Infineon Technologies S29CD016J1MDGH114

Overview

S29CD016J1MDGH114 from Spansion LLC is a 16 Mbit (512K × 32-bit) 2.5 V–2.75 V single-supply burst-mode Flash memory IC with simultaneous read/write capability across two independent banks, 56 MHz synchronous operation, and dual boot sector architecture - deployed in automotive infotainment and engine control units requiring zero-latency background erase.

For engineers reviewing the S29CD016J1MDGH114 datasheet, S29CD016J1MDGH114 pinout, S29CD016J1MDGH114 application, or S29CD016J1MDGH114 equivalent, key selection criteria include 2.6 V-only operation, VersatileI/O™ support for 1.65 V–VCC I/O, JEDEC CFI compliance, 100,000 program/erase cycles per sector, and hardware WP# protection of outermost large-bank sectors.

Technical Context

This Known Good Die (KGD) Flash device uses 110 nm Floating Gate technology and implements a dual-bank architecture enabling true concurrent read and write operations without latency - one bank executes erase or program while the other serves burst reads. It supports linear 2/4/8-double-word burst modes with wrap-around and integrates a dedicated CLK input and ADV# signal for synchronous timing control.

The device features three sector protection methods: Persistent (default), Password-based, and hardware WP#-enabled locking of two 8 KB outermost sectors in the large bank. Its RY/BY# output, DQ7 polling, and DQ6 toggle bits provide real-time status feedback during program/erase, and RESET# terminates any active operation to restore array-read state.

Key Specifications

Pinout & Package

Package: Known Good Die (KGD) - bare die format supplied in Gel-Pak/Waffle Pack or embossed tape; no leadframe or molded body; requires flip-chip or wire-bond assembly.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar burst-mode Flash memory applications.

Compared with S29CD016J1MDGH114, the Cypress alternative trades dual-bank concurrency for broader voltage tolerance, while the Macronix part sacrifices speed and interface sophistication for cost-sensitive 16-bit embedded use - neither matches the 2.6 V, zero-latency, CFI-compliant feature set required for modern automotive Flash applications.

Availability

S29CD016J1MDGH114 is available at Aetrix Electronics and suitable for automotive ECU development, ADAS firmware storage, and telematics control unit design requiring stable component supply across extended temperature and high-reliability lifecycles.

Supply support for S29CD016J1MDGH114 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Spansion LLC was a joint venture between AMD and Fujitsu, specializing in NOR Flash memory solutions for automotive, industrial, and networking applications before its acquisition by Cypress Semiconductor in 2015.

The S29CD016J series belongs to Spansion's KGD burst-mode Flash product line, engineered specifically for automotive-grade code storage where zero-latency background erase, dual-boot redundancy, and 145°C operation are mandatory.

FAQ

Is S29CD016J1MDGH114 a packaged IC or bare die?

S29CD016J1MDGH114 is a Known Good Die (KGD) - supplied as unpackaged silicon in Gel-Pak, Waffle Pack, or embossed tape formats. It requires wire-bond or flip-chip assembly onto substrates or leadframes and is not a ready-to-mount surface-mount component.

What does "1MDGH114" in the part number indicate?

The suffix "1MDGH114" denotes Spansion's internal KGD ordering code: '1M' = 16 Mbit density, 'D' = S29CD-J series (2.6 V), 'GH' = Gel-Pak packaging, and '114' specifies die revision and test grade per Spansion's KGD qualification flow documented in S29CD016J_KGD_A1.

Does this device support standard JEDEC programming tools?

Yes - the S29CD016J1MDGH114 implements the JEDEC 42.4 command set and is programmable in standard EPROM programmers. Its command register accepts microprocessor-style write cycles, and Unlock Bypass mode reduces programming overhead by halving required write commands per double word.

Can the Secured Silicon Sector be reprogrammed after factory lock?

No - the 256-byte Secured Silicon Sector is one-time-programmable (OTP). Once locked by the factory or customer via the OTP programming sequence, its contents cannot be altered. This ensures permanent storage of cryptographic keys or calibration constants immune to field overwrite.