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Infineon Technologies S29CD016J1MQAM113

Part No.:
S29CD016J1MQAM113
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
80-BQFP
Datasheet:
AetrixS29CD016J1MQAM113.pdf
Description:
IC FLASH 16MBIT PAR 56MHZ 80PQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,207

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Product details

Overview

S29CD016J1MQAM113 from Cypress Semiconductor is a 16 Mbit (512k × 32-bit), 2.6 V single-supply, dual-boot burst-mode Flash memory with simultaneous read/write capability across two independent banks. It operates at up to 66 MHz synchronous burst speed, supports JEDEC-standard command set and Common Flash Interface (CFI), and features VersatileI/O™ for 1.65–3.6 V I/O compatibility. Used in automotive engine control units for firmware storage with zero-latency background updates.

For engineers reviewing the S29CD016J1MQAM113 datasheet, S29CD016J1MQAM113 pinout, S29CD016J1MQAM113 application, or S29CD016J1MQAM113 equivalent, key selection criteria include dual-bank concurrent operation, 2.6 V core supply, industrial/extended temperature support (–40 °C to +125 °C), and PQFP-80 packaging with hardware write protection on outermost sectors.

Technical Context

This device implements a floating-gate 110 nm process with separate address/data buses per bank, enabling true zero-latency simultaneous read from one bank while programming or erasing the other. Its burst interface supports linear 2-, 4-, and 8-double-word wrap-around modes, controlled via configuration register and ADV#-triggered address loading.

The architecture includes dedicated state control logic for embedded erase/program algorithms, RY/BY# status signaling, suspend/resume commands, and dual-sector protection methods-persistent bits and password-based locking-applied independently to the secured silicon sector and user banks.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 16 Mbit (512k × 32-bit) - provides sufficient space for boot code + application firmware in compact ECU designs
Supply Voltage (VCC) 2.5 V to 2.75 V - single low-voltage rail simplifies power design and reduces system-level noise coupling
Burst Clock Frequency 66 MHz - enables 8 ns synchronous burst access time (tBACC), meeting real-time firmware fetch requirements
Data Bus Width x32 - matches 32-bit microcontroller interfaces without glue logic or data multiplexing
Operating Temperature –40 °C to +125 °C - qualified for under-hood automotive environments per AEC-Q100 stress test profile
Cycling Endurance 1 million program/erase cycles per sector - supports field firmware updates over full vehicle lifetime
Data Retention 20 years (typical) - ensures long-term reliability of calibration data and security keys without refresh

Pinout & Package

Package: 80-pin Plastic Quad Flat Package (PQFP), 20.0 mm × 14.0 mm body, 0.65 mm pitch, lead-free (RoHS-compliant).

Pin/Terminal Circuit Role Design Meaning
A18–A0 Address Input 19-bit address bus for 512k-word addressing; A9 accepts 12 V for autoselect mode entry
DQ31–DQ0 Bi-directional Data I/O 32-bit parallel data path supporting burst transfers and JEDEC command execution
CE#, OE#, WE# Chip/Output/Write Enable Asynchronous control inputs enabling standard NOR Flash interface timing with microcontrollers
RY/BY# Open-drain Status Output Indicates device readiness (VOH) or active internal operation (VOL); requires external pull-up resistor
WP# Hardware Write Protect At VIL, disables program/erase in two outermost sectors of large bank-prevents accidental corruption of boot code
ACC Acceleration Input At VHH (12 V), reduces factory programming time; tied to VSS/VCC when unused
CLK, ADV#, IND#, WAIT# Burst Timing Control Enable synchronous burst reads: CLK drives internal timing, ADV# latches address, IND#/WAIT# signal burst completion

Key Features

Feature Design Value
Dual Boot Sector Architecture Top and bottom boot configurations allow fail-safe firmware recovery-switching between primary and backup images without external intervention
Simultaneous Read/Write Zero-latency concurrent operations across independent banks eliminate CPU stall during background firmware updates
Secured Silicon Sector Factory- or customer-lockable 2 kB region stores cryptographic keys or calibration data with tamper-resistant access control
Advanced Sector Protection Persistent lock bits and password-based dynamic protection enable layered security policies for production and service modes
VersatileI/O™ Interface I/O voltage range 1.65–3.6 V allows direct interfacing with mixed-voltage SoCs without level shifters

Applications

Automotive Engine Control Unit (ECU) Industrial PLC Firmware Storage

Use Scenario: Storing boot loader and main application firmware in an ISO 26262-compliant powertrain ECU requiring safe firmware updates.

IC Role / Device Role / Timing Role: Non-volatile program memory with dual-bank architecture enabling background reprogramming while executing current code.

Use Value: Eliminates system downtime during OTA updates; 125 °C rating ensures reliability in under-hood thermal environments.

Use Scenario: Holding ladder logic programs and configuration parameters in modular industrial controllers subject to frequent field revisions.

IC Role / Device Role / Timing Role: High-endurance Flash memory supporting >100,000 field update cycles over 15-year product lifecycle.

Use Value: 1M-cycle endurance and 20-year data retention guarantee integrity of mission-critical control logic without periodic refresh.

Medical Diagnostic Imaging System Avionics Display Processor

Use Scenario: Storing FPGA configuration bitstreams and calibration tables in portable ultrasound devices requiring FDA-grade data integrity.

IC Role / Device Role / Timing Role: Secure boot memory with Secured Silicon Sector protecting proprietary image processing algorithms.

Use Value: Password-locked sector prevents unauthorized modification of regulatory-certified firmware components.

Use Scenario: Hosting display firmware and font assets in DO-178C Level A certified cockpit displays where deterministic boot timing is mandatory.

IC Role / Device Role / Timing Role: Burst-mode Flash delivering sub-10 ns access to graphics assets during real-time rendering pipelines.

Use Value: 66 MHz synchronous interface meets hard real-time latency budgets for safety-critical visual feedback.

Equivalent & Alternatives

The following parts are listed as comparable options for similar burst-mode Flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
S29CL016J1MQAM113 3.3 V supply (3.0–3.6 V), same density/timing but incompatible VCC range Used in 3.3 V systems with legacy power rails; lacks 2.6 V low-power advantage Select only if existing board uses 3.3 V core supply and cannot accommodate voltage regulator change
MX29LV160ETTI-90G Single 3.0 V supply, no simultaneous read/write, 90 ns async access only, no CFI support Suitable for cost-sensitive non-automotive applications where background updates are not required Choose only for legacy designs lacking burst interface or dual-bank requirements; lower performance and feature set

Compared with S29CL016J1MQAM113, this part enables lower system power and better noise immunity via 2.6 V operation; versus MX29LV160ETTI-90G, it delivers deterministic background updates and standardized CFI identification-critical for automated firmware deployment tools.

Availability

S29CD016J1MQAM113 is available at Aetrix Electronics and suitable for automotive engine control units, industrial PLCs, medical diagnostic imaging systems, and avionics display processors requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S29CD016J1MQAM113 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for automotive, industrial, and aerospace applications, emphasizing functional safety and long-term supply stability.

The S29CD-J series targets automotive-grade embedded systems needing concurrent firmware execution and update capabilities, built on 110 nm floating-gate technology to meet AEC-Q100 Grade 1 and Grade 0 requirements.

FAQ

What is the purpose of the ACC pin on S29CD016J1MQAM113?

The ACC (Acceleration) pin accepts 12 V to reduce factory programming and erase times by enabling higher internal voltages during those operations. When unused, it must be tied to VSS or VCC-not left floating-to prevent unintended acceleration mode activation and ensure stable operation during normal read/write cycles.

Does S29CD016J1MQAM113 support JEDEC-standard commands?

Yes, S29CD016J1MQAM113 implements the JEDEC JESD21-C (JC42.4) command set for program, erase, and query operations. This ensures interoperability with standard Flash programming tools and bootloader frameworks that rely on JEDEC-compliant instruction sequences.

How does the dual-boot sector configuration work in practice?

The dual-boot architecture provides physically separate top and bottom sector groups, each containing boot code. The boot sector option (0 = top, 1 = bottom) is selected at order time and fixed in silicon. During reset, the device boots from the designated sector, allowing field-upgradable fallback images without external logic.

Can S29CD016J1MQAM113 operate in asynchronous mode only?

Yes-S29CD016J1MQAM113 supports full asynchronous operation using CE#, OE#, and WE# without CLK or ADV#. Maximum asynchronous access time is 54 ns (tACC). The synchronous burst mode is optional and activated only when CLK is driven and burst configuration registers are set.

S29CD016J1MQAM113 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
CD-J
Package/Case:
80-BQFP
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
16Mbit
Memory Organization:
512K x 32
Memory Interface:
Parallel
Clock Frequency:
56 MHz
Write Cycle Time - Word, Page:
60ns
Access Time:
54 ns
Voltage - Supply:
1.65V ~ 2.75V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
80-PQFP (14x20)

S29CD016J1MQAM113 FAQ

1.How can I place an order for S29CD016J1MQAM113 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29CD016J1MQAM113 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29CD016J1MQAM113 reliable?

The price and inventory of S29CD016J1MQAM113 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29CD016J1MQAM113 is usually 5 days.

3.What payment methods are accepted for S29CD016J1MQAM113?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29CD016J1MQAM113 transactions.

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4.How is shipping managed for S29CD016J1MQAM113?

S29CD016J1MQAM113 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29CD016J1MQAM113 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29CD016J1MQAM113?

For technical support, including S29CD016J1MQAM113 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29CD016J1MQAM113 requirements.

6.How does Aetrix verify that S29CD016J1MQAM113 is sourced from the original manufacturer or authorized distributors?

All S29CD016J1MQAM113 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29CD016J1MQAM113 meets industry standards.

7.What is the process for return or replacement of S29CD016J1MQAM113?

All S29CD016J1MQAM113 units undergo pre-shipment inspection (PSI). If there is an issue with S29CD016J1MQAM113, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29CD016J1MQAM113 part is unused and in its original packaging.

Return procedure for S29CD016J1MQAM113:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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