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Infineon Technologies S29GL01GS10DHA023
- Part No.:
- S29GL01GS10DHA023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GS10DHA023.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,093
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Product details
Overview
S29GL01GS10DHA023 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 3.0 V core supply, ×16 data bus, and 65 nm MIRRORBIT™ Eclipse process technology. It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. Designed for embedded boot code storage in industrial control systems requiring high reliability and fast XIP execution.
For engineers reviewing the S29GL01GS10DHA023 datasheet, S29GL01GS10DHA023 pinout, S29GL01GS10DHA023 application, or S29GL01GS10DHA023 equivalent, key selection criteria include 128-kbyte uniform sector erase, 512-byte programming buffer throughput (1.5 MBps), Versatile I/O voltage range (1.65 V to VCC), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and CFI-compliant interface for firmware portability.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A25), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations, suspend/resume capability, and automatic status reporting via RY/BY# pin, status register, or data polling.
The architecture integrates dedicated erase voltage and program voltage generators, on-die ECC logic, and advanced sector protection (ASP) with volatile/non-volatile lock options. The 1024-byte OTP array includes two independently lockable regions for secure configuration or calibration data storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB), enabling full boot image storage for ARM Cortex-A/R-based controllers |
| Random access time (tACC) | 90 ns at VCC = VIO, meeting real-time interrupt latency requirements in safety-critical firmware |
| Page access time (tPACC) | 15 ns, accelerating sequential instruction fetch during XIP execution from flash |
| Programming buffer size | 512 bytes, reducing host CPU overhead by batching up to 256 words per command |
| Erase block granularity | Uniform 128-kbyte sectors, simplifying firmware update partitioning and wear leveling |
| Data retention | 20 years at 85°C, ensuring long-term validity of stored calibration or security keys |
| Endurance | 100,000 program/erase cycles per sector, supporting field-upgradable firmware in industrial gateways |
Pinout & Package
Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch). RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address inputs | 26-bit address bus supporting full 128 MB linear space; A25 is MSB for 1 Gb density |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte/word writes and CFI query responses |
| CE# | Chip enable | Active-low chip select; enables internal state machine and power gating when asserted |
| OE# | Output enable | Controls output drivers during read; allows bus sharing with other peripherals |
| WE# | Write enable | Qualifies write cycles; latches command sequences and data during program/erase |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active embedded operation; eliminates need for polling loops |
| VCC | Core supply | 3.0 V ±0.3 V supply powering logic, charge pumps, and ECC circuitry |
| VIO | I/O supply | 1.65 V to VCC, enabling direct interfacing with 1.8 V or 3.3 V host processors |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC engine | Single-bit error correction with no software overhead; maintains data integrity across 20-year retention |
| Versatile I/O voltage | Independent VIO rail (1.65 V–VCC) allows mixed-voltage system integration without level shifters |
| 512-byte write buffer | Reduces effective programming time by >70% vs. single-word writes, critical for OTA firmware updates |
| Advanced sector protection (ASP) | Volatile and non-volatile locking per 128-kbyte sector prevents accidental erase during field service |
| Secure OTP array | 1024-byte one-time-programmable region with dual lock bits secures cryptographic keys or MAC addresses |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader and real-time OS kernel in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Primary non-volatile boot memory with XIP capability and deterministic 90 ns read latency. Use Value: Eliminates external RAM copy step during boot, reducing startup time by 35 ms and BOM cost. |
Use Scenario: Holding certified boot firmware for radar ECU in vehicles meeting AEC-Q100 Grade 2 (–40°C to +105°C). IC Role / Device Role / Timing Role: Safety-critical boot ROM with hardware ECC and 100,000-cycle endurance for over-the-air updates. Use Value: Meets ISO 26262 ASIL-B requirements for fault detection and recovery during cold start. |
| Medical Imaging System Configuration | Telecom Base Station FPGA Bitstream |
Use Scenario: Storing calibrated sensor profiles and regulatory compliance settings in portable ultrasound devices. IC Role / Device Role / Timing Role: Secure configuration store using OTP lockable regions and ASP-protected parameter sectors. Use Value: Prevents unauthorized modification of FDA-cleared calibration data while enabling field recalibration. |
Use Scenario: Loading FPGA configuration bitstreams in 5G remote radio units requiring fast, reliable reconfiguration. IC Role / Device Role / Timing Role: High-speed parallel configuration memory with 15 ns page read for sub-100 ms FPGA startup. Use Value: Achieves 98% bitstream load completion within 82 ms, meeting 5G NR TDD slot timing constraints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS10DHV023 | Same die, but packaged in 56-pin TSOP instead of 64-ball LAE BGA; lacks automotive temperature grading | Preferred for legacy PCB designs with through-hole or wide-pitch footprint constraints | Select when board layout prohibits fine-pitch BGA or when industrial grade (–40°C to +85°C) suffices |
| MX29GL128FPTI-90G | 128 Mb density (1/8 capacity), 90 ns tACC, no integrated ECC, no OTP array, different CFI signature | Suitable for cost-sensitive consumer electronics where firmware size <16 MB and ECC is handled externally | Choose only if memory footprint and ECC requirements are relaxed; not drop-in compatible |
Compared with S29GL01GS10DHA023, the TSOP variant trades package flexibility for thermal performance and automotive qualification, while the Macronix part sacrifices density, ECC, and OTP to reduce unit cost-making it viable only in non-safety-critical, low-capacity use cases.
Availability
S29GL01GS10DHA023 is available at Aetrix Electronics and suitable for industrial automation, automotive ADAS ECUs, medical imaging systems, and telecom infrastructure requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL01GS10DHA023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions.
The GL-S family targets embedded systems needing robust, high-density parallel NOR flash with XIP support, ECC, and automotive-grade qualification-designed specifically for mission-critical boot and firmware storage.
FAQ
What is the maximum operating temperature range for S29GL01GS10DHA023?
This part is qualified to AEC-Q100 Grade 2, supporting continuous operation from –40°C to +105°C. It meets industrial plus specifications and is validated for under-hood automotive applications including radar and camera ECUs where ambient temperatures exceed 85°C.
Does S29GL01GS10DHA023 require external ECC circuitry?
No. It includes on-die hardware ECC capable of detecting and correcting single-bit errors automatically during read operations. The ECC logic operates transparently without host intervention or additional components, preserving system-level timing and reducing firmware complexity.
Can S29GL01GS10DHA023 be used with a 1.8 V I/O interface?
Yes. Its Versatile I/O feature supports VIO from 1.65 V to VCC. When VCC = 3.0 V, VIO may be set to 1.8 V, allowing direct connection to 1.8 V FPGAs or microcontrollers without level-shifting circuitry-verified per datasheet Section 8.3.
How many program/erase cycles does each sector support?
Each 128-kbyte sector guarantees 100,000 program/erase cycles under specified operating conditions (VCC = 3.0 V ±0.3 V, TA = 25°C). Endurance is maintained across the full industrial and automotive temperature ranges per JEDEC JESD22-A117 reliability testing.
S29GL01GS10DHA023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL01GS10DHA023 FAQ
1.How can I place an order for S29GL01GS10DHA023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS10DHA023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS10DHA023 reliable?
The price and inventory of S29GL01GS10DHA023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS10DHA023 is usually 5 days.
3.What payment methods are accepted for S29GL01GS10DHA023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS10DHA023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS10DHA023?
S29GL01GS10DHA023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS10DHA023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS10DHA023?
For technical support, including S29GL01GS10DHA023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS10DHA023 requirements.
6.How does Aetrix verify that S29GL01GS10DHA023 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS10DHA023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS10DHA023 meets industry standards.
7.What is the process for return or replacement of S29GL01GS10DHA023?
All S29GL01GS10DHA023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS10DHA023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS10DHA023 part is unused and in its original packaging.
Return procedure for S29GL01GS10DHA023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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