Infineon Technologies S29CD016J0PQAM113
- Part No.:
- S29CD016J0PQAM113
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 80-BQFP
- Datasheet:
-
S29CD016J0PQAM113.pdf
- Description:
- IC FLASH 16MBIT PARALLEL 80PQFP
- Quantity:
- Payment:

- Shipping:

Inventory:2,743
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Product details
Overview
S29CD016J0PQAM113 from Cypress Semiconductor is a 16 Mbit (512k × 32-bit) burst-mode Flash memory IC with simultaneous read/write capability across dual banks, operating at 2.5–2.75 V supply, 66 MHz max clock frequency, and featuring dual boot sector architecture for automotive firmware storage. It supports zero-latency concurrent operations using separate address/data paths and integrates VersatileI/O™ for 1.65–3.6 V I/O compatibility.
For engineers reviewing the S29CD016J0PQAM113 datasheet, S29CD016J0PQAM113 pinout, S29CD016J0PQAM113 application, or S29CD016J0PQAM113 equivalent, key selection criteria include its 2.6 V single-supply operation, 80-pin PQFP package with verified pin mapping, dual-bank burst interface timing, and advanced sector protection methods for safety-critical firmware updates.
Technical Context
This device implements a dual-bank floating-gate Flash architecture fabricated in 110 nm process, enabling independent read and write execution on upper and lower banks without arbitration delay. Its synchronous burst mode uses CLK, ADV#, and IND#/WAIT# to manage 2/4/8-double-word wrap-around sequences with programmable initial clock delay (4–5 cycles).
Hardware-level protection includes WP#-controlled locking of two outermost large-bank sectors, ACC-assisted high-voltage programming acceleration, and persistent/password-based Advanced Sector Protection. The RY/BY# open-drain output provides real-time status feedback during erase/program operations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (512k × 32-bit) - supports full 32-bit data path for microprocessor boot code fetch |
| Supply Voltage | 2.5 V to 2.75 V - single VCC rail eliminates level-shifting for 2.6 V system domains |
| Max Clock Frequency | 66 MHz - enables synchronous burst access with 8 ns tBACC for deterministic timing in real-time firmware execution |
| Data Retention | 20 years (typical) - meets automotive AEC-Q100 long-term reliability requirements for ECU storage |
| Endurance | 1 million program/erase cycles per sector - supports frequent over-the-air (OTA) update partitioning |
| Operating Temperature | –40 °C to +125 °C - qualified for extended temperature automotive applications (Grade 1) |
| Burst Access Delay | 4–5 clock cycles - configurable initial latency aligns with CPU wait-state requirements |
| Simultaneous Operation | Zero-latency dual-bank read/write - allows background firmware update while executing active code from alternate bank |
Pinout & Package
Package: 80-pin Plastic Quad Flat Package (PQFP), 20.0 mm × 14.0 mm body, 0.65 mm pitch, lead-free (RoHS-compliant) option available.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A18–A0 | Address Input | 19-bit address bus (A18–A0) for 512k-word addressing; A9 accepts 12 V autoselect voltage |
| DQ31–DQ0 | Data I/O | 32-bit bidirectional data bus supporting x32 burst transfers and JEDEC-standard command protocol |
| CE#, OE#, WE# | Control Inputs | Asynchronous chip/output/write enable signals - decouple timing from CLK for flexible interface integration |
| CLK, ADV#, IND#/WAIT# | Burst Timing | CLK drives synchronous mode; ADV# latches burst address; IND# signals last word; WAIT# indicates data validity in continuous burst |
| RY/BY#, WP#, RESET#, ACC | Status & Control | RY/BY# open-drain ready/busy flag; WP# hardware-locks outer sectors; RESET# forces hardware reset; ACC enables VHH acceleration for faster erase/program |
Key Features
| Feature | Design Value |
|---|---|
| Dual Boot Sector Architecture | Top and bottom boot configuration enables fail-safe firmware recovery by isolating primary and backup boot images |
| Secured Silicon Sector | Factory- or customer-lockable 2 kB region stores cryptographic keys or calibration data with permanent read/write protection |
| Advanced Sector Protection | Persistent and password-based methods allow granular, non-volatile locking of individual sectors without requiring continuous power |
| Unlock Bypass Command | Reduces double-word programming time by 30% versus standard command sequence, accelerating field firmware patching |
| Common Flash Interface (CFI) | JEDEC JESD68-compliant CFI query table enables automatic driver detection and runtime configuration in bootloader software |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
|
Use Scenario: Storing calibrated engine maps and real-time control algorithms subject to periodic OTA updates. IC Role / Device Role / Timing Role: Dual-bank Flash memory providing concurrent execution and background reprogramming without system interruption. Use Value: Zero-latency simultaneous read/write ensures uninterrupted engine operation during firmware validation and swap-critical for ASIL-B compliance. |
Use Scenario: Holding ladder logic firmware and I/O configuration data in modular automation controllers. IC Role / Device Role / Timing Role: Nonvolatile storage with hardware write protection (WP#) safeguarding critical startup routines from accidental overwrite. Use Value: Persistent sector locking prevents corruption during brown-out events, maintaining deterministic boot behavior in harsh factory environments. |
| Avionics Flight Management System | Medical Imaging Device Boot Memory |
|
Use Scenario: Hosting certified flight software with dual-image redundancy and secure boot verification. IC Role / Device Role / Timing Role: Secured Silicon Sector stores cryptographic signatures; dual boot enables A/B image rollback on integrity failure. Use Value: 20-year data retention and 125 °C extended temperature rating meet DO-160E environmental stress requirements. |
Use Scenario: Storing DICOM-compliant boot firmware and calibration tables in MRI/PET scanner mainboards. IC Role / Device Role / Timing Role: Burst-mode interface delivers low-latency instruction fetch for real-time image reconstruction processors. Use Value: 66 MHz synchronous access reduces boot time by >40% versus legacy parallel Flash, accelerating clinical workflow startup. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar burst-mode Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29CL016J0PQAM113 | 3.0–3.6 V supply range; identical pinout and timing but higher VCC tolerance | Used where system rail is 3.3 V and 2.6 V regulation is unavailable | Select when board-level power architecture mandates 3.3 V-only Flash; not interoperable with 2.6 V designs |
| MX29LV160DBTI-70G | Single 3.0 V supply; no simultaneous read/write; 70 ns async access only; no burst mode or CFI support | Legacy replacement in cost-sensitive industrial panels without OTA update needs | Choose only for drop-in replacement where dual-bank operation and firmware agility are not required |
Compared with S29CL016J0PQAM113 and MX29LV160DBTI-70G, the S29CD016J0PQAM113 uniquely delivers zero-latency dual-bank operation at 2.6 V, enabling safe firmware updates in automotive and medical systems where power efficiency and functional safety coexist.
Availability
S29CD016J0PQAM113 is available at Aetrix Electronics and suitable for automotive ECU design, industrial PLC firmware storage, avionics boot memory, and medical imaging device boot memory requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29CD016J0PQAM113 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a global leader in high-performance embedded memory and programmable solutions, founded in 1982 and headquartered in San Jose, California.
The S29CD-J series was designed specifically for automotive and industrial applications demanding robust, dual-bank Flash with simultaneous operation, extended temperature resilience, and hardware-enforced security for firmware integrity.
FAQ
What is the function of the ACC pin on S29CD016J0PQAM113?
The ACC (Acceleration) pin accepts VHH (12 V) to accelerate internal erase and program operations by enabling higher tunneling current in the floating gate structure. When unused, it must be tied to VSS or VCC-not left floating-to prevent unintended acceleration or latch-up. This pin reduces typical double-word programming time from 25 µs to 18 µs and sector erase from 1.2 s to 1.0 s.
Does S29CD016J0PQAM113 support JEDEC-standard command sets?
Yes, the device implements the JEDEC JC42.4 standard command set for program, erase, and query operations, including autoselect ID codes (7E, 46, 01/00 for S29CD016J). It also fully supports Common Flash Interface (CFI) per JEDEC JESD68, allowing host software to auto-detect geometry, timing, and protection features at runtime without hard-coded parameters.
How does the dual boot sector configuration work in practice?
The device partitions the 512k-word array into top and bottom boot sectors-eight 2k double-word sectors at each end, plus thirty 16k double-word sectors in the middle. During reset, the processor can be configured to fetch boot code from either top or bottom via hardware strap or register setting, enabling A/B firmware images with atomic swap capability and guaranteed fallback on corruption.
Is the 80-pin PQFP package RoHS-compliant and lead-free?
Yes, the S29CD016J0PQAM113 is offered in a lead-free (Pb-free) 80-pin PQFP package compliant with RoHS Directive 2011/65/EU and JEDEC JS-001 moisture sensitivity level 3 (MSL-3). The "F" material set designation in the order code confirms Pb-free construction, and the package undergoes 260 °C reflow profile qualification per J-STD-020.
S29CD016J0PQAM113 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- CD-J
- Package/Case:
- 80-BQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 16Mbit
- Memory Organization:
- 512K x 32
- Memory Interface:
- Parallel
- Clock Frequency:
- 66 MHz
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 54 ns
- Voltage - Supply:
- 1.65V ~ 2.75V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 80-PQFP (14x20)
S29CD016J0PQAM113 FAQ
1.How can I place an order for S29CD016J0PQAM113 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29CD016J0PQAM113 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of S29CD016J0PQAM113 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29CD016J0PQAM113 is usually 5 days.
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6.How does Aetrix verify that S29CD016J0PQAM113 is sourced from the original manufacturer or authorized distributors?
All S29CD016J0PQAM113 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29CD016J0PQAM113 meets industry standards.
7.What is the process for return or replacement of S29CD016J0PQAM113?
All S29CD016J0PQAM113 units undergo pre-shipment inspection (PSI). If there is an issue with S29CD016J0PQAM113, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29CD016J0PQAM113 part is unused and in its original packaging.
Return procedure for S29CD016J0PQAM113:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29CD016J0PQAM113 Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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M24C02-FMC6TG
STMicroelectronics

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Microchip Technology

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93LC46BT-I/OT
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AT24C04C-SSHM-T
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AT24C08C-STUM-T
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