My Inquiry
My Account
Infineon Technologies S29CD016J1JQFM010
- Part No.:
- S29CD016J1JQFM010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 80-BQFP
- Datasheet:
-
S29CD016J1JQFM010.pdf
- Description:
- IC FLASH 16MBIT PAR 80PQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,185
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29CD016J1JQFM010 from Cypress Semiconductor is a 16 Mbit (512k × 32-bit), 2.6 V single-supply burst-mode Flash memory with simultaneous read/write capability across two independent banks, dual boot sector architecture (top/bottom), and VersatileI/O™ support (1.65–3.6 V). It operates at up to 66 MHz synchronous burst speed with 54 ns asynchronous access time and targets automotive infotainment boot code storage.
For engineers reviewing the S29CD016J1JQFM010 datasheet, S29CD016J1JQFM010 pinout, S29CD016J1JQFM010 application, or S29CD016J1JQFM010 equivalent, key selection criteria include dual-bank zero-latency operation, industrial/extended temperature support (–40 °C to +125 °C), JEDEC-standard command set compatibility, CFI compliance, and hardware write protection for outermost sectors.
Technical Context
This device implements a dual-bank floating-gate Flash architecture fabricated in 110 nm process, enabling true concurrent read and write operations without arbitration delay. Each bank has independent address/data paths and supports autonomous erase/program cycles while the other bank serves read requests.
The synchronous burst interface uses CLK, ADV#, and WAIT#/IND# signals to deliver linear 2/4/8-double-word bursts with wrap-around addressing. The VersatileI/O™ input (VIO) decouples I/O voltage from core VCC (2.5–2.75 V), allowing direct interfacing with 1.8 V, 2.5 V, or 3.3 V controllers without level shifters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (512k × 32-bit) - provides sufficient space for dual-boot firmware images in automotive ECUs. |
| Supply Voltage (VCC) | 2.5 V to 2.75 V - single low-voltage rail simplifies power design and reduces system-level noise coupling. |
| Burst Clock Frequency | 66 MHz - enables 264 MB/s peak throughput in continuous burst mode for fast boot loading. |
| Asynchronous Access Time | 54 ns - meets timing requirements for legacy microcontroller interfaces without wait states. |
| Data Retention | 20 years (typical) - validated for long-life automotive applications with extended thermal cycling exposure. |
| Erase Endurance | 1 million cycles per sector - supports field firmware updates over full vehicle lifetime. |
| Operating Temperature | –40 °C to +125 °C - qualified for under-hood and transmission control unit environments. |
Pinout & Package
Package: 80-pin Plastic Quad Flat Package (PQFP), 24 × 24 mm body, 0.65 mm pitch, Pb-free option available.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A18–A0 | Address Input | 19-bit address bus (A18–A0) for 512k-word addressing; A9 supports 12 V autoselect detection. |
| DQ31–DQ0 | Bi-directional Data Bus | 32-bit parallel data path supporting x32 burst transfers and JEDEC-compliant command execution. |
| CE#, OE#, WE# | Chip/Output/Write Enable | Asynchronous control inputs compatible with standard SRAM timing; no clock dependency required. |
| RY/BY# | Ready/Busy Output | Open-drain status signal indicating internal operation completion; requires external pull-up for system handshake. |
| WP# | Hardware Write Protect | Active-low pin disabling program/erase in two outermost large-bank sectors - prevents accidental corruption of critical boot code. |
| ACC | Acceleration Input | Accepts VHH (12 V) to reduce factory programming time; tied to VSS/VCC when unused. |
| VIO | I/O Supply Reference | Independent voltage reference (1.65–3.6 V) enabling mixed-voltage system integration without level translators. |
Key Features
| Feature | Design Value |
|---|---|
| Dual Bank Simultaneous Read/Write | Zero-latency concurrent access allows real-time firmware update while executing active code - eliminates reboot requirement during OTA updates. |
| Dual Boot Sector Architecture | Top and bottom boot configurations enable fail-safe recovery: one sector holds active firmware, the other stores validated backup image. |
| Secured Silicon Sector | Factory- or customer-lockable 128-byte region stores cryptographic keys or calibration data immune to field erase commands. |
| Advanced Sector Protection | Persistent and password-based protection methods prevent unauthorized reprogramming - essential for ASIL-B/C functional safety compliance. |
| Common Flash Interface (CFI) | Standardized query table enables automatic driver detection and configuration by bootloader software - reduces BSP porting effort. |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
|
Use Scenario: Storing primary and backup boot firmware in an ISO 26262-compliant powertrain ECU requiring ASIL-B fault containment. IC Role / Device Role / Timing Role: Dual-boot Flash memory providing atomic firmware swap and hardware-protected sector locking for safe update rollback. Use Value: Enables certified over-the-air updates without compromising runtime code integrity or violating safety shutdown timing constraints. |
Use Scenario: Holding programmable logic controller firmware and configuration data in harsh factory-floor environments with wide temperature swings. IC Role / Device Role / Timing Role: High-reliability nonvolatile storage with 1M-cycle endurance and –40 °C to +125 °C operation for unattended 24/7 operation. Use Value: Eliminates need for external EEPROM or battery-backed SRAM, reducing BOM count and field failure modes from capacitor aging. |
| Telematics Control Unit (TCU) | Medical Diagnostic Imaging Boot Loader |
|
Use Scenario: Hosting secure boot loader and cellular modem firmware in a connected vehicle TCU subject to frequent remote updates. IC Role / Device Role / Timing Role: Burst-mode Flash with CFI support and VersatileI/O™ enabling seamless interface with 1.8 V application processor and 3.3 V radio subsystem. Use Value: Reduces boot latency by 40% vs. legacy parallel NOR, accelerating network registration after cold start. |
Use Scenario: Storing FDA-cleared diagnostic imaging boot firmware in portable ultrasound equipment requiring data retention over 15+ year service life. IC Role / Device Role / Timing Role: 20-year data retention-rated Flash with hardware write protection guarding against accidental overwrite during service technician reflash. Use Value: Meets IEC 62304 Class C software lifecycle requirements without periodic refresh or checksum validation overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar burst-mode Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29CL016J1JQFM010 | 3.3 V supply (3.0–3.6 V) instead of 2.6 V; identical pinout, timing, and feature set. | Used where main system rail is 3.3 V and VIO is not needed for mixed-voltage signaling. | Select when board-level power architecture already delivers stable 3.3 V and no 1.8 V interface is present. |
| MX29LV160ETTI-70G | Single-bank 16 Mbit Flash; no simultaneous read/write; 70 ns access; 3.0–3.6 V only; lacks CFI and burst mode. | Legacy designs with simple boot ROM replacement needs and no OTA update requirements. | Choose only for cost-sensitive, non-safety-critical applications lacking concurrent operation or field update demands. |
Compared with S29CL016J1JQFM010, this part offers lower VCC noise sensitivity and better compatibility with 2.5 V logic families; versus MX29LV160ETTI-70G, it delivers 3× faster burst throughput and certified dual-bank reliability for functional safety systems.
Availability
S29CD016J1JQFM010 is available at Aetrix Electronics and suitable for automotive engine control units, industrial PLCs, telematics control units, and medical diagnostic imaging systems requiring stable component supply across extended product lifecycles.
Supply support for S29CD016J1JQFM010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability semiconductor solutions for automotive, industrial, and IoT applications, with emphasis on functional safety and long-term supply stability.
The S29CD-J series targets automotive-grade embedded Flash memory needs, specifically engineered for zero-latency dual-bank operation, extended temperature resilience, and ASIL-compliant firmware storage in safety-critical ECUs.
FAQ
What is the purpose of the ACC pin on S29CD016J1JQFM010?
The ACC (Acceleration) pin accepts a 12 V input during factory programming to reduce internal erase and program times by enabling higher tunneling voltages. In end-user systems, it must be tied to VSS or VCC; leaving it floating may cause undefined behavior or increased power consumption during standby.
Does S29CD016J1JQFM010 support both top-boot and bottom-boot configurations?
Yes - the 16th character in the ordering code determines boot sector orientation: '0' = top boot with simultaneous operation, '1' = bottom boot with simultaneous operation. The S29CD016J1JQFM010 suffix 'M' indicates extended temperature range, and '010' confirms top-boot configuration per Cypress valid combinations table.
How does the VersatileI/O™ feature benefit system design?
VersatileI/O™ allows independent VIO supply (1.65–3.6 V) while maintaining 2.5–2.75 V VCC, enabling direct connection to 1.8 V microcontrollers or FPGAs without external level shifters. This reduces PCB layer count, signal integrity risk, and BOM cost in mixed-voltage automotive modules.
Can S29CD016J1JQFM010 replace S29CD016J1JQFI010 in existing designs?
Yes - both share identical pinout, timing, and electrical specifications; the only difference is temperature grade: 'M' denotes –40 °C to +125 °C (extended), while 'I' is –40 °C to +85 °C (industrial). No layout or firmware changes are required for migration to the extended grade.
S29CD016J1JQFM010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- CD-J
- Package/Case:
- 80-BQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 16Mbit
- Memory Organization:
- 512K x 32
- Memory Interface:
- Parallel
- Clock Frequency:
- 40 MHz
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 54 ns
- Voltage - Supply:
- 1.65V ~ 2.75V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 80-PQFP (14x20)
S29CD016J1JQFM010 FAQ
1.How can I place an order for S29CD016J1JQFM010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29CD016J1JQFM010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29CD016J1JQFM010 reliable?
The price and inventory of S29CD016J1JQFM010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29CD016J1JQFM010 is usually 5 days.
3.What payment methods are accepted for S29CD016J1JQFM010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29CD016J1JQFM010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29CD016J1JQFM010?
S29CD016J1JQFM010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29CD016J1JQFM010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29CD016J1JQFM010?
For technical support, including S29CD016J1JQFM010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29CD016J1JQFM010 requirements.
6.How does Aetrix verify that S29CD016J1JQFM010 is sourced from the original manufacturer or authorized distributors?
All S29CD016J1JQFM010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29CD016J1JQFM010 meets industry standards.
7.What is the process for return or replacement of S29CD016J1JQFM010?
All S29CD016J1JQFM010 units undergo pre-shipment inspection (PSI). If there is an issue with S29CD016J1JQFM010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29CD016J1JQFM010 part is unused and in its original packaging.
Return procedure for S29CD016J1JQFM010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29CD016J1JQFM010 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
