Infineon Technologies S29CL032J0RFFM033
- Part No.:
- S29CL032J0RFFM033
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 80-LBGA
- Datasheet:
-
S29CL032J0RFFM033.pdf
- Description:
- IC FLASH 32MBIT PAR 75MHZ 80FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,632
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29CL032J0RFFM033 from Cypress Semiconductor is a 32 Mbit (1M × 32-bit) 3.3 V simultaneous-read/write burst flash memory with dual boot sector architecture, fabricated in 110 nm floating gate technology. It supports zero-latency concurrent operations across two independent banks, delivers 75 MHz synchronous burst access (8 ns tBACC), and features VersatileI/O™ (1.65–3.6 V), secured silicon sector, and CFI-compliant command set for automotive-grade embedded storage.
For engineers reviewing the S29CL032J0RFFM033 datasheet, S29CL032J0RFFM033 pinout, S29CL032J0RFFM033 application, or S29CL032J0RFFM033 equivalent, key selection criteria include simultaneous bank operation capability, extended temperature support (–40 °C to +125 °C), 1 million program/erase cycles per sector, hardware write protection on outermost large-bank sectors, and PQFP/BGA package compatibility for automotive infotainment and ADAS control modules.
Technical Context
This device implements a dual-bank architecture with physically separate address/data paths enabling true concurrent read and write-no arbitration or latency penalty between banks. Each bank uses independent X/Y decoders, latches, and state control logic, with dedicated ADV#, CE#, OE#, and WE# handling per bank in burst mode.
The synchronous interface relies on CLK-driven burst addressing with programmable initial delay (4–5 clock cycles), linear wrap-around burst lengths (2/4/8 double words), and RY/BY# open-drain status signaling. The VersatileI/O™ input (VIO) allows I/O voltage independence from VCC, supporting mixed-voltage system interfacing without level shifters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 32 Mbit (1,048,576 × 32-bit), enabling full firmware image storage for mid-tier automotive ECUs |
| Supply Voltage | 3.0–3.6 V VCC; supports stable operation across automotive battery transients without external regulation |
| Burst Clock Speed | 75 MHz max (tBACC = 8 ns), delivering 300 MB/s peak throughput in continuous burst mode |
| Simultaneous Operation | Zero-latency concurrent read/write across two independent banks using separate address/data buses |
| Data Retention | 20 years typical at +125 °C, validated for extended-life automotive applications |
| Endurance | 1 million program/erase cycles per sector, sufficient for over-the-air (OTA) update logging |
| Temperature Range | –40 °C to +125 °C (Extended grade), qualified per AEC-Q100 Grade 1 requirements |
Pinout & Package
Package: 80-ball Fortified BGA (11 × 9 mm, 1.0 mm pitch), Pb-free, RoHS-compliant. Pinout defined per Document 002-00948 Rev. *C Section 5.4 (LAD080).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A19–A0 | Address Input | 20-bit address bus (A19–A0); A9 supports 12 V autoselect for factory ID detection |
| DQ31–DQ0 | Bi-directional Data Bus | 32-bit wide data path; supports x32 burst transfers without byte-lane multiplexing |
| CE#, OE#, WE# | Chip/Output/Write Enable | Asynchronous control inputs; CE# enables burst timing relative to CLK, not address setup |
| RY/BY# | Open-Drain Status Output | Indicates internal operation completion (VOL = busy); requires external pull-up for system handshake |
| WP# | Hardware Write Protect | At VIL, permanently disables programming/erasing of two outermost sectors in large bank |
| ACC | Acceleration Input | At VHH (12 V), reduces erase/program time; tied to VSS/VCC when unused |
Key Features
| Feature | Design Value |
|---|---|
| Dual Boot Sector Architecture | Independent top/bottom boot sectors allow fail-safe firmware recovery and dual-image switching |
| Secured Silicon Sector | Factory- or customer-lockable 2 kB region for cryptographic keys or calibration data with persistent protection bits |
| Advanced Sector Protection | Persistent and password-based methods prevent unauthorized firmware modification in field-deployed units |
| Suspend/Resume Commands | Pause active erase/program operations to service high-priority reads-critical for real-time ECU response |
| Common Flash Interface (CFI) | Standardized query table enables automatic driver configuration across toolchains and OS loaders |
Applications
| Automotive Instrument Cluster | ADAS Domain Controller |
|---|---|
|
Use Scenario: Stores calibrated display firmware and real-time graphics assets for digital dashboards with hot-swap update capability. IC Role / Device Role / Timing Role: Dual-bank flash serving as primary nonvolatile code/data store with zero-latency background OTA update while foreground UI remains responsive. Use Value: Concurrent read/write eliminates UI freeze during firmware patching; 125 °C rating ensures reliability behind dashboard glass. |
Use Scenario: Hosts sensor fusion algorithms and camera calibration tables requiring frequent updates under thermal stress. IC Role / Device Role / Timing Role: High-reliability burst flash providing deterministic read latency (<8 ns) and secure sector locking for safety-critical parameters. Use Value: Secured Silicon Sector protects calibration integrity; WP# hardware lock prevents accidental corruption of critical boot sectors. |
| Engine Control Unit (ECU) | Telematics Control Unit (TCU) |
|
Use Scenario: Stores engine map tables and diagnostic logs updated via CAN FD during vehicle operation. IC Role / Device Role / Timing Role: Simultaneous read/write flash enabling real-time logging to one bank while executing control code from the other. Use Value: 1 million endurance cycles support >10 years of daily log writes; CFI compliance simplifies bootloader integration. |
Use Scenario: Holds cellular modem firmware, GNSS assist data, and encrypted OTA update packages. IC Role / Device Role / Timing Role: Secure, high-throughput flash with password-protected sectors isolating carrier-specific binaries from user-accessible partitions. Use Value: Dual boot configuration enables seamless fallback to prior firmware after failed update; VersatileI/O™ eases interface to 1.8 V modem baseband. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar burst-mode flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29CL032J0RFFI033 | Industrial temperature range (–40 °C to +85 °C); identical electrical specs and pinout | Lacks extended-temp qualification; unsuitable for under-hood deployment | Select when cost-sensitive industrial control systems do not require 125 °C operation |
| S29CL032J0PFFM033 | 66 MHz max clock (vs. 75 MHz); same package, voltage, and feature set | Lower burst throughput (264 MB/s vs. 300 MB/s); reduced power consumption during high-frequency operation | Choose for thermally constrained modules where 75 MHz timing margin is unnecessary |
Compared with S29CL032J0RFFM033, the industrial-grade variant trades extended temperature support for lower cost, while the 66 MHz version sacrifices peak bandwidth for improved thermal headroom-both retain identical dual-bank concurrency, security features, and automotive qualification scope except temperature.
Availability
S29CL032J0RFFM033 is available at Aetrix Electronics and suitable for automotive instrument clusters, ADAS domain controllers, and engine control units requiring stable component supply with AEC-Q100-aligned lifecycle assurance.
Supply support for S29CL032J0RFFM033 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and microcontroller solutions for automotive, industrial, and IoT applications, with focus on functional safety and long-term supply stability.
S29CL032J0RFFM033 belongs to the S29CL-J family of burst-mode flash memories engineered specifically for zero-latency concurrent code execution and firmware updates in automotive electronic control units.
FAQ
What is the purpose of the ACC pin on S29CL032J0RFFM033?
The ACC (Acceleration) pin accepts 12 V to accelerate internal erase and program operations by boosting internal charge pump voltage. When unused, it must be tied to VSS or VCC-floating is prohibited. This pin reduces typical double-word programming time from 18 µs to <10 µs and sector erase from 1.0 s to ~700 ms under accelerated conditions.
How does the dual-boot sector configuration function in practice?
The dual-boot architecture provides two independent boot sectors-one at the top and one at the bottom of the memory map-each configurable as protected or unprotected. During reset, the device boots from the sector selected via hardware strap or configuration register. This enables safe firmware updates: new code writes to the inactive sector while the system runs from the active one, then switches vectors post-verification.
Can S29CL032J0RFFM033 operate with VIO different from VCC?
Yes. The VersatileI/O™ (VIO) input allows I/O buffer voltage to be set independently from VCC (3.0–3.6 V). VIO supports 1.65–3.6 V, enabling direct interface to 1.8 V or 2.5 V logic without external level shifters. This is confirmed in DC Characteristics Table 14.1 and supported across all operating modes including burst read and command execution.
Is the RY/BY# signal compatible with standard microprocessor wait-state logic?
Yes. RY/BY# is an open-drain output requiring an external pull-up resistor. When high (VOH), the device is ready for read commands or data access; when low (VOL), it signals active internal operation (e.g., erase, program, or reset). This directly interfaces with standard microprocessor WAIT# or READY inputs, eliminating need for polling or software delays in timing-critical systems.
S29CL032J0RFFM033 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- CL-J
- Package/Case:
- 80-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 32Mbit
- Memory Organization:
- 1M x 32
- Memory Interface:
- Parallel
- Clock Frequency:
- 75 MHz
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 54 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 80-FBGA (13x11)
S29CL032J0RFFM033 FAQ
1.How can I place an order for S29CL032J0RFFM033 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29CL032J0RFFM033 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29CL032J0RFFM033 reliable?
The price and inventory of S29CL032J0RFFM033 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29CL032J0RFFM033 is usually 5 days.
3.What payment methods are accepted for S29CL032J0RFFM033?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29CL032J0RFFM033 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29CL032J0RFFM033?
S29CL032J0RFFM033 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29CL032J0RFFM033 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29CL032J0RFFM033?
For technical support, including S29CL032J0RFFM033 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29CL032J0RFFM033 requirements.
6.How does Aetrix verify that S29CL032J0RFFM033 is sourced from the original manufacturer or authorized distributors?
All S29CL032J0RFFM033 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29CL032J0RFFM033 meets industry standards.
7.What is the process for return or replacement of S29CL032J0RFFM033?
All S29CL032J0RFFM033 units undergo pre-shipment inspection (PSI). If there is an issue with S29CL032J0RFFM033, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29CL032J0RFFM033 part is unused and in its original packaging.
Return procedure for S29CL032J0RFFM033:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29CL032J0RFFM033 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

