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Infineon Technologies S29GL01GS10DHA013

Part No.:
S29GL01GS10DHA013
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
64-LBGA
Datasheet:
AetrixS29GL01GS10DHA013.pdf
Description:
IC FLASH 1GBIT PARALLEL 64FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,114

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Product details

Overview

S29GL01GS10DHA013 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access and 15 ns page access, and integrates hardware ECC for single-bit error correction-used in boot code storage and firmware execution in industrial control and automotive ECUs.

For engineers reviewing the S29GL01GS10DHA013 datasheet, S29GL01GS10DHA013 pinout, S29GL01GS10DHA013 application, or S29GL01GS10DHA013 equivalent, key selection criteria include its 128-kbyte uniform sector erase, 512-byte programming buffer, Versatile I/O (1.65–VCC), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and TSOP-56/LAA/LAE/VBU package compatibility.

Technical Context

This device implements asynchronous parallel interface logic with dedicated CE#, OE#, and WE# control lines, supporting XIP-capable read operations and embedded program/erase algorithms managed by an on-chip Embedded Algorithm Controller (EAC). Its architecture enables page-mode reads (32-byte aligned, 15 ns subsequent access) and buffer programming of up to 512 bytes per command.

Hardware ECC operates transparently during read cycles, correcting single-bit errors without software intervention; status is reported via status register, data polling, or RY/BY# pin. Sector protection includes volatile/non-volatile lock bits and a separate 1024-byte OTP array with two lockable regions.

Key Specifications

Parameter Value and Actual Design Meaning
Memory density 1 Gb (128 MB), organized as 8,388,608 × 16-bit words - supports full firmware image storage for mid-tier microcontrollers.
Access time 90 ns random access, 15 ns page access - enables deterministic boot timing in real-time systems.
Supply voltage VCC = 2.7–3.6 V; VIO = 1.65–VCC - allows interfacing with mixed-voltage SoCs without level shifters.
Programming buffer 512-byte write buffer - reduces effective programming time by 3× vs. single-word writes.
Erase granularity Uniform 128-kbyte sectors - simplifies firmware update partitioning and wear leveling design.
Data retention 20 years at 85°C - meets long-lifecycle requirements for industrial and automotive deployments.
Endurance 100,000 program/erase cycles per sector - supports field firmware updates over product lifetime.

Pinout & Package

Package: 56-pin Thin Small Outline Package (TSOP), 14 mm × 20 mm, standard JEDEC MO-142AB footprint with 0.5 mm pitch.

Pin/Terminal Circuit Role Design Meaning
A0–A25 Address inputs 26-bit address bus; A25 is MSB for 1 Gb density - supports full linear addressing without bank switching.
DQ0–DQ15 Data I/O 16-bit bidirectional data bus; compatible with ARM Cortex-M/A and Power Architecture processors.
CE# Chip enable Active-low chip select; controls device power state and enables multi-device decoding in parallel bus systems.
OE# Output enable Active-low read strobe; decouples output timing from address setup, enabling glueless interface with FPGA/CPLD.
WE# Write enable Active-low write strobe; initiates internal program/erase commands when combined with address/data sequences.
RY/BY# Ready/Busy indicator Open-drain output signals ongoing embedded operation - eliminates need for polling loops in host firmware.
RESET# Hardware reset Active-low asynchronous reset; restores device to known state after power-up or fault recovery.
WP# Write protect Hardware sector lock override; disables program/erase to protected sectors independent of software commands.

Key Features

Feature Design Value
Hardware ECC On-the-fly single-bit error correction with no CPU overhead - ensures boot ROM integrity without external scrubbing logic.
Versatile I/O VIO range 1.65 V to VCC - permits direct connection to 1.8 V, 2.5 V, or 3.3 V host interfaces without voltage translation.
Page-mode read 32-byte aligned access with 15 ns subsequent cycle - accelerates sequential instruction fetch in XIP applications.
Advanced sector protection Volatile and non-volatile lock bits per 128-kbyte sector - enables secure bootloader partitioning and field-upgrade safety.
OTP array 1024-byte one-time-programmable region with two independently lockable zones - stores cryptographic keys or calibration data.

Applications

Industrial PLC Firmware Storage Automotive ECU Boot Memory

Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers with extended temperature operation.

IC Role / Device Role / Timing Role: Non-volatile XIP-capable boot memory providing deterministic 90 ns read latency for hard real-time task initialization.

Use Value: Eliminates external SRAM copy step; supports in-field firmware updates via 128-kbyte sector erase and 512-byte buffered programming.

Use Scenario: Holding certified boot code and safety-critical application firmware in engine control units compliant with AEC-Q100 Grade 2.

IC Role / Device Role / Timing Role: Secure, high-reliability flash memory with hardware ECC and OTP key storage for ASIL-B functional safety compliance.

Use Value: Meets 20-year data retention and 100K-cycle endurance requirements while enabling secure OTA update rollback mechanisms.

Medical Imaging System BIOS Telecom Base Station Configuration

Use Scenario: Hosting diagnostic self-test routines and hardware configuration tables in FDA-cleared imaging equipment.

IC Role / Device Role / Timing Role: Trusted firmware repository with advanced sector protection preventing accidental overwrite of calibration parameters.

Use Value: Dual-lock OTP region stores factory calibration coefficients; non-volatile sector locks prevent runtime corruption during power interruption.

Use Scenario: Storing FPGA bitstreams, DSP firmware, and network protocol stacks in carrier-grade wireless infrastructure.

IC Role / Device Role / Timing Role: High-density parallel flash interfaced directly to PowerPC or ARM-based baseband processors for low-latency configuration loading.

Use Value: 15 ns page access accelerates FPGA reconfiguration; CFI table enables automatic driver detection across multiple hardware revisions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
S29GL01GS10DHV013 Same die, but packaged in 64-ball LAA Fortified BGA (13 mm × 11 mm); no TSOP option. Preferred for space-constrained PCBs where board area is prioritized over manual reworkability. Select when using automated BGA assembly and requiring thermal performance margin over TSOP.
MX29GL128FDTI-90G 128 Mb density (1/8 capacity), 90 ns access, same 3.0 V supply and TSOP-56 package; lacks OTP array and Versatile I/O. Suitable only for legacy designs with smaller firmware footprints and fixed 3.3 V I/O. Choose only if capacity and OTP/ECC features are unnecessary and cost sensitivity outweighs future scalability.

Compared with S29GL01GS10DHA013, the LAA-packaged variant offers superior thermal dissipation and higher pin-count flexibility, while the MX29GL128F lacks critical reliability features (OTP, hardware ECC, Versatile I/O) required for new industrial or automotive designs.

Availability

S29GL01GS10DHA013 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ECU boot memory, and medical imaging system BIOS requiring stable component supply across extended temperature and long-lifecycle programs.

Supply support for S29GL01GS10DHA013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certifications including IATF 16949 and ISO 9001.

The GL-S family targets mission-critical embedded systems demanding XIP capability, long-term data integrity, and AEC-Q100-compliant operation - designed specifically for automotive, industrial, and medical applications where firmware security and endurance are non-negotiable.

FAQ

Does S29GL01GS10DHA013 support execute-in-place (XIP) operation?

Yes, it supports true XIP operation with 90 ns random access and 15 ns page-mode reads, enabling direct CPU instruction fetch from flash without copying to RAM. The architecture includes dedicated address/data latching and asynchronous timing to meet tight timing budgets of ARM Cortex-R and Power Architecture cores.

What is the function of the Versatile I/O (VIO) feature?

Versatile I/O allows independent VIO supply from 1.65 V to VCC, enabling direct interface with 1.8 V, 2.5 V, or 3.3 V host processors without external level shifters. This reduces BOM count and signal integrity risk while maintaining full timing compliance across mixed-voltage system designs.

How does the hardware ECC work during read operations?

Hardware ECC operates transparently on every read: single-bit errors in a 512-bit word are corrected in real time using BCH algorithm, and correction status is reported via ECC status ASO or status register bit. No firmware intervention or additional latency is required - correction occurs within normal read access timing.

Is the 1024-byte OTP array field-programmable and lockable?

Yes, the OTP array is one-time programmable via standard command sequences and supports two independently lockable 512-byte regions. Once locked (via non-volatile bit), a region becomes permanently read-only; unlocking is impossible. This ensures permanent storage of cryptographic keys or calibration data immune to firmware bugs or malware.

S29GL01GS10DHA013 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-S
Package/Case:
64-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
1Gbit
Memory Organization:
64M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
60ns
Access Time:
100 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
64-FBGA (9x9)

S29GL01GS10DHA013 FAQ

1.How can I place an order for S29GL01GS10DHA013 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL01GS10DHA013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL01GS10DHA013 reliable?

The price and inventory of S29GL01GS10DHA013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS10DHA013 is usually 5 days.

3.What payment methods are accepted for S29GL01GS10DHA013?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS10DHA013 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL01GS10DHA013?

S29GL01GS10DHA013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL01GS10DHA013 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL01GS10DHA013?

For technical support, including S29GL01GS10DHA013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS10DHA013 requirements.

6.How does Aetrix verify that S29GL01GS10DHA013 is sourced from the original manufacturer or authorized distributors?

All S29GL01GS10DHA013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS10DHA013 meets industry standards.

7.What is the process for return or replacement of S29GL01GS10DHA013?

All S29GL01GS10DHA013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS10DHA013, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL01GS10DHA013 part is unused and in its original packaging.

Return procedure for S29GL01GS10DHA013:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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