terminal	Circuit Role	Design Meaning
A18–A0	Address Input	19-bit address bus (A18–A0) for 512k-word addressing; A9 supports 12 V autoselect
DQ31–DQ0	Bi-directional Data I/O	32-bit parallel data path; supports burst transfers and JEDEC CFI queries
CE#, OE#, WE#	Chip/Output/Write Enable	Asynchronous control inputs; CE# enables device, OE# gates output drivers, WE# controls write latching
CLK, ADV#, IND#, WAIT#	Burst Timing Control	CLK synchronizes burst reads; ADV# latches address; IND# flags last burst word; WAIT# signals data validity in continuous mode
RY/BY#, WP#, RESET#, ACC	Status & Protection	RY/BY# open-drain ready/busy indicator; WP# hardware-locks outer sectors; RESET# forces hardware reset; ACC = VHH accelerates program/erase
VCC, VIO, VSS, NC	Power & No Connect	VCC = 2.5–2.75 V core supply; VIO = 1.65–3.6 V I/O voltage reference; VSS = ground; NC = unconnected die pad

Key Features

Feature	Design Value
Simultaneous Read/Write	Zero-latency concurrent access across two independent banks enables real-time firmware patching without halting application execution
Dual Boot Sector Architecture	Top and bottom boot configurations allow safe failover between primary and backup firmware images during OTA updates
Secured Silicon Sector	Factory- or customer-lockable 2 kB region stores cryptographic keys or calibration data immune to field reprogramming
Unlock Bypass Command	Reduces typical double-word programming time from 18 µs to ≤12 µs by skipping initial unlock sequence
Common Flash Interface (CFI)	Standardized query table allows automatic detection of geometry, timing, and command set by bootloader software
Hardware Reset (RESET#)	Asynchronous active-low input forces device into known state without clock dependency-critical for safety-critical power-up sequencing

Applications

Automotive Instrument Cluster

Industrial PLC Firmware Storage

Use Scenario: Storing calibrated gauge graphics, driver alert logic, and CAN message lookup tables in digital dashboards.

IC Role / Device Role / Timing Role: Primary boot ROM and runtime firmware partition accessed by ARM Cortex-M7 MCU at 66 MHz burst rate.

Use Value: Dual-bank operation allows background firmware validation while displaying current UI-no screen freeze during updates.

Use Scenario: Holding ladder logic executables, I/O configuration maps, and safety watchdog firmware in modular controllers.

IC Role / Device Role / Timing Role: Non-volatile program memory with hardware WP# protection of critical startup routines against accidental overwrite.

Use Value: 1M-cycle endurance ensures >15 years of daily firmware revisions in factory automation environments.

Medical Imaging Boot Loader

Avionics Display System

Use Scenario: Hosting secure boot loader and DICOM protocol stack in portable ultrasound devices requiring FDA-certified firmware integrity.

IC Role / Device Role / Timing Role: Secured Silicon Sector stores RSA-2048 private key; dual boot enables A/B firmware rollback on signature verification failure.

Use Value: Password + persistent protection prevents unauthorized firmware modification-meets IEC 62304 Class C requirements.

Use Scenario: Storing flight-critical display firmware, font assets, and synthetic vision terrain data in certified cockpit displays.

IC Role / Device Role / Timing Role: High-reliability Flash memory operating at –40 °C to +125 °C with RY/BY#-driven status polling for deterministic boot timing.

Use Value: 20-year data retention validated at 125 °C ensures no bit corruption over aircraft service life (30+ years).

Equivalent & Alternatives

The following parts are listed as comparable options for similar burst-mode Flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29CL016J0MQFM030	3.0–3.6 V supply (vs. 2.5–2.75 V); identical density, timing, and feature set	Used where system already uses 3.3 V I/O rails; no level-shifting needed	Select when board-level power architecture mandates 3.3 V core supply
MX29LV160ETTI-70G	Single 3.0 V supply; 70 ns access; no simultaneous read/write; no burst mode	Legacy designs lacking dual-bank or burst requirements; lower cost where performance not critical	Choose only if zero-latency concurrent operation is unnecessary and JEDEC command compatibility suffices

Compared with S29CL016J0MQFM030, this part offers lower voltage operation but same functionality; versus MX29LV160ETTI-70G, it delivers 2.3× faster effective read bandwidth and true concurrent execution-essential for deterministic boot and firmware update workflows.

Availability

S29CD016J0MQFM030 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, medical imaging boot loaders, and avionics display systems requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S29CD016J0MQFM030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability non-volatile memory and programmable system-on-chip solutions for automotive, industrial, and aerospace applications.

The S29CD-J series targets demanding automotive environments requiring simultaneous read/write, extended temperature operation, and robust firmware protection-specifically engineered for ECU boot code, ADAS subsystems, and safety-critical firmware storage.

FAQ

What is the purpose of the ACC pin on S29CD016J0MQFM030?

The ACC (Acceleration) pin accepts V_HH (12 V) to reduce internal program and erase times by accelerating charge injection into the floating gate. When unused, it must be tied to V_SS or V_CC; applying V_HH cuts typical double-word programming time from 18 µs to ≤12 µs and sector erase from 1.0 s to ~700 ms-critical for rapid field firmware updates.

Does S29CD016J0MQFM030 support JEDEC-standard commands?

Yes-it implements the JEDEC JESD68 (JC42.4) standard command set, including autoselect, block erase, and program commands. It also supports Common Flash Interface (CFI) query mode, allowing host software to auto-detect device geometry, timing parameters, and supported features without hard-coded assumptions.

How does the dual boot sector configuration work in practice?

The device partitions its array into top and bottom boot sectors (eight 2k double-word sectors each), configurable via ordering option. During boot, the MCU can execute from either region; if an update fails in the active bank, the bootloader switches to the mirrored bank-enabling atomic firmware swaps and guaranteed recovery without external supervision.

Can S29CD016J0MQFM030 operate with mixed I/O voltages?

Yes-its VersatileI/O™ interface accepts V_IO from 1.65 V to 3.6 V independently of V_CC, allowing direct interfacing with 1.8 V, 2.5 V, or 3.3 V logic families without external level shifters. This simplifies integration into heterogeneous SoC platforms where core and I/O domains use different supply rails.

S29CD016J0MQFM030 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: CD-J

Package/Case:: 80-BQFP

Packaging:: Tray

Product Status:: Last Time Buy

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 16Mbit

Memory Organization:: 512K x 32

Memory Interface:: Parallel

Clock Frequency:: 56 MHz

Write Cycle Time - Word, Page:: 60ns

Access Time:: 54 ns

Voltage - Supply:: 1.65V ~ 2.75V

Operating Temperature:: -40°C ~ 125°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 80-PQFP (14x20)

S29CD016J0MQFM030 FAQ

1.How can I place an order for S29CD016J0MQFM030 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29CD016J0MQFM030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29CD016J0MQFM030 reliable?

The price and inventory of S29CD016J0MQFM030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29CD016J0MQFM030 is usually 5 days.

3.What payment methods are accepted for S29CD016J0MQFM030?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29CD016J0MQFM030 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29CD016J0MQFM030?

S29CD016J0MQFM030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29CD016J0MQFM030 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29CD016J0MQFM030?

For technical support, including S29CD016J0MQFM030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29CD016J0MQFM030 requirements.

6.How does Aetrix verify that S29CD016J0MQFM030 is sourced from the original manufacturer or authorized distributors?

All S29CD016J0MQFM030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29CD016J0MQFM030 meets industry standards.

7.What is the process for return or replacement of S29CD016J0MQFM030?

All S29CD016J0MQFM030 units undergo pre-shipment inspection (PSI). If there is an issue with S29CD016J0MQFM030, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29CD016J0MQFM030 part is unused and in its original packaging.

Return procedure for S29CD016J0MQFM030:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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