Spansion S29CD016J0PQAM110
- Part No.:
- S29CD016J0PQAM110
- Manufacturer:
- Spansion
- Category:
- Memory
- Package:
- 80-BQFP
- Datasheet:
-
S29CD016J0PQAM110.pdf
- Description:
- IC FLASH 16MBIT PARALLEL 80PQFP
- Quantity:
- Payment:

- Shipping:

Inventory:256
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29CD016J0PQAM110 from Cypress Semiconductor is a 16 Mbit (512k × 32-bit) burst-mode Flash memory IC with dual-boot sector architecture, simultaneous read/write operation across two independent banks, and single 2.6 V supply (2.5–2.75 V). It supports 66 MHz synchronous burst access (tBACC = 8 ns), zero-latency concurrent operations, and operates over –40 °C to +125 °C for automotive powertrain and ADAS control modules.
For engineers reviewing the S29CD016J0PQAM110 datasheet, S29CD016J0PQAM110 pinout, S29CD016J0PQAM110 application, or S29CD016J0PQAM110 equivalent, key selection criteria include dual-bank concurrency timing, VersatileI/O™ voltage range (1.65–3.6 V), secured silicon sector lock capability, and PQFP-80 package compatibility with industrial-grade thermal cycling requirements.
Technical Context
This device implements a floating-gate 110 nm process with separate address/data buses per bank, enabling true zero-latency interleaved execution of program/erase in one bank while reading from the other. Its command set complies with JEDEC JC42.4 and supports Common Flash Interface (CFI) for host auto-configuration.
The architecture includes dedicated hardware acceleration via ACC pin (VHH), programmable burst lengths (2/4/8 double words with wrap), and dual protection schemes: persistent sector lock bits and password-based dynamic protection. Ready/Busy (RY/BY#) and IND#/WAIT# signals provide precise operation status feedback without polling overhead.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (512k × 32-bit) - supports full 32-bit data path without byte-lane masking in microcontroller boot interfaces. |
| Supply Voltage | 2.5 V to 2.75 V - single-rail operation eliminates need for level-shifting in 2.6 V automotive domains. |
| Burst Clock Frequency | 66 MHz - enables 264 MB/s peak throughput in linear burst mode with 4-cycle initial delay (4-1-1-1). |
| Simultaneous Operation | Zero-latency dual-bank R/W - allows firmware update in background bank while executing code from active bank. |
| Data Retention | 20 years (typical) - validated for extended-life automotive ECUs requiring >15-year field reliability. |
| Cycle Endurance | 1 million program/erase cycles per sector - sufficient for over-the-air (OTA) update partitions with daily updates over 10+ years. |
| Operating Temperature | –40 °C to +125 °C - qualified for engine control unit (ECU) and transmission control module (TCM) mounting locations. |
Pinout & Package
Package: 80-pin Plastic Quad Flat Package (PQFP), 20.0 mm × 14.0 mm, 0.65 mm pitch, RoHS-compliant (Pb-free option available).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A18–A0 | Address Input | 19-bit address bus (A18–A0) for 512k-word addressing; A9 supports 12 V autoselect detection. |
| DQ31–DQ0 | Data I/O | 32-bit bidirectional data bus; supports x32 interface directly with ARM Cortex-R5/R7 and Power Architecture MPC57xx MCUs. |
| CE#, OE#, WE# | Control Inputs | Asynchronous chip/output/write enable signals - decoupled from CLK for mixed-mode timing flexibility. |
| CLK, ADV#, IND#, WAIT# | Burst Timing | CLK drives synchronous burst; ADV# latches address; IND# flags last burst word; WAIT# indicates data validity in continuous mode. |
| RY/BY#, WP#, RESET#, ACC | Status & Protection | RY/BY# open-drain ready/busy indicator; WP# hardware-locks outer sectors; RESET# forces hardware reset; ACC enables VHH-assisted programming/erase acceleration. |
Key Features
| Feature | Design Value |
|---|---|
| Dual Boot Sector | Top and bottom boot configurations allow fail-safe firmware recovery - critical for ISO 26262 ASIL-B/C systems where boot integrity must be guaranteed. |
| Secured Silicon Sector | Factory- or customer-lockable 2 kB region stores cryptographic keys or calibration data immune to field reprogramming. |
| VersatileI/O™ | I/O voltage range 1.65–3.6 V enables direct interfacing with 1.8 V, 2.5 V, or 3.3 V logic without external level shifters. |
| Suspend/Resume Commands | Interrupts ongoing erase/program operations to service high-priority reads - essential for real-time OS context switching in safety-critical tasks. |
| Hardware Data Protection | WP# pin disables write/erase on two outermost large-bank sectors - prevents accidental corruption of bootloader or configuration tables. |
Applications
| Engine Control Unit (ECU) | Advanced Driver Assistance Systems (ADAS) |
|---|---|
|
Use Scenario: Storing calibrated fuel injection maps and real-time diagnostic logs in vehicles with CAN FD communication. IC Role / Device Role / Timing Role: Non-volatile storage for boot firmware and runtime parameter tables; dual-bank operation enables seamless OTA updates without engine shutdown. Use Value: Zero-latency simultaneous read/write ensures uninterrupted engine control during background firmware patching - meeting ASIL-B timing constraints. |
Use Scenario: Hosting sensor fusion algorithms and camera calibration data in front radar and surround-view systems. IC Role / Device Role / Timing Role: Burst-mode Flash providing low-latency access to neural network weights and image processing lookup tables. Use Value: 66 MHz synchronous access reduces CPU wait states during high-bandwidth vision processing - improving frame rate consistency. |
| Transmission Control Module (TCM) | Electric Vehicle Battery Management System (BMS) |
|
Use Scenario: Storing gear-shifting logic, torque maps, and fault history in 8-speed automatic transmissions. IC Role / Device Role / Timing Role: Dual-boot Flash supporting redundant firmware images for fail-operational behavior during transmission software upgrades. Use Value: Secured silicon sector protects torque limiter parameters from unauthorized modification - satisfying UNECE R156 software update regulation. |
Use Scenario: Retaining cell balancing profiles and thermal derating curves across charge/discharge cycles in 400 V battery packs. IC Role / Device Role / Timing Role: High-endurance Flash storing mission-critical BMS calibration data with 1M-cycle sector endurance. Use Value: 20-year data retention ensures accurate state-of-charge estimation over full vehicle lifetime without recalibration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar burst-mode Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29CL016J0PQAM110 | 3.3 V supply (3.0–3.6 V); identical pinout, timing, and feature set except VCC range and autoselect ID. | Used in 3.3 V industrial controllers where 2.6 V rail is unavailable; not suitable for 2.6 V automotive domains. | Select when system uses 3.3 V core logic and requires same dual-bank concurrency but cannot support 2.6 V supply. |
| MX29LV160DBTI-70G | Single 3.0 V supply; no simultaneous R/W; 70 ns async access only; lacks CFI, burst mode, and VersatileI/O. | Legacy 8/16-bit MCU designs with simple boot ROM requirements; no OTA update or real-time interrupt support. | Choose only for cost-sensitive, non-automotive applications lacking concurrency or burst performance needs. |
Compared with S29CL016J0PQAM110, this part enables lower-power 2.6 V operation in thermally constrained ECUs; versus MX29LV160DBTI-70G, it delivers 8× faster burst throughput and deterministic dual-bank latency - critical for functional safety-certified firmware architectures.
Availability
S29CD016J0PQAM110 is available at Aetrix Electronics and suitable for automotive powertrain control, ADAS sensor fusion, and electric vehicle battery management systems requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S29CD016J0PQAM110 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability semiconductor solutions for automotive, industrial, and IoT applications, with expertise in non-volatile memory and microcontroller systems.
The S29CD-J series targets automotive-grade Flash memory applications demanding concurrent execution, secure boot, and extended temperature operation - specifically engineered for ASIL-B/C compliant electronic control units.
FAQ
What is the purpose of the ACC pin on S29CD016J0PQAM110?
The ACC (Acceleration) pin accepts VHH (12 V) to reduce internal programming and erase times by accelerating Fowler-Nordheim tunneling. When unused, it must be tied to VSS or VCC. This pin enables factory-programming speedup and supports fast field updates in time-critical automotive diagnostics.
Does S29CD016J0PQAM110 support JEDEC-standard command sets?
Yes - it fully implements the JEDEC JC42.4 standard command set for Flash memory, including autoselect, block erase, and program commands. This ensures interoperability with standard flash programmers and bootloader frameworks compliant with JEDEC specifications.
How does the dual-boot sector configuration improve system reliability?
The top-and-bottom boot sector layout allows independent locking and updating of primary and backup firmware images. During an OTA update, the system boots from the stable image while writing to the alternate sector - eliminating boot failure risk from interrupted writes or power loss.
Can S29CD016J0PQAM110 operate with a 1.8 V I/O interface?
Yes - its VersatileI/O™ feature supports VIO from 1.65 V to 3.6 V, enabling direct connection to 1.8 V microcontrollers without level shifters. The core VCC remains at 2.6 V, maintaining internal timing integrity while simplifying board-level signal routing.
S29CD016J0PQAM110 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Spansion
- Series:
- CD-J
- Package/Case:
- 80-BQFP
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 16Mbit
- Memory Organization:
- 512K x 32
- Memory Interface:
- Parallel
- Clock Frequency:
- 66 MHz
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 54 ns
- Voltage - Supply:
- 1.65V ~ 2.75V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 80-PQFP (14x20)
S29CD016J0PQAM110 FAQ
1.How can I place an order for S29CD016J0PQAM110 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29CD016J0PQAM110 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29CD016J0PQAM110 reliable?
The price and inventory of S29CD016J0PQAM110 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29CD016J0PQAM110 is usually 5 days.
3.What payment methods are accepted for S29CD016J0PQAM110?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29CD016J0PQAM110 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29CD016J0PQAM110?
S29CD016J0PQAM110 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29CD016J0PQAM110 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29CD016J0PQAM110?
For technical support, including S29CD016J0PQAM110 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29CD016J0PQAM110 requirements.
6.How does Aetrix verify that S29CD016J0PQAM110 is sourced from the original manufacturer or authorized distributors?
All S29CD016J0PQAM110 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29CD016J0PQAM110 meets industry standards.
7.What is the process for return or replacement of S29CD016J0PQAM110?
All S29CD016J0PQAM110 units undergo pre-shipment inspection (PSI). If there is an issue with S29CD016J0PQAM110, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29CD016J0PQAM110 part is unused and in its original packaging.
Return procedure for S29CD016J0PQAM110:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29CD016J0PQAM110 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…

