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Infineon Technologies S29GL01GP11TFCR10

Part No.:
S29GL01GP11TFCR10
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
56-TFSOP (0.724", 18.40mm Width)
Datasheet:
AetrixS29GL01GP11TFCR10.pdf
Description:
IC FLASH 1GBIT PARALLEL 56TSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,472

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Product details

Overview

S29GL01GP11TFCR10 from Cypress Semiconductor is a 1 Gbit (128 Mbyte), 3.0 V-only Page Flash memory IC fabricated on 90 nm MirrorBit process technology, featuring 25 ns page access time, 110 ns random access time, uniform 64 Kword sectors (1024 total), and 32-word write buffer for accelerated multi-word programming. It operates across industrial temperature range (–40°C to +85°C) in a Pb-free 64-ball Fortified BGA (LAA064) package and is used in embedded boot code storage for networking routers and industrial controllers.

For engineers reviewing the S29GL01GP11TFCR10 datasheet, S29GL01GP11TFCR10 pinout, S29GL01GP11TFCR10 application, or S29GL01GP11TFCR10 equivalent, key selection criteria include VersatileI/O™ voltage flexibility (VIO = 1.65–VCC), Secured Silicon Sector with factory-programmable 128-word serial number, CFI compliance, and hardware WP#/ACC acceleration support for high-throughput production programming.

Technical Context

This device implements a synchronous/non-volatile memory architecture with dual-mode data bus (word/byte via BYTE#), hardware reset (RESET#), and Ready/Busy# status signaling. Its internal state machine executes embedded erase and program algorithms, supported by unlock bypass and suspend/resume commands for real-time system responsiveness.

The 90 nm MirrorBit cell enables 100,000 erase cycles per sector and 20-year data retention. VersatileI/O™ decouples I/O voltage (VIO) from core supply (VCC), allowing interface compatibility with 1.8 V, 2.5 V, or 3.3 V logic while maintaining 3.0 V core operation - critical for mixed-voltage SoC designs.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 1 Gbit (128 Mbyte), organized as 1024 × 64 Kword uniform sectors
Access Time 110 ns random access (Regulated VCC = 3.0–3.6 V); 25 ns page access enables burst reads
Write Buffer Size 32 words (64 bytes) per operation - reduces effective programming time vs. single-word writes
Endurance & Retention 100,000 erase cycles per sector; 20-year data retention at 85°C
Supply Voltages VCC = 2.7–3.6 V; VIO = 1.65–VCC - supports mixed-voltage host interfacing
Operating Temp Industrial grade: –40°C to +85°C - qualified for rugged embedded environments
Protection Features Persistent sector protection, password-based locking, and WP#/ACC hardware acceleration

Pinout & Package

Package: 64-ball Fortified BGA (LAA064), 11 mm × 13 mm, 1.0 mm pitch, Pb-free, top-side marking omits "S29" and packing type per datasheet note.

Pin/Terminal Circuit Role Design Meaning
A25–A0 Address Inputs 26-bit address bus (A25–A0) for full 1 Gbit addressing; A-1 multiplexed on DQ15 in byte mode
DQ15–DQ0 Data I/O 16-bit bidirectional data bus; DQ15/A-1 serves as LSB address in byte mode (BYTE# = VIL)
CE#, OE#, WE# Control Inputs Standard chip-enable, output-enable, and write-enable signals - fully compatible with standard NOR Flash timing
RY/BY#, RESET#, WP#/ACC Status & Control RY/BY# indicates algorithm progress; RESET# forces read mode; WP#/ACC enables VHH-accelerated programming or sector lock
VCC, VIO, VSS, BYTE#, NC Power & Config VIO sets I/O voltage level independently; BYTE# selects word/byte data width; NC pins are unconnected

Key Features

Feature Design Value
VersatileI/O™ Interface VIO range 1.65–VCC allows seamless integration with 1.8 V/2.5 V/3.3 V logic without level shifters
Secured Silicon Sector 128-word factory- or customer-programmable serial number region, lockable for secure device identification
Write Buffer Acceleration 32-word buffer cuts multi-word programming time by >70% vs. standard command sequences
Advanced Sector Protection Combines persistent lock bits and password methods to prevent accidental or malicious firmware overwrite
Suspend/Resume Capability Allows read access during erase/program operations - essential for real-time interrupt handling in embedded OS

Applications

Networking Equipment Boot Storage Industrial PLC Firmware Storage

Use Scenario: Storing boot loader and firmware images in Layer 3 switches and carrier-grade routers requiring fast, reliable non-volatile code execution.

IC Role / Device Role / Timing Role: Primary NOR Flash for XIP (eXecute-In-Place) boot code with deterministic 25 ns page read latency.

Use Value: 110 ns random access and CFI compliance ensure compatibility with ARM Cortex-A/M series boot ROM interfaces and U-Boot initialization sequences.

Use Scenario: Holding firmware and configuration data in programmable logic controllers deployed in factory automation systems with wide temperature swings.

IC Role / Device Role / Timing Role: Industrial-grade non-volatile memory supporting field firmware updates and secure parameter storage.

Use Value: –40°C to +85°C rating, 100K erase cycles, and hardware WP#/ACC enable robust over-the-air updates in harsh environments.

Medical Imaging System BIOS Avionics Data Logger

Use Scenario: Storing diagnostic BIOS and calibration tables in portable ultrasound and MRI subsystems where data integrity is mission-critical.

IC Role / Device Role / Timing Role: Secure, tamper-resistant boot memory with locked Secured Silicon Sector for regulatory traceability.

Use Value: Factory-programmed 128-word serial number meets FDA 21 CFR Part 11 electronic record requirements for device identity and audit trail.

Use Scenario: Recording flight-critical event logs and configuration snapshots in airborne data acquisition units subject to DO-160 environmental stress.

IC Role / Device Role / Timing Role: High-reliability Flash memory with 20-year data retention and suspend/resume for uninterrupted logging during power transients.

Use Value: Suspend capability allows log writes to continue after interrupt service, preventing data loss during EMI-induced resets.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Page Flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
S29GL01GS11TFI010 Same die, but TSOP-56 package (not BGA); lacks Fortified BGA mechanical robustness and thermal performance Suitable for cost-sensitive consumer boards with space margin; not recommended for high-vibration avionics or medical enclosures Select only if board layout requires through-hole or standard surface-mount footprint and thermal cycling is minimal
MX29GL128FPTI-90G 128 Mbyte, 90 nm process, but no VersatileI/O™ - fixed 3.3 V I/O; no Secured Silicon Sector or WP#/ACC acceleration Lacks secure ID and production acceleration features; limited to basic firmware storage without security or throughput requirements Choose only when legacy 3.3 V-only interface is mandatory and secure serialization or high-volume programming is unnecessary

Compared with S29GL01GP11TFCR10, the TSOP variant trades mechanical reliability and thermal dissipation for footprint simplicity, while the Macronix part sacrifices I/O flexibility, security, and programming speed - making the Cypress BGA version optimal for high-integrity, volume-manufactured embedded systems.

Availability

S29GL01GP11TFCR10 is available at Aetrix Electronics and suitable for networking equipment boot storage, industrial PLC firmware storage, and medical imaging system BIOS requiring stable component supply across extended product lifecycles.

Supply support for S29GL01GP11TFCR10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

The S29GL-P family was designed specifically for embedded systems demanding high-density, low-power, and secure NOR Flash with production-ready features like write acceleration and CFI compatibility - targeting boot code, firmware, and configuration storage.

FAQ

What is the function of the WP#/ACC pin on S29GL01GP11TFCR10?

The WP#/ACC pin serves dual functions: at VIL, it protects the highest or lowest sector from accidental program/erase; at VHH (12 V), it accelerates programming throughput by enabling unlock bypass mode. Internal pull-up ensures safe default (VIH) state when unconnected, preventing unintended lockout during power-up.

Does S29GL01GP11TFCR10 support byte-wide data access?

Yes - asserting BYTE# = VIL configures the device for 8-bit data bus operation, activating DQ0–DQ7 and repurposing DQ15/A-1 as the LSB address input. This mode maintains full 1 Gbit addressability while reducing signal count for microcontroller interfaces with narrow data paths.

How does the Secured Silicon Sector differ from standard flash sectors?

The Secured Silicon Sector is a dedicated 128-word (256-byte) region physically isolated from main array, factory- or customer-programmable with a unique Electronic Serial Number. Once locked, its contents cannot be erased or rewritten - providing immutable device identity for security, traceability, and licensing enforcement.

Can S29GL01GP11TFCR10 operate with VIO = 1.8 V while VCC = 3.3 V?

Yes - VersatileI/O™ explicitly supports VIO = 1.65–VCC, so 1.8 V I/O with 3.3 V core is fully compliant. This eliminates external level shifters when interfacing with 1.8 V FPGAs or low-voltage microcontrollers, reducing BOM cost and PCB complexity without compromising timing or reliability.

S29GL01GP11TFCR10 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-P
Package/Case:
56-TFSOP (0.724", 18.40mm Width)
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
1Gbit
Memory Organization:
128M x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
110ns
Access Time:
110 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
56-TSOP

S29GL01GP11TFCR10 FAQ

1.How can I place an order for S29GL01GP11TFCR10 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL01GP11TFCR10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL01GP11TFCR10 reliable?

The price and inventory of S29GL01GP11TFCR10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GP11TFCR10 is usually 5 days.

3.What payment methods are accepted for S29GL01GP11TFCR10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GP11TFCR10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL01GP11TFCR10?

S29GL01GP11TFCR10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL01GP11TFCR10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL01GP11TFCR10?

For technical support, including S29GL01GP11TFCR10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GP11TFCR10 requirements.

6.How does Aetrix verify that S29GL01GP11TFCR10 is sourced from the original manufacturer or authorized distributors?

All S29GL01GP11TFCR10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GP11TFCR10 meets industry standards.

7.What is the process for return or replacement of S29GL01GP11TFCR10?

All S29GL01GP11TFCR10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GP11TFCR10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL01GP11TFCR10 part is unused and in its original packaging.

Return procedure for S29GL01GP11TFCR10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S29GL01GP11TFCR10 Tags

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