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Infineon Technologies S29GL01GS10DHI013

Part No.:
S29GL01GS10DHI013
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
64-LBGA
Datasheet:
AetrixS29GL01GS10DHI013.pdf
Description:
IC FLASH 1GBIT PARALLEL 64FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,950

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Product details

Overview

S29GL01GS10DHI013 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across industrial temperature range (–40°C to +85°C) and supports sector erase of uniform 128-kbyte sectors in embedded boot code storage applications.

For engineers reviewing the S29GL01GS10DHI013 datasheet, S29GL01GS10DHI013 pinout, S29GL01GS10DHI013 application, or S29GL01GS10DHI013 equivalent, key selection criteria include its 512-byte programming buffer, Versatile I/O (1.65–VCC VIO), CFI compliance, ASP sector protection, and OTP array - all critical for automotive and industrial firmware storage designs requiring high reliability and long-term data retention.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A25), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume capability and status reporting via status register, data polling, or RY/BY# pin.

The MIRRORBIT™ Eclipse architecture on 65-nm process enables 100,000 program/erase cycles and 20-year data retention. Internal hardware ECC corrects single-bit errors on-the-fly during read, while Advanced Sector Protection (ASP) provides volatile and non-volatile locking per 128-kbyte sector - essential for secure boot partitioning.

Key Specifications

ParameterValue and Actual Design Meaning
Density1 Gb (128 MB) - supports full firmware images for complex microcontrollers and SoCs
InterfaceParallel ×16 asynchronous - enables XIP execution without external buffering
Access Time90 ns random / 15 ns page - meets real-time boot latency requirements
Programming Buffer512 bytes - reduces effective programming time by batching writes
ECCInternal hardware single-bit correction - eliminates need for external ECC logic
Endurance100,000 program/erase cycles - suitable for field-upgradable firmware
Data Retention20 years at 85°C - ensures long-term reliability in industrial environments

Pinout & Package

Package: 56-pin TSOP (Type I, 400 mil width), RoHS-compliant, JEDEC-standard footprint.

Pin/TerminalCircuit RoleDesign Meaning
A0–A25Address inputs26-bit word address bus (A25 only active for 1 Gb density)
DQ0–DQ15Data I/O16-bit bidirectional data bus; supports 1.65–VCC VIO range
CE#Chip enableActive-low device selection; controls power-down entry
OE#Output enableActive-low read control; gates output drivers
WE#Write enableActive-low write control; latches command/data on rising edge
RY/BY#Ready/Busy indicatorOpen-drain output signaling internal operation progress
RESET#Hardware resetActive-low asynchronous reset; clears internal state and aborts operations
VCCCore supply3.0 V ±0.3 V supply for logic and memory array
VIOI/O supply1.65 V to VCC - enables interfacing with mixed-voltage systems

Key Features

FeatureDesign Value
Page-mode read (32-byte aligned)15 ns cycle time within same page - accelerates sequential instruction fetch
512-byte programming bufferReduces average programming time vs. byte-by-byte writes - critical for OTA updates
Hardware ECC (single-bit correction)On-die correction without CPU intervention - improves system-level reliability
Advanced Sector Protection (ASP)Volatile/non-volatile lock per 128-kB sector - enables secure boot + application partitioning
1024-byte OTP arrayTwo lockable regions for immutable keys or calibration data - supports secure provisioning

Applications

Automotive Instrument ClusterIndustrial PLC Firmware Storage

Use Scenario: Storing boot code and calibrated display assets in AEC-Q100 Grade 3 instrument clusters.

IC Role / Device Role / Timing Role: Primary NOR flash for XIP boot ROM and static UI resource storage.

Use Value: 90 ns random access ensures sub-100 ms cold boot; ASP protects bootloader against corruption.

Use Scenario: Holding firmware and configuration tables in DIN-rail mounted programmable logic controllers.

IC Role / Device Role / Timing Role: Non-volatile program memory with field-upgrade capability via RS-485 interface.

Use Value: 100,000 erase cycles support >10 years of firmware revisions; 20-year retention avoids recalibration drift.

Medical Imaging Boot LoaderTelecom Baseband Processor Storage

Use Scenario: Secure boot image storage for FDA-cleared ultrasound processors requiring traceable firmware integrity.

IC Role / Device Role / Timing Role: Trusted boot source with OTP-stored cryptographic keys and ECC-protected execution.

Use Value: Hardware ECC and OTP lock prevent unauthorized modification; CFI enables automatic driver detection.

Use Scenario: Storing DSP microcode and protocol stacks in 5G small-cell baseband units operating at extended temperature.

IC Role / Device Role / Timing Role: High-reliability parallel flash for multi-core ARM-based baseband SoC boot and runtime code.

Use Value: Versatile I/O (1.65–3.3 V) interfaces directly with 1.8 V/3.3 V SoC buses; 105°C grade option supports fanless enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S29GL01GS10DHIV10Same die, automotive-grade (AEC-Q100 Grade 2, –40°C to +105°C), different marking and traceabilityRequired for under-hood automotive modules needing extended temperature operationSelect when full AEC-Q100 Grade 2 qualification and lot-level traceability are mandated
MX29GL128FDT2I-90G128 Mb density, 90 ns access, no integrated ECC, no OTP array, different command setLimited to simpler boot storage where ECC and secure provisioning are handled externallyChoose only if lower density suffices and system-level ECC implementation is already in place

Compared with S29GL01GS10DHI013, the automotive variant offers higher temperature tolerance and stricter qualification, while the Macronix part lacks ECC and OTP - making the Infineon device uniquely suited for safety-critical, upgradable, and secure firmware storage.

Availability

S29GL01GS10DHI013 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, and medical imaging boot loader applications requiring stable component supply, long-lifecycle support, and AEC-Q100-compliant sourcing.

Supply support for S29GL01GS10DHI013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with leadership in flash memory for mission-critical embedded systems.

The GL-S family targets high-reliability firmware storage in automotive, industrial, and medical devices - designed specifically for XIP-capable boot memory with integrated ECC, sector protection, and extended temperature operation.

FAQ

What is the maximum operating voltage for VIO on S29GL01GS10DHI013?

The VIO supply accepts 1.65 V to VCC (3.6 V max), enabling direct interface with 1.8 V, 2.5 V, and 3.3 V logic families without level shifters. This Versatile I/O feature simplifies board design in mixed-voltage systems and is confirmed in Section 8.3 of the datasheet Rev. *U.

Does S29GL01GS10DHI013 support common flash interface (CFI)?

Yes, it implements the Common Flash Interface (CFI) parameter table per JEDEC JESD68, allowing host software to auto-detect device geometry, timing, and command set. CFI support is mandatory for OS-level flash drivers and is verified in Section 2.2 and Section 7.2 of the datasheet.

Can the 1024-byte OTP array be reprogrammed after locking?

No - once either of the two OTP lock bits is set, that region becomes permanently read-only. The OTP array is designed for one-time programming of security keys or calibration data; unlocking is not supported, and this behavior is enforced by hardware fuses as documented in Section 3.3.

Is hardware reset (RESET#) required before power-up?

No - the device includes internal power-on reset (POR) circuitry that asserts reset automatically during VCC ramp-up. External RESET# is optional and used only for synchronous system-level reset events; POR timing is specified in Section 11.3 with tRST = 100 µs minimum.

S29GL01GS10DHI013 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-S
Package/Case:
64-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
1Gbit
Memory Organization:
64M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
60ns
Access Time:
100 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
64-FBGA (9x9)

S29GL01GS10DHI013 FAQ

1.How can I place an order for S29GL01GS10DHI013 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL01GS10DHI013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL01GS10DHI013 reliable?

The price and inventory of S29GL01GS10DHI013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS10DHI013 is usually 5 days.

3.What payment methods are accepted for S29GL01GS10DHI013?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS10DHI013 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL01GS10DHI013?

S29GL01GS10DHI013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL01GS10DHI013 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL01GS10DHI013?

For technical support, including S29GL01GS10DHI013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS10DHI013 requirements.

6.How does Aetrix verify that S29GL01GS10DHI013 is sourced from the original manufacturer or authorized distributors?

All S29GL01GS10DHI013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS10DHI013 meets industry standards.

7.What is the process for return or replacement of S29GL01GS10DHI013?

All S29GL01GS10DHI013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS10DHI013, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL01GS10DHI013 part is unused and in its original packaging.

Return procedure for S29GL01GS10DHI013:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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