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Infineon Technologies S29CD016J1JDGH017
- Part No.:
- S29CD016J1JDGH017
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- Die
- Datasheet:
-
S29CD016J1JDGH017.pdf
- Description:
- IC FLASH 16MBIT PAR DIE
- Quantity:
- Payment:
- Shipping:
Inventory:4,860
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Product details
Overview
S29CD016J1JDGH017 from Spansion LLC is a 16 Mbit (512K × 32-bit) 2.5–2.75 V single-supply burst-mode Flash memory IC with simultaneous read/write capability across two independent banks, 56 MHz synchronous operation, and dual boot sector architecture - deployed in automotive infotainment and engine control units requiring zero-latency background erase.
For engineers reviewing the S29CD016J1JDGH017 datasheet, S29CD016J1JDGH017 pinout, S29CD016J1JDGH017 application, or S29CD016J1JDGH017 equivalent, key selection criteria include 110 nm floating gate process, VersatileI/O™ support for 1.65–2.75 V I/O, JEDEC CFI compliance, persistent/password sector protection, and KGD (Known Good Die) form factor for embedded module integration.
Technical Context
This device implements a dual-bank Simultaneous Read/Write architecture using Fowler-Nordheim tunneling for erase and hot-electron injection for programming. Each bank operates independently, enabling zero-latency reads during background program/erase operations.
It supports linear burst modes (2/4/8 double-word) with wrap/non-wrap options, uses ADV# and CLK for synchronous access, and features RY/BY# and DQ6/DQ7 status polling for operation completion detection. Sector protection combines hardware WP# (two outermost 8 KB sectors), persistent software locking, and password-protected OTP configuration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (512K × 32-bit) - supports 2 MB of addressable code/data space in X32 bus configuration |
| Supply Voltage | 2.5 V to 2.75 V (VCC) - single rail enables direct interface with 2.5 V logic domains without level shifting |
| Max Clock Frequency | 56 MHz - delivers ≤10 ns synchronous burst access time for real-time firmware execution |
| Data Retention | 20 years (typical) - validated for automotive underhood temperature cycling and long-term storage |
| Erase Endurance | 100,000 cycles per sector (typical) - supports frequent OTA update partitions in telematics modules |
| Bus Interface | X32 asynchronous/synchronous - compatible with ARM9/PowerPC host processors using standard microprocessor timing |
| Protection Mechanisms | Hardware WP#, Persistent Sector Protection, Password Sector Protection - enables secure bootloader and calibration data partitioning |
Pinout & Package
Package: Known Good Die (KGD), bare die format with aluminum bond pads; intended for flip-chip or wire-bond integration into custom modules or multi-chip packages.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC | Core power supply | 2.5–2.75 V input powering internal logic, charge pumps, and memory array |
| VSS | Ground reference | Multiple dedicated ground pads ensure low-impedance return paths for high-speed switching noise suppression |
| CE#, OE#, WE# | Chip/Output/Write enable controls | Independent active-low enables eliminate bus contention in multi-device systems |
| RY/BY# | Ready/Busy indicator | Open-drain output signals operation completion or suspension without polling overhead |
| ADV#, CLK | Burst address valid & clock | Enable synchronous burst reads/writes with deterministic latency and phase-aligned timing |
| WP# | Hardware write protect | Hardwired protection for top/bottom 8 KB sectors - immune to software corruption or reset glitches |
| DQ[0:31] | 32-bit bidirectional data bus | Full-width interface reduces instruction fetch cycles vs. narrower buses; supports double-word addressing |
| A[0:18] | Address inputs | 19-bit address bus decodes 512K × 32-bit space; A16–A18 used for bank/sector selection in dual-boot mode |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank simultaneous read/write | Enables real-time firmware updates without halting CPU execution - critical for ASIL-B automotive safety mechanisms |
| VersatileI/O™ (VCCQ) | Supports 1.65–2.75 V I/O voltage - allows direct interfacing with 1.8 V microcontrollers while maintaining 2.5 V core operation |
| Secured Silicon Sector (256 B) | One-time-programmable OTP area stores immutable keys or calibration constants resistant to field reprogramming |
| Unlock Bypass programming | Reduces write cycle count from four to two - cuts flash programming time by ~50% in production test environments |
| Program/Erase Suspend & Resume | Allows interruption of erase to service high-priority reads - essential for deterministic response in real-time ECUs |
Applications
| Automotive Engine Control Unit (ECU) | Infotainment Head Unit Firmware Storage |
|---|---|
Use Scenario: Storing calibrated fuel injection maps and real-time diagnostic code in an ASIL-B compliant ECU. IC Role / Device Role / Timing Role: Non-volatile program memory with dual-boot capability for fail-safe firmware rollback. Use Value: Simultaneous read/write allows background update of secondary bank while primary bank executes live engine control - eliminating runtime interruption. |
Use Scenario: Hosting boot loader, OS kernel, and UI assets in a head unit with over-the-air (OTA) update capability. IC Role / Device Role / Timing Role: Burst-mode Flash providing low-latency instruction fetch for ARM Cortex-A8 processor. Use Value: 56 MHz synchronous access and 10 ns burst latency reduce boot time by >30% versus legacy parallel NOR devices. |
| Advanced Driver Assistance Systems (ADAS) Camera Module | Telematics Control Unit (TCU) Secure Boot |
Use Scenario: Storing image processing firmware and calibration parameters in a compact camera ECU operating at 125°C junction temperature. IC Role / Device Role / Timing Role: High-reliability KGD Flash integrated into thermally optimized SiP package. Use Value: 20-year data retention and 100K erase cycles ensure firmware integrity over 15-year vehicle lifetime despite thermal cycling. |
Use Scenario: Securing boot code and cryptographic keys against tampering in a cellular-connected TCU. IC Role / Device Role / Timing Role: Protected memory partition with password-locked Secured Silicon Sector. Use Value: Hardware-enforced WP# + password sector protection prevents unauthorized firmware modification during remote diagnostics or update sessions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar burst-mode Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29CL016J1JDGH017 | 3.0–3.6 V supply range; identical density, timing, and feature set but higher VCC tolerance | Used where system power rails are 3.3 V only, not mixed 2.5/3.3 V domains | Select when board-level VCC is fixed at 3.3 V and no 2.5 V regulation exists |
| MX29LV160ETTI-70G | 3.0 V supply; lacks simultaneous read/write, burst mode, and VersatileI/O™; 70 ns async access only | Suitable for cost-sensitive non-automotive consumer applications without real-time update requirements | Choose only if zero-latency background operations and automotive qualification are not required |
Compared with S29CL016J1JDGH017, this part offers lower VCC compatibility for 2.5 V systems but shares identical timing, protection, and KGD packaging; versus MX29LV160ETTI-70G, it delivers deterministic real-time performance via dual-bank architecture and synchronous burst - essential for ASIL-compliant automotive firmware.
Availability
S29CD016J1JDGH017 is available at Aetrix Electronics and suitable for automotive ECU design, ADAS camera modules, and telematics control units requiring stable component supply across extended product lifecycles.
Supply support for S29CD016J1JDGH017 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Spansion LLC was a joint venture between AMD and Fujitsu, specializing in high-reliability NOR Flash memory for automotive and industrial applications before its acquisition by Cypress Semiconductor in 2015.
This device belongs to the S29CD-J series of burst-mode, dual-bank Flash memories designed specifically for zero-latency firmware execution and secure over-the-air updates in automotive electronic control units.
FAQ
Is S29CD016J1JDGH017 a packaged IC or bare die?
S29CD016J1JDGH017 is a Known Good Die (KGD) - supplied as an unpackaged silicon die with aluminum bond pads, intended for integration into custom modules, multi-chip packages, or flip-chip assemblies. It does not include leadframe, molding compound, or standard surface-mount packaging.
What does "Dual Boot Sector Configuration" mean for system design?
Dual Boot Sector Configuration provides separate top and bottom 8 KB protected sectors that can store independent boot images - enabling fail-safe firmware recovery. During power-up, the host processor selects boot source via hardware strapping or register setting, allowing verified fallback execution if main firmware is corrupted.
How does VersatileI/O™ (VCCQ) affect interface design?
VersatileI/O™ decouples I/O voltage (VCCQ = 1.65–2.75 V) from core VCC (2.5–2.75 V), permitting direct connection to 1.8 V microcontrollers without external level shifters. This reduces BOM count, PCB area, and signal integrity risk in space-constrained automotive modules.
Can S29CD016J1JDGH017 be used in new designs given its "Advance Information" status?
Yes - though labeled "Advance Information" in its 2006 supplement, this part entered full production and was widely adopted in automotive platforms through 2012. Its qualification data, reliability testing, and field history confirm suitability for new designs targeting long-lifecycle automotive applications with documented Spansion/Cypress support channels.
S29CD016J1JDGH017 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- CD-J
- Package/Case:
- Die
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 16Mbit
- Memory Organization:
- 512K x 32
- Memory Interface:
- Parallel
- Clock Frequency:
- 40 MHz
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 54 ns
- Voltage - Supply:
- 1.65V ~ 2.75V
- Operating Temperature:
- -40°C ~ 145°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Die
S29CD016J1JDGH017 FAQ
1.How can I place an order for S29CD016J1JDGH017 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29CD016J1JDGH017 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29CD016J1JDGH017 reliable?
The price and inventory of S29CD016J1JDGH017 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29CD016J1JDGH017 is usually 5 days.
3.What payment methods are accepted for S29CD016J1JDGH017?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29CD016J1JDGH017 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29CD016J1JDGH017?
S29CD016J1JDGH017 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29CD016J1JDGH017 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29CD016J1JDGH017?
For technical support, including S29CD016J1JDGH017 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29CD016J1JDGH017 requirements.
6.How does Aetrix verify that S29CD016J1JDGH017 is sourced from the original manufacturer or authorized distributors?
All S29CD016J1JDGH017 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29CD016J1JDGH017 meets industry standards.
7.What is the process for return or replacement of S29CD016J1JDGH017?
All S29CD016J1JDGH017 units undergo pre-shipment inspection (PSI). If there is an issue with S29CD016J1JDGH017, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29CD016J1JDGH017 part is unused and in its original packaging.
Return procedure for S29CD016J1JDGH017:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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