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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL01GS10DHI010

Name: S29GL01GS10DHI010
Brand: Infineon Technologies
SKU: S29GL01GS10DHI010
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL01GS10DHI010

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL01GS10DHI010.pdf

Description:: IC FLASH 1GBIT PARALLEL 64FBGA

Quantity:: RFQ Add To RFQ list

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Product details

Overview

S29GL01GS10DHI010 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across industrial temperature range (–40°C to +85°C) and supports sector erase of uniform 128-kbyte sectors in embedded boot code storage applications.

For engineers reviewing the S29GL01GS10DHI010 datasheet, S29GL01GS10DHI010 pinout, S29GL01GS10DHI010 application, or S29GL01GS10DHI010 equivalent, this device delivers deterministic XIP-capable read latency, Versatile I/O support (1.65–VCC), 512-byte write buffer programming, and AEC-Q100 grade 3 qualification - critical for automotive ECU firmware and industrial controller boot memory selection.

Technical Context

The S29GL01GS10DHI010 implements asynchronous parallel interface logic with CE#, OE#, and WE# control signals, supporting both standard word programming and multi-word buffered writes up to 512 bytes. Its internal Embedded Algorithm Controller (EAC) manages autonomous program/erase sequences and status reporting via status register, data polling, or RY/BY# pin.

It features dual-voltage I/O (VIO = 1.65 V to VCC), enabling direct interfacing with 1.8 V, 2.5 V, or 3.3 V host processors without level shifters. Sector protection includes volatile and non-volatile lock bits per 128-kbyte sector, plus a dedicated 1024-byte OTP array with two independently lockable regions for secure configuration storage.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	1 Gb (128 MB), organized as 8,388,608 × 16-bit words - sufficient for full boot image + firmware partitioning in automotive ECUs.
Random Access Time	90 ns at VCC = VIO - enables sub-11 MHz CPU read cycles without wait states in XIP execution.
Page Access Time	15 ns - allows burst reads within 32-byte aligned pages for efficient instruction fetch pipelines.
Write Buffer Size	512 bytes (256 words) - reduces average programming time by >3× vs. single-word writes in firmware update routines.
ECC Support	On-die hardware single-bit error correction - eliminates need for external ECC logic in safety-critical systems.
Endurance & Retention	100,000 program/erase cycles and 20-year data retention - meets long-life requirements for industrial control firmware.
Operating Temp	–40°C to +85°C (Industrial grade) - qualified for under-hood automotive and factory-floor embedded use.
Supply Voltage	VCC = 2.7–3.6 V, VIO = 1.65–VCC - supports mixed-voltage SoC interfaces without external regulators.

Pinout & Package

Package: 56-pin TSOP (Type I, 14 mm × 20 mm, 0.5 mm pitch). Pinout validated per Infineon datasheet Rev. *U, Section 12.1.

Pin/Terminal	Circuit Role	Design Meaning
A0–A25	Address Inputs	26-bit address bus; A25 is MSB for 1 Gb density (8M × 16), enabling full linear addressing without bank switching.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports byte/word writes and 32-byte page reads with no external multiplexing.
CE#	Chip Enable	Active-low chip select; controls device power state and enables low-current standby (100 µA) when deasserted.
OE#	Output Enable	Active-low read strobe; gates output drivers only - does not affect internal timing or status registers.
WE#	Write Enable	Active-low write strobe; initiates command latching and embedded program/erase algorithms when combined with address/data patterns.
RY/BY#	Ready/Busy Output	Open-drain status indicator; low during active program/erase, high when operation complete or in read mode.
RESET#	Hardware Reset	Active-low asynchronous reset; forces device into known state and aborts ongoing operations without data corruption.
VCC	Core Supply	3.0 V nominal core voltage (2.7–3.6 V); powers all logic, memory array, and ECC circuitry.
VIO	I/O Supply	Independent I/O voltage (1.65–VCC); sets input thresholds and output drive strength for flexible host interfacing.
WP#	Write Protect	Hardware sector protection enable; when asserted, prevents accidental sector erase or program commands.

Key Features

Feature	Design Value
65 nm MIRRORBIT™ Eclipse Technology	Enables 1 Gb density in compact TSOP package while maintaining 90 ns random access and low active current (60 mA @ 5 MHz).
Asynchronous 32-byte Page Read	Reduces instruction fetch latency in XIP mode: first word in page = 90 ns, subsequent words = 15 ns each.
512-byte Programming Buffer	Allows firmware update blocks to be loaded and committed atomically - improves reliability over sequential single-word writes.
Advanced Sector Protection (ASP)	Per-sector volatile/non-volatile lock bits prevent unauthorized reprogramming of boot code or calibration data in field-deployed units.
Common Flash Interface (CFI)	Standardized parameter table accessible via read commands - enables OS/driver auto-detection without hard-coded timing or geometry assumptions.
Secure Silicon Region (OTP)	1024-byte one-time-programmable array with dual lockable regions - stores cryptographic keys or unique device identifiers securely.

Applications

Automotive Engine Control Unit (ECU)

Industrial PLC Firmware Storage

Use Scenario: Storing boot loader and real-time control firmware in diesel engine management systems requiring AEC-Q100 Grade 3 compliance.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory with XIP capability, delivering deterministic 90 ns instruction fetch latency to MCU core.

Use Value: Eliminates external SRAM copy step; reduces BOM count and boot time by enabling direct execution from flash.

Use Scenario: Holding firmware and configuration data for programmable logic controllers operating continuously in factory environments.

IC Role / Device Role / Timing Role: Field-upgradable firmware repository with sector-level write protection and 20-year data retention guarantee.

Use Value: Enables remote firmware updates without physical access; ASP prevents accidental overwrite of critical control logic.

Medical Diagnostic Imaging Boot Memory

Avionics Display System Code Storage

Use Scenario: Hosting boot code and safety-certified diagnostic firmware in MRI and CT scanner mainboards.

IC Role / Device Role / Timing Role: Safety-critical boot ROM with on-die ECC and 100,000-cycle endurance for periodic firmware validation cycles.

Use Value: Meets IEC 62304 Class C software requirements by detecting and correcting bit flips in stored executable code.

Use Scenario: Storing display controller firmware and font assets in certified cockpit display units with DO-254 compliance needs.

IC Role / Device Role / Timing Role: High-reliability code storage with hardware reset recovery and RY/BY# status signaling for deterministic boot sequencing.

Use Value: Ensures fail-safe initialization: RESET# aborts pending writes, and status register confirms readiness before code execution.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL01GS10DHIV10	Same die, identical specs, but packaged in 64-ball LAE Fortified BGA (9 mm × 9 mm) instead of 56-pin TSOP.	Requires PCB redesign for BGA layout and reflow profile; better thermal performance and board space efficiency.	Select for space-constrained or thermally demanding designs where TSOP footprint is prohibitive.
MX29GL128FHT2I-90G	128 Mb (16 MB) density, 90 ns access, same 3.0 V supply, but lacks on-die ECC and OTP region; uses older 90 nm process.	Insufficient capacity for full 1 Gb boot images; requires external ECC implementation for functional equivalence.	Select only if legacy compatibility or cost sensitivity outweighs density, ECC, and longevity requirements.

Compared with S29GL01GS10DHI010, the TSOP-packaged variant offers drop-in PCB compatibility for existing industrial designs, while the MX29GL128FHT2I-90G trades density and integrated reliability features for lower unit cost in non-safety-critical applications.

Availability

S29GL01GS10DHI010 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware upgrades, and medical imaging system manufacturing requiring stable component supply and long-term lifecycle assurance.

Supply support for S29GL01GS10DHI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions for industrial and safety-critical applications.

The GL-S family targets high-reliability embedded systems needing fast XIP-capable boot memory with robust data integrity - designed specifically for automotive, industrial, and medical applications demanding AEC-Q100 qualification and 20-year data retention.

FAQ

What is the maximum operating frequency supported for asynchronous reads?

The S29GL01GS10DHI010 does not operate on a clock signal; it is fully asynchronous. Its timing is defined by access times: 90 ns random access and 15 ns page access. These values correspond to effective throughput of ~11.1 MBps (random) and ~66.7 MBps (page-mode burst), assuming ideal bus turnaround and no wait states.

Does this device support byte-level writes?

No. The S29GL01GS10DHI010 is a 16-bit wide (×16) parallel NOR flash and only supports word-level (16-bit) writes. Byte writes are not possible; DQ0–DQ7 and DQ8–DQ15 must be driven simultaneously with valid data for each word written.

How is the 1024-byte OTP region accessed and secured?

The OTP array resides at fixed address offset 0x00000000 in the Secure Silicon Region ASO map. It is accessed using standard read/write commands after unlocking via CFI query and specific unlock sequences. Two lockable regions allow independent permanent locking - once locked, contents cannot be modified or read back, meeting secure key storage requirements.

Can the device be used with a 1.8 V I/O interface?

Yes. With VIO supplied at 1.8 V (within 1.65–VCC range) and VCC at 3.0 V, the device supports 1.8 V host interfaces directly. Input thresholds adapt to VIO, and output drive strength scales accordingly - no level shifter required between a 1.8 V FPGA or ASIC and this flash.

S29GL01GS10DHI010 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 1Gbit

Memory Organization:: 64M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL01GS10DHI010 FAQ

1.How can I place an order for S29GL01GS10DHI010 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL01GS10DHI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL01GS10DHI010 reliable?

The price and inventory of S29GL01GS10DHI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS10DHI010 is usually 5 days.

3.What payment methods are accepted for S29GL01GS10DHI010?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS10DHI010 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL01GS10DHI010?

S29GL01GS10DHI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL01GS10DHI010 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL01GS10DHI010?

For technical support, including S29GL01GS10DHI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS10DHI010 requirements.

6.How does Aetrix verify that S29GL01GS10DHI010 is sourced from the original manufacturer or authorized distributors?

All S29GL01GS10DHI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS10DHI010 meets industry standards.

7.What is the process for return or replacement of S29GL01GS10DHI010?

All S29GL01GS10DHI010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS10DHI010, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL01GS10DHI010 part is unused and in its original packaging.

Return procedure for S29GL01GS10DHI010:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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